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Infineon Technologies CYT4DNJBBCQ1BZSGS

Part No.:
CYT4DNJBBCQ1BZSGS
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
327-LFBGA
Datasheet:
AetrixCYT4DNJBBCQ1BZSGS.pdf
Description:
TRAVEO-2 CLUST.2.5DGRAPH
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,911

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Product details

Overview

CYT4DNJBBCQ1BZSGS from Infineon is an automotive-grade 32-bit TRAVEO™ T2G microcontroller built on Arm® Cortex®-M7 dual-core (320 MHz) and Cortex®-M0+ (100 MHz) architecture, featuring integrated 2D/2.5D graphics engine, JPEG decoder, CAN FD (up to 8 Mbps), Gigabit Ethernet MAC, and hardware crypto engine supporting AES-256, SHA-256, ECC, and secure boot. It targets instrument clusters and HUD systems requiring concurrent display rendering, camera input, audio processing, and functional safety.

For engineers reviewing the CYT4DNJBBCQ1BZSGS datasheet, CYT4DNJBBCQ1BZSGS pinout, CYT4DNJBBCQ1BZSGS application, or CYT4DNJBBCQ1BZSGS equivalent, this page delivers verified technical context, package mapping, real-world use scenarios, and validated alternative options for automotive display and control system design.

Technical Context

The device implements a heterogeneous multi-CPU subsystem: two lockstep-capable Cortex®-M7 cores handle primary graphics, timing, and real-time control tasks, while the Cortex®-M0+ manages peripheral offload, security services, and ASIL-B safety monitoring. Hardware inter-processor communication enables deterministic message passing without software arbitration.

Its graphics pipeline includes dedicated drawing, composition, and display engines with on-the-fly warping and direct video feed-through-enabling HUD projection without frame buffers. The JPEG decoder supports full-resolution decoding (up to 16384×16384) in RGB/YUV/Grayscale with 4:2:0–4:4:4 subsampling, directly feeding pixel data to dual FPD-Link outputs.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual Arm® Cortex®-M7 @ 320 MHz + single Cortex®-M0+ @ 100 MHz for security/peripheral offload
Graphics Memory4096 KB embedded VRAM enabling dual-display rendering at up to 2880×1080 (FPD-Link dual)
Flash & RAM6336 KB code-flash (RWW, dual-bank), 128 KB work-flash, 640 KB SRAM with selective retention
Communication4× CAN FD (8 Mbps), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, IEEE-802.3az Gigabit Ethernet MAC
SecurityHSM-compliant crypto engine with AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, and SECDED ECC on all safety-critical memories
Functional SafetyASIL-B compliant with MPU, SMPU, PPU, MCWDT, CSV, BOD/OVD/OCD/LVD, and hardware error correction
Analog Peripherals12-bit SAR ADC (1 Msps, 48 external channels), 6 internal analog inputs, sequencer-driven autonomous scanning

Pinout & Package

Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8 mm pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
VDDA_ADCAnalog supply for ADC1.1 V regulated core supply; dual BOD thresholds (2.7 V / 3.0 V) ensure stable conversion during brown-out
GPIO_SMC[0..5]Stepper motor control I/ODirectly drives stepper phases with ZPD and slew rate control; supports 6 SMC channels via 12 counters
ETH_RXD[0..3], ETH_TXD[0..3]Gigabit Ethernet PHY interfaceSupports MII/RMII/RGMII; enables IEEE-1588 PTP and AVB (802.1AS/Qav/Qbb) for time-synchronized audio/video
FPD_LX_P/N[0..7]Dual FPD-Link differential outputDrives two independent Wide-HD displays (2880×1080 @ 220 MHz) with on-the-fly warping for HUD projection
JTAG_TCK, JTAG_TMS, SWDIO, SWCLKDebug interfaceIEEE-1149.1 JTAG and Arm® SWD support ETM instruction/data trace and GHS/IAR toolchain integration

Key Features

FeatureDesign Value
On-the-fly graphics renderingEliminates frame buffer memory overhead by composing and outputting layers directly to dual displays
Hardware JPEG decodeFull ISO/IEC 10918-1 subset compliance with YUV 4:2:0–4:4:4 support and pixel output up to 16384×16384
Dual-core inter-processor messagingDedicated hardware mailbox enables zero-latency, lock-free communication between M7 and M0+ subsystems
FOTA-ready flash architectureDual-bank code-flash with RWW allows seamless over-the-air firmware updates without runtime interruption
ASIL-B safety mechanismsIntegrated SMPU, PPU, MCWDT, and SECDED ECC on SRAM/flash/TCM meet ISO 26262 requirements out-of-box

Applications

Instrument Cluster DisplayHead-Up Display (HUD)

Use Scenario: Real-time rendering of speed, RPM, navigation, and ADAS alerts on TFT-LCD cluster with animated transitions.

IC Role / Device Role / Timing Role: Primary graphics controller with dual-display output, TCPWM-driven gauge animation, and CAN FD telemetry ingestion.

Use Value: 2880×1080 FPD-Link dual output drives high-resolution cluster + secondary info panel simultaneously; JPEG decoder loads UI assets without CPU load.

Use Scenario: Projection of vehicle speed, lane departure, and navigation cues onto windshield with geometric correction.

IC Role / Device Role / Timing Role: HUD-specific graphics engine performing real-time perspective warping and overlay composition on captured camera feed.

Use Value: On-the-fly warping eliminates need for external GPU; direct video feed-through from MIPI CSI-2 to FPD-Link ensures <10 ms latency.

Automotive Camera Processing UnitSecure Gateway Controller

Use Scenario: Front-facing ADAS camera capturing 1920×720@60 fps via dual-lane MIPI CSI-2 for object detection preprocessing.

IC Role / Device Role / Timing Role: Image acquisition node with ITU-656/RGB/CSI-2 capture engine, JPEG compression, and CAN FD forwarding.

Use Value: Dual-lane MIPI CSI-2 interface supports 110 MHz clock; hardware JPEG encoder reduces bandwidth to 1/10 vs raw RGB.

Use Scenario: In-vehicle network gateway aggregating CAN FD, LIN, CXPI, and Ethernet traffic with secure firmware update capability.

IC Role / Device Role / Timing Role: Secure bridge processor executing authenticated boot, encrypted SMIF XIP, and firewall-enforced inter-network routing.

Use Value: HSM-compliant crypto engine validates OTA payloads; dual-bank flash enables atomic firmware rollback on corruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive display and control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344Single Cortex®-M7 @ 320 MHz; no integrated graphics engine or VRAM; relies on external GPU or software renderingTargeted at body control and gateway functions-not optimized for HUD/instrument cluster display renderingSelect when graphics acceleration is handled externally or not required; better suited for non-display ECU roles
Renesas RH850/U2A32-bit RXv3 core @ 400 MHz; no JPEG decoder or FPD-Link; supports only LVDS and parallel RGB display interfacesFocused on powertrain and chassis control; lacks dual-display compositor and on-the-fly warping for HUDChoose for high-reliability powertrain applications where display functionality is minimal or absent

Compared with S32K344 and RH850/U2A, CYT4DNJBBCQ1BZSGS uniquely integrates dual-display graphics, hardware JPEG decode, and HUD-specific warping-making it the only option among the three capable of standalone instrument cluster + HUD implementation without external IP.

Availability

CYT4DNJBBCQ1BZSGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, camera processing units, and secure gateways requiring stable component supply across production lifecycles.

Supply support for CYT4DNJBBCQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CYT4DN belongs to the TRAVEO™ T2G family-designed specifically for automotive human-machine interface (HMI) systems requiring high-resolution graphics, real-time vision processing, and ASIL-B functional safety compliance.

FAQ

What is the maximum display resolution supported by CYT4DNJBBCQ1BZSGS?

The device supports up to 2880×1080 pixels via dual-channel FPD-Link at 220 MHz, enabling Wide-HD dual-display output. Parallel RGB supports 1600×600 at 80 MHz, and single FPD-Link supports 1920×720 at 110 MHz. All resolutions are achievable with on-the-fly composition and warping.

Does CYT4DNJBBCQ1BZSGS include hardware JPEG encoding or only decoding?

CYT4DNJBBCQ1BZSGS includes only hardware JPEG decoding per ISO/IEC 10918-1 subset. It decodes JPEG images into pixel data for display or processing but does not perform JPEG encoding. Encoding must be implemented in software or via external IP.

Is the crypto engine enabled on all CYT4DN variants, or only specific part numbers?

The crypto engine-including AES, SHA, ECC, RSA, TRNG, and GCM-is available only on select CYT4DN MPNs marked with [1] in the datasheet. CYT4DNJBBCQ1BZSGS is confirmed to include full eSHE/HSM support, as verified in its ordering code suffix and device configuration registers.

Can CYT4DNJBBCQ1BZSGS operate in deep sleep mode while maintaining CAN FD bus activity?

Yes-CAN FD controllers retain full bus monitoring and message filtering capability in Deep Sleep mode. Up to 81 GPIO pins and dedicated CAN FD wakeup sources can trigger exit from Deep Sleep, enabling low-power always-on network presence with sub-100 µA current draw.

CYT4DNJBBCQ1BZSGS Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
327-LFBGA
Series:
Traveo™ T2G
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 320MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
168
Program Memory Size:
6.19MB (6.19M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 48x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT4DNJBBCQ1BZSGS FAQ

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Please submit a Request for Quotation (RFQ) for CYT4DNJBBCQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CYT4DNJBBCQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBBCQ1BZSGS is usually 5 days.

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CYT4DNJBBCQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT4DNJBBCQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT4DNJBBCQ1BZSGS?

For technical support, including CYT4DNJBBCQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBBCQ1BZSGS requirements.

6.How does Aetrix verify that CYT4DNJBBCQ1BZSGS is sourced from the original manufacturer or authorized distributors?

All CYT4DNJBBCQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBBCQ1BZSGS meets industry standards.

7.What is the process for return or replacement of CYT4DNJBBCQ1BZSGS?

All CYT4DNJBBCQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBBCQ1BZSGS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT4DNJBBCQ1BZSGS part is unused and in its original packaging.

Return procedure for CYT4DNJBBCQ1BZSGS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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