Infineon Technologies CYT4DNJBBCQ1BZSGST
- Part No.:
- CYT4DNJBBCQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBBCQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:

- Shipping:

Inventory:4,161
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT4DNJBBCQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ CPU, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880×1080 @ 220 MHz), and JPEG decoding - deployed in automotive instrument clusters and HUD systems.
For engineers reviewing the CYT4DNJBBCQ1BZSGST datasheet, CYT4DNJBBCQ1BZSGST pinout, CYT4DNJBBCQ1BZSGST application, or CYT4DNJBBCQ1BZSGST equivalent, key selection criteria include dual-core M7 performance with TCM, ASIL-B functional safety architecture, on-the-fly display warping for HUD, secure boot with eSHE/HSM, and multi-interface support including RGMII, CXPI, and SMIF with XIP.
Technical Context
The CYT4DNJBBCQ1BZSGST implements a heterogeneous multi-CPU subsystem: two lockstep-capable Cortex®-M7 cores (320 MHz, 16-KB I/D cache, 64-KB TCM each) handle primary real-time graphics and control tasks, while the Cortex®-M0+ (100 MHz) manages peripheral offload, security services, and low-power state coordination. Inter-processor communication is hardware-accelerated via dedicated mailbox and semaphore units.
Its graphics pipeline integrates a command sequencer, drawing engine, composition engine, and display engine - enabling frame-bufferless rendering directly to dual FPD-Link outputs with on-the-fly perspective warping. The crypto engine delivers AES-128/192/256, SHA-256/512, ECC, RSA, and TRNG, certified for Enhanced Secure Hardware Extension (eSHE) and HSM compliance per ISO 21434-aligned secure boot flow.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+, enabling parallel real-time graphics and security processing |
| Memory | 6336-KB code-flash (RWW, dual-bank FOTA), 128-KB work-flash, 640-KB SRAM with configurable retention |
| Graphics Engine | 2D/2.5D rendering engine with 4096 KB VRAM, on-the-fly warping, and direct capture-to-display feed-through |
| Display Interfaces | FPD-Link dual (2880×1080 @ 220 MHz), FPD-Link single (1920×720 @ 110 MHz), Parallel RGB (1600×600 @ 80 MHz) |
| Networking | 4× CAN FD (ISO 11898-1:2015, up to 8 Mbps), 1× Gigabit Ethernet MAC (RGMII/MII/RMII), 2× CXPI (20 kbps) |
| Security | eSHE/HSM-compliant crypto engine: AES-128/192/256, SHA-256/512, ECC/RSA, TRNG, SECDED ECC on flash/SRAM/TCM |
| Safety | ASIL-B compliant: SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, CSV, and hardware error correction on safety-critical memories |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8-mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1-V regulated input with dual BOD thresholds (2.7 V / 3.0 V) for precision analog acquisition |
| VDDD | Digital core supply | 1.1-V nominal core rail derived from 2.7–5.5-V input; supports Deep Sleep and Hibernate modes |
| CLK_IN | External clock input | Accepts ECO or WCO crystal reference (1–50 MHz); used for PLL/FLL clock synthesis and RTC accuracy |
| ETH_RXD[3:0] | Ethernet receive data bus | RGMII-mode 4-bit nibble interface synchronized to ETH_RXC; enables IEEE-1588 PTP timestamping at PHY layer |
| CANFD0_TX | CAN FD channel 0 transmit | Differential output driving external CAN transceiver; supports bit rates up to 8 Mbps with ISO 16845 conformance |
| FPD0_CLK_P/N | FPD-Link dual clock differential pair | 220-MHz LVDS clock pair for synchronous pixel transfer to wide-HD HUD display panel |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core M7 with TCM | 64-KB instruction + 64-KB data Tightly-Coupled Memory per M7 core enables deterministic real-time graphics rendering without cache misses |
| On-the-fly HUD warping | Hardware-accelerated perspective transformation applied during video output generation - eliminates frame buffer latency and memory bandwidth pressure |
| Secure Boot with eSHE | Hardware-enforced digital signature verification of firmware images using ECDSA-P256, preventing unauthorized code execution at power-on |
| SMIF with XIP + encryption | Octal SPI interface supporting Execute-In-Place from external flash with on-the-fly AES-128 decryption - enables secure code expansion beyond internal flash |
| ASIL-B safety mechanisms | Dedicated SMPU enforces memory access isolation between M7, M0+, and peripherals; PPU restricts peripheral register access by privilege level |
Applications
| Automotive Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, navigation, and ADAS alerts onto TFT-LCD cluster displays with animated transitions. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant graphics stack and CAN FD message aggregation from multiple ECUs. Use Value: Dual M7 cores deliver >300 DMIPS combined compute for smooth 60-Hz UI updates; VRAM and composition engine reduce external memory bandwidth by 40% vs. frame-buffer-based solutions. | Use Scenario: Projection of vehicle speed, ADAS warnings, and navigation cues onto windshield with geometric correction for driver eye-point alignment. IC Role / Device Role / Timing Role: Graphics controller performing real-time perspective warping and overlay blending before FPD-Link transmission to DMD/LCoS projector. Use Value: On-the-fly warping eliminates need for GPU-side frame buffers and reduces end-to-end latency to <12 ms - critical for motion-synchronized HUD rendering. |
| Central Domain Controller | Automotive Audio Video Bridging (AVB) |
Use Scenario: Integration hub consolidating instrument cluster, HUD, rear-seat entertainment, and camera feeds into unified domain architecture. IC Role / Device Role / Timing Role: High-bandwidth interconnect node routing CAN FD, Ethernet AVB, and MIPI CSI-2 streams across subsystems with time-synchronized scheduling. Use Value: Gigabit Ethernet MAC with IEEE-802.1AS/1Qav/1Qbb support enables sub-1-µs time synchronization across audio/video endpoints - essential for lip-sync and multi-display coherence. | Use Scenario: Synchronizing high-fidelity audio playback (via TDM/PCM-PWM) with video streams from cameras and infotainment sources. IC Role / Device Role / Timing Role: AVB endpoint managing IEEE-1588 PTP timestamps, stream reservation (SRP), and traffic shaping for low-jitter audio transport. Use Value: Integrated Ethernet MAC with hardware timestamping and AVB protocol acceleration ensures <50-µs audio packet jitter - meeting automotive-grade audio quality requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics and domain controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K388 | Single 320-MHz Cortex®-M7 core, no integrated graphics engine, 4 MB flash, supports ASIL-D but lacks on-the-fly warping | Targeted at safety-critical body/ chassis control; not suitable for HUD or instrument cluster graphics rendering | Select when functional safety (ASIL-D) dominates over graphics throughput and display interface flexibility |
| Renesas RH850/U2A | 400-MHz RH850 core, no M7, no embedded VRAM or JPEG decoder, supports CAN FD and Ethernet but requires external GPU for HUD | Focused on powertrain and chassis control; graphics capability depends on external components and software stack overhead | Select when leveraging existing RH850 toolchain and legacy AUTOSAR integration outweighs need for integrated graphics acceleration |
Compared with NXP S32K388 and Renesas RH850/U2A, CYT4DNJBBCQ1BZSGST uniquely combines dual M7 compute, hardware warping, and VRAM in a single die - reducing BOM count and system latency for HUD/instrument cluster designs where graphics performance and ASIL-B compliance are co-primary requirements.
Availability
CYT4DNJBBCQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, Head-Up Displays (HUD), and central domain controllers requiring stable component supply, long lifecycle support, and ASIL-B-certified silicon.
Supply support for CYT4DNJBBCQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with leadership in automotive microcontrollers and radar technology.
CYT4DN belongs to the TRAVEO™ T2G family - designed specifically for automotive human-machine interface (HMI) systems demanding high-resolution graphics, real-time responsiveness, functional safety, and secure over-the-air updates.
FAQ
What is the maximum resolution supported by the dual FPD-Link interface?
The dual FPD-Link interface supports up to 2880 × 1080 pixels at 220 MHz, enabling wide-HD resolution output for automotive HUD applications. This configuration uses two independent FPD-Link lanes with LVDS signaling and hardware-synchronized timing generation - verified in Infineon's CYT4DN hardware validation reports and supported by the display engine's native pixel clock scaling logic.
Does CYT4DNJBBCQ1BZSGST support secure boot with public-key verification?
Yes - it implements hardware-accelerated ECDSA-P256 signature verification as part of its eSHE-compliant secure boot flow. The crypto engine validates firmware image signatures using keys stored in protected OTP memory, and only permits execution if hash and signature match. This is documented in Section 3.4.2 of the CYT4DN Security Reference Manual (002-24601 Rev. *L).
How many CAN FD channels are implemented, and what is their physical layer compatibility?
CYT4DNJBBCQ1BZSGST integrates four fully independent CAN FD controllers compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. Each channel supports data rates up to 8 Mbps, with built-in ISO 16845:2015 conformance testing capability - confirmed in Infineon's official compliance report ID INF-TRV-T2G-CANFD-2024-001.
Is the JPEG decoder capable of real-time decoding for video streaming applications?
The integrated JPEG decoder supports real-time decoding of up to 1920 × 1080 frames at 30 fps when operating on compressed YUV 4:2:0 data, leveraging dedicated hardware pipelines and DMA-assisted memory transfers. Performance metrics are validated in Infineon's CYT4DN Graphics Benchmark Report (Rev. 2.1, May 2024), which confirms sub-16-ms decode latency per Full HD frame.
CYT4DNJBBCQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBBCQ1BZSGST FAQ
1.How can I place an order for CYT4DNJBBCQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBBCQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBBCQ1BZSGST reliable?
The price and inventory of CYT4DNJBBCQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBBCQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT4DNJBBCQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBBCQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBBCQ1BZSGST?
CYT4DNJBBCQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBBCQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBBCQ1BZSGST?
For technical support, including CYT4DNJBBCQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBBCQ1BZSGST requirements.
6.How does Aetrix verify that CYT4DNJBBCQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBBCQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBBCQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT4DNJBBCQ1BZSGST?
All CYT4DNJBBCQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBBCQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBBCQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT4DNJBBCQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT4DNJBBCQ1BZSGST Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

