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Infineon Technologies CYT4DNJBCCQ1BZSGST
- Part No.:
- CYT4DNJBCCQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBCCQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:2,015
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Product details
Overview
CYT4DNJBCCQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ security core, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880 × 1080 @ 220 MHz), and JPEG decoding - deployed in automotive instrument clusters and HUD systems.
For engineers reviewing the CYT4DNJBCCQ1BZSGST datasheet, CYT4DNJBCCQ1BZSGST pinout, CYT4DNJBCCQ1BZSGST application, or CYT4DNJBCCQ1BZSGST equivalent, key selection criteria include dual-core deterministic real-time performance, ASIL-B functional safety certification, on-the-fly graphics composition without frame buffers, and hardware-accelerated crypto (AES-128/192/256, SHA-256/512, ECC, TRNG).
Technical Context
The CYT4DNJBCCQ1BZSGST implements a heterogeneous multi-core architecture: two lockstep-capable Cortex®-M7 cores handle primary graphics and control tasks with 16-KB I/D caches and 64-KB TCM each, while the Cortex®-M0+ manages peripheral offload, secure boot, and HSM operations. Memory subsystem includes RWW flash supporting FOTA updates in dual-bank mode and SECDED ECC protection on all safety-critical memories (SRAM, flash, TCM).
Graphics processing is hardware-accelerated via dedicated engines: drawing engine for vector rendering, composition engine for layer blending, display engine for timing generation, and command sequencer for pipeline control - enabling direct video feed-through from MIPI CSI-2 capture (up to 2880 × 1080) to dual FPD-Link outputs with on-the-fly warping for HUD projection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ for security/peripheral offload |
| Memory | 6336-KB code-flash (RWW, dual-bank), 128-KB work-flash, 640-KB SRAM with retention granularity |
| Graphics Engine | 2D/2.5D rendering with 4096 KB VRAM; supports on-the-fly warping and direct capture-to-display feed-through |
| Video Interfaces | FPD-Link dual (2880 × 1080 @ 220 MHz), Parallel RGB (1600 × 600 @ 80 MHz), MIPI CSI-2 4-lane input |
| Networking | 4× CAN FD (ISO 11898-1:2015, up to 8 Mbps), 1× Gigabit Ethernet MAC (MII/RMII/RGMII, IEEE-1588 PTP) |
| Safety & Security | ASIL-B compliant; eSHE/HSM, AES-128/192/256, SHA-256/512, ECC, TRNG, SECDED ECC on SRAM/flash/TCM |
| Power Range | 2.7 V to 5.5 V operation; Deep Sleep, Hibernate, and Low-power Sleep modes with configurable BOD thresholds |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8-mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1-V regulated supply with dedicated brown-out detection at 1.1 V |
| VDDD | Digital core supply | 1.1-V nominal core voltage generated internally from 2.7–5.5 V input |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Supports ECO (up to 50 MHz) and WCO (32.768 kHz) for precise clocking |
| MDIO / MDC | Ethernet management interface | IEEE-802.3-compliant MDIO/MDC for PHY configuration and status monitoring |
| TXD0 / RXD0 | CAN FD channel 0 differential pair | Compliant with ISO 11898-1:2015; supports data rates up to 8 Mbps |
| CLKIN0 / CLKOUT0 | FPD-Link clock pair | Differential clock for FPD-Link dual interface driving 2880 × 1080 displays |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Two Cortex®-M7 cores with independent TCM and cache enable time-critical graphics + control task partitioning |
| On-the-fly graphics composition | Direct video path from MIPI CSI-2 capture to dual FPD-Link outputs with overlay and warping - no frame buffer required |
| FOTA-ready flash architecture | Dual-bank code-flash with Read-While-Write enables seamless firmware updates without system interruption |
| Hardware crypto acceleration | Dedicated crypto engine supports AES-GCM, SHA-512, ECC-384, RSA-4096, TRNG - meeting UNECE R155 compliance requirements |
| ASIL-B functional safety | MPU, SMPU, PPU, MCWDT, SECDED ECC, and clock supervisor ensure runtime fault detection and containment |
Applications
| Automotive Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD dashboards with animated transitions. IC Role / Device Role / Timing Role: Primary graphics controller and system orchestrator using dual Cortex®-M7 cores and dedicated 2D engine. Use Value: Enables 60 FPS rendering at 1600 × 600 resolution with zero-latency sensor fusion via CAN FD and LIN interfaces. | Use Scenario: Projection of speed, ADAS warnings, and AR navigation onto windshield with geometric correction for driver eye position. IC Role / Device Role / Timing Role: Graphics warping engine + timing generator with on-the-fly perspective correction synchronized to vehicle dynamics. Use Value: Eliminates external FPGA/GPU by performing real-time warping and display timing generation in hardware. |
| Central Domain Controller | Digital Rearview Mirror |
Use Scenario: Consolidating body control, lighting, HVAC, and gateway functions into a single high-integration domain ECU. IC Role / Device Role / Timing Role: Dual-core application processor with integrated CAN FD, Ethernet, and LIN for inter-module communication and OTA orchestration. Use Value: Reduces BOM count by integrating 4× CAN FD, 1× Gigabit Ethernet, and 12× SCB channels - eliminating discrete transceivers and PHYs. | Use Scenario: Processing wide-angle camera feed, applying distortion correction, and driving high-resolution LCD mirror display. IC Role / Device Role / Timing Role: Image capture engine (MIPI CSI-2 4-lane) + JPEG decoder + display engine for low-latency video pipeline. Use Value: Achieves sub-50 ms end-to-end latency from camera input to mirror output using hardware-accelerated capture-to-display path. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 core (320 MHz), no integrated graphics engine, 4 MB flash, 2 MB SRAM | Targeted at gateway/control domains - lacks hardware-accelerated 2D/2.5D rendering and VRAM | Select when graphics capability is unnecessary and ASIL-D safety extension is required. |
| Renesas RH850/U2A | Tri-core (3× Cortex®-R7), 16 MB flash, no JPEG decoder or FPD-Link support, 12-bit ADC only | Focused on powertrain and chassis control - no display/video subsystem or HUD warping capability | Select for high-reliability motor control where display integration is handled externally. |
Compared with S32K344 and RH850/U2A, CYT4DNJBCCQ1BZSGST uniquely integrates dual M7 cores, on-chip 2D/2.5D graphics, FPD-Link dual, and JPEG decode - making it the only option among the three qualified for HUD and instrument cluster SoC consolidation without external GPU or video bridge ICs.
Availability
CYT4DNJBCCQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, and central domain controllers requiring stable component supply, long-term lifecycle support, and ASIL-B certified silicon.
Supply support for CYT4DNJBCCQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and R&D centers.
CYT4DN belongs to the TRAVEO™ T2G product line, designed specifically for automotive human-machine interface (HMI) systems requiring integrated graphics, functional safety, and multi-protocol connectivity in a single chip.
FAQ
What is the maximum display resolution supported by CYT4DNJBCCQ1BZSGST?
The device supports up to 2880 × 1080 pixels via dual FPD-Link at 220 MHz, 1920 × 720 via single FPD-Link at 110 MHz, and 1600 × 600 via Parallel RGB at 80 MHz. All outputs are driven simultaneously with independent timing generators and hardware warping for HUD use cases.
Does CYT4DNJBCCQ1BZSGST support over-the-air (OTA) firmware updates?
Yes - it features dual-bank code-flash with Read-While-Write capability, enabling background firmware validation and atomic bank switching during OTA updates without interrupting real-time graphics or control operations.
Is the JPEG decoder capable of real-time decoding for video streams?
No - the JPEG decoder is optimized for static image decompression (e.g., icons, UI assets, map tiles) and does not support motion-JPEG or video frame-rate decoding. It processes images up to 16384 × 16384 pixels with YUV 4:2:0/4:2:2/4:4:4 subsampling.
How many CAN FD interfaces does CYT4DNJBCCQ1BZSGST integrate?
The part integrates four fully independent CAN FD controllers compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0, each supporting data rates up to 8 Mbps depending on physical layer implementation and transceiver selection.
CYT4DNJBCCQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBCCQ1BZSGST FAQ
1.How can I place an order for CYT4DNJBCCQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBCCQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBCCQ1BZSGST reliable?
The price and inventory of CYT4DNJBCCQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBCCQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT4DNJBCCQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBCCQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBCCQ1BZSGST?
CYT4DNJBCCQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBCCQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBCCQ1BZSGST?
For technical support, including CYT4DNJBCCQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBCCQ1BZSGST requirements.
6.How does Aetrix verify that CYT4DNJBCCQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBCCQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBCCQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT4DNJBCCQ1BZSGST?
All CYT4DNJBCCQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBCCQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBCCQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT4DNJBCCQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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