My Inquiry
My Account
Infineon Technologies CYT4DNJBDCQ1BZSGS
- Part No.:
- CYT4DNJBDCQ1BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBDCQ1BZSGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:3,711
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT4DNJBDCQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ CPU, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880 × 1080 @ 220 MHz), and JPEG decoding for HUD and digital instrument cluster applications.
For engineers reviewing the CYT4DNJBDCQ1BZSGS datasheet, CYT4DNJBDCQ1BZSGS pinout, CYT4DNJBDCQ1BZSGS application, or CYT4DNJBDCQ1BZSGS equivalent, key selection criteria include dual-core M7 performance with TCM, ASIL-B functional safety architecture, on-the-fly graphics composition without frame buffers, and hardware-accelerated crypto (AES-256, ECC, SHA-512) with eSHE/HSM support.
Technical Context
The device implements a heterogeneous multi-CPU subsystem: two lockstep-capable Cortex®-M7 cores (320 MHz, 16-KB I/D cache, 64-KB TCM each) handle primary real-time graphics and control tasks, while the Cortex®-M0+ (100 MHz) manages peripheral offload, security boot, and ASIL-B safety monitoring. Inter-processor communication is handled via dedicated hardware semaphores and message RAM.
Graphics processing uses a dedicated pipeline including capture engine (MIPI CSI-2 up to 4-lane, ITU-656, RGB), composition engine (layer blending), drawing engine (vector acceleration), and display engine (timing generation). All engines operate with zero-framebuffer latency and support HUD-specific on-the-fly warping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ |
| Flash Memory | 6336-KB code-flash with RWW, dual-bank FOTA support |
| SRAM | 640-KB with configurable retention granularity |
| Graphics Engine | 2D/2.5D rendering, 4096 KB VRAM, no-framebuffer output to dual displays |
| Video Interfaces | FPD-Link dual (2880×1080 @ 220 MHz), Parallel RGB (1600×600 @ 80 MHz) |
| Networking | 4× CAN FD (8 Mbps), 1× Gigabit Ethernet MAC (MII/RMII/RGMII), 2× LIN, 2× CXPI |
| Safety & Security | ASIL-B compliant, SECDED ECC on flash/SRAM/TCM, eSHE/HSM with AES-256, ECC, SHA-512 |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8-mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1-V regulated input; enables 12-bit SAR ADC sampling at 1 Msps with internal temperature sensing |
| SWDIO / SWCLK | Serial Wire Debug interface | Two-pin debug access supporting ETM instruction/data trace and secure firmware update |
| ETH_RXD[3:0] / ETH_TXD[3:0] | Gigabit Ethernet PHY data lanes | Supports RGMII timing for IEEE-802.1AS PTP synchronization in AVB networks |
| CSI2_D[3:0] / CSI2_CLK | MIPI CSI-2 camera interface | 4-lane configuration delivers 2880×1080 video capture at 220 MHz for surround-view systems |
| FPDLP0_P/N, FPDLP1_P/N | FPD-Link differential video outputs | Dual-channel LVDS signaling driving HUD projection modules with real-time warping |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core M7 with TCM | 64-KB instruction + 64-KB data TCM per core enables deterministic real-time graphics rendering and motor-control loop execution |
| On-the-fly graphics composition | Zero-framebuffer rendering allows HUD image warping and overlay insertion directly into video stream without memory bandwidth penalty |
| Hardware JPEG decoder | Full ISO/IEC 10918-1 subset decoding (YUV 4:2:0–4:4:4) up to 16384×16384 pixels for dynamic UI asset loading |
| ASIL-B safety mechanisms | MPU/SMPU/PPU, SECDED ECC, MCWDT, CSV, and BOD/OVD/OCD monitoring across all power modes |
| Secure boot with eSHE | Fast authenticated boot using RSA/ECC signatures and AES-GCM encrypted firmware images stored in dual-bank flash |
Applications
| Digital Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, ADAS alerts, navigation arrows, and 3D gauges on TFT-LCD clusters with <100-ms latency. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR CP stack, graphics composition, and CAN FD gateway logic. Use Value: Dual M7 cores with TCM ensure deterministic frame scheduling; 4096 KB VRAM eliminates external graphics memory, reducing BOM cost and EMI. | Use Scenario: Projection of augmented reality navigation cues onto windshield with perspective-correct warping and ambient light adaptation. IC Role / Device Role / Timing Role: Graphics subsystem controller performing real-time pixel warping, video capture-to-display pass-through, and JPEG-decoded icon overlay. Use Value: On-the-fly warping engine avoids frame buffer storage; FPD-Link dual interface drives high-resolution combiner optics at 220 MHz pixel clock. |
| Surround-View System | Automotive Audio Gateway |
Use Scenario: Synchronizing four MIPI CSI-2 camera inputs (front/rear/left/right) into stitched top-down view with dynamic distortion correction. IC Role / Device Role / Timing Role: Video capture hub with hardware compositor, JPEG encoder, and Ethernet AVB transport for camera data aggregation. Use Value: 4-lane MIPI CSI-2 support at 220 MHz enables 1920×720@60fps per camera; IEEE-1588 PTP ensures sub-microsecond timestamp alignment across sensors. | Use Scenario: Central audio mixer routing TDM streams from infotainment head unit, microphone arrays, and seat speakers with low-latency echo cancellation. IC Role / Device Role / Timing Role: Audio subsystem controller managing five SG interfaces, two PCM-PWM converters, and dual TDM buses with sample-rate conversion. Use Value: Two independent PCM mixers with five input streams enable concurrent voice assistant, ANC, and entertainment playback without CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 (320 MHz), no integrated graphics engine, 4 MB flash, 2 MB SRAM, supports only parallel RGB (no FPD-Link) | Targeted at body control and gateway functions-not HUD/instrument cluster graphics rendering | Select when graphics acceleration is unnecessary and ASIL-D safety certification is required. |
| Renesas RH850/U2A | Dual-lockstep RH850 cores (200 MHz), no GPU, 8 MB flash, 2.5 MB SRAM, supports CAN FD and Ethernet but lacks JPEG decode or VRAM | Focused on powertrain and chassis control with deterministic interrupt latency-no display subsystem | Choose for high-integrity motor control where display capability is delegated to companion SoC. |
Compared with S32K344 and RH850/U2A, CYT4DNJBDCQ1BZSGS uniquely integrates dual M7 cores with dedicated graphics pipeline, on-the-fly warping, and FPD-Link dual-enabling single-chip HUD and cluster solutions without external GPU or video bridge ICs.
Availability
CYT4DNJBDCQ1BZSGS is available at Aetrix Electronics and suitable for automotive instrument clusters, Head-Up Displays, surround-view systems, and audio gateways requiring stable component supply across extended product lifecycles.
Supply support for CYT4DNJBDCQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and automotive qualification expertise.
CYT4DN belongs to the TRAVEO™ T2G family, designed specifically for automotive human-machine interface (HMI) applications demanding high-resolution graphics, functional safety (ASIL-B), and secure connectivity in instrument clusters and HUDs.
FAQ
What is the maximum resolution supported by the FPD-Link dual interface?
The FPD-Link dual interface supports up to 2880 × 1080 pixels at 220 MHz pixel clock, enabling Wide-HD resolution for HUD projection modules with real-time perspective warping. This is verified in the CYT4DN datasheet Section 3.4 and confirmed by Infineon's TRAVEO™ T2G hardware reference manual Rev. *L.
Does CYT4DNJBDCQ1BZSGS support secure over-the-air (FOTA) updates?
Yes - it supports dual-bank flash with Read-While-Write (RWW) capability, enabling seamless FOTA updates without system downtime. The hardware crypto engine (AES-256, ECC, SHA-512) authenticates and decrypts firmware images, and eSHE enforces secure boot chain integrity per ISO/SAE 21434 requirements.
How many CAN FD channels does this MCU provide, and what is the max data rate?
CYT4DNJBDCQ1BZSGS provides up to four CAN FD channels compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0, supporting data rates up to 8 Mbps - limited only by physical layer transceiver and topology, as specified in Section 3.3 of the official datasheet.
Is the JPEG decoder capable of handling YUV 4:2:0 subsampling and large image sizes?
Yes - the hardware JPEG decoder conforms to ISO/IEC 10918-1 and supports YUV 4:2:0, 4:2:2, 4:4:4, and grayscale color spaces. It decodes images from 1×1 up to 16384×16384 pixels, enabling dynamic UI asset loading for high-DPI instrument clusters without CPU load.
CYT4DNJBDCQ1BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBDCQ1BZSGS FAQ
1.How can I place an order for CYT4DNJBDCQ1BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBDCQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBDCQ1BZSGS reliable?
The price and inventory of CYT4DNJBDCQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBDCQ1BZSGS is usually 5 days.
3.What payment methods are accepted for CYT4DNJBDCQ1BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBDCQ1BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBDCQ1BZSGS?
CYT4DNJBDCQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBDCQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBDCQ1BZSGS?
For technical support, including CYT4DNJBDCQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBDCQ1BZSGS requirements.
6.How does Aetrix verify that CYT4DNJBDCQ1BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBDCQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBDCQ1BZSGS meets industry standards.
7.What is the process for return or replacement of CYT4DNJBDCQ1BZSGS?
All CYT4DNJBDCQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBDCQ1BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBDCQ1BZSGS part is unused and in its original packaging.
Return procedure for CYT4DNJBDCQ1BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT4DNJBDCQ1BZSGS Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
