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Infineon Technologies CYT4DNJBDCQ1BZSGST
- Part No.:
- CYT4DNJBDCQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBDCQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:2,365
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Product details
Overview
CYT4DNJBDCQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ CPU, 6336 KB code-flash, 640 KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880×1080 @ 220 MHz), and JPEG decoding - deployed in automotive instrument clusters and HUD systems.
For engineers reviewing the CYT4DNJBDCQ1BZSGST datasheet, CYT4DNJBDCQ1BZSGST pinout, CYT4DNJBDCQ1BZSGST application, or CYT4DNJBDCQ1BZSGST equivalent, key selection criteria include dual-core M7 performance with TCM, ASIL-B functional safety architecture, on-the-fly graphics composition without frame buffers, and secure boot with eSHE/HSM support for OTA firmware updates.
Technical Context
The CYT4DNJBDCQ1BZSGST implements a heterogeneous multi-CPU subsystem: two lockstep-capable Cortex®-M7 cores (320 MHz, 16 KB I/D cache, 64 KB TCM each) handle primary real-time graphics and control tasks, while the Cortex®-M0+ (100 MHz) manages peripheral offload and security services including AES-128/192/256, SHA-256/512, and RSA/ECC acceleration via dedicated vector unit.
Its graphics pipeline integrates a command sequencer, drawing engine, composition engine, and display engine - enabling direct video feed-through from MIPI CSI-2 (4-lane, 2880×1080 @ 220 MHz) to dual FPD-Link outputs with on-the-fly warping for HUD projection, all without external frame buffer memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ for security/peripheral offload |
| Memory | 6336 KB code-flash (RWW, dual-bank), 128 KB work-flash, 640 KB SRAM with selective retention |
| Graphics Engine | 2D/2.5D rendering engine with 4096 KB VRAM; supports on-the-fly warping & composition without frame buffers |
| Video I/O | FPD-Link dual (2880×1080 @ 220 MHz), MIPI CSI-2 4-lane (1920×720 @ 110 MHz), ITU-656 capture (800×480) |
| Networking | 4× CAN FD (8 Mbps, ISO 11898-1:2015), 1× Gigabit Ethernet MAC (MII/RMII/RGMII, IEEE-1588 PTP, AVB) |
| Security | eSHE/HSM crypto engine: AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, SECDED ECC on flash/SRAM/TCM |
| Safety | ASIL-B compliant: SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, CSV, hardware error correction on safety-critical memories |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V ±5% regulated input; enables 12-bit SAR ADC sampling at up to 1 Msps with internal temperature/bandgap monitoring |
| GPIO_SMC[0..5] | Stepper motor control I/O | Direct interface to stepper drivers; supports ZPD and slew rate control for precise motor positioning in cluster gauges |
| RMII_RXD[0..1]/TXD[0..1] | Ethernet physical layer interface | Enables 10/100 Mbps operation with minimal external components; required for AVB audio streaming and time-synchronized diagnostics |
| MIPI_CSI2_CLK_P/N | Differential clock for MIPI CSI-2 | Supports 4-lane camera input up to 220 MHz lane rate; essential for rear-view or driver-monitoring video capture |
| FPD_LINK0_TX[0..3]_P/N | Dual differential FPD-Link output channel 0 | Drives first display (e.g., TFT LCD) at Wide-HD resolution; paired with FPD_LINK1 for dual-display HUD + cluster |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core M7 with TCM | 64 KB instruction + 64 KB data TCM per core enables deterministic real-time graphics rendering and control loop execution without cache misses |
| On-the-fly graphics composition | Eliminates need for external SDRAM frame buffer; reduces BOM cost and board space while lowering latency for HUD warping |
| FOTA-ready flash architecture | Dual-bank code-flash + RWW allows seamless background firmware update during vehicle operation without system reset |
| Hardware-accelerated JPEG decode | Offloads CPU from image decompression; supports full-resolution icons, menus, and warning graphics in instrument clusters |
| ASIL-B safety mechanisms | Integrated SMPU/PPU, SECDED ECC on all safety-critical memories, and redundant watchdogs meet ISO 26262 requirements out-of-box |
Applications
| Automotive Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, navigation, and ADAS alerts on TFT-LCD with animated transitions. IC Role / Device Role / Timing Role: Primary graphics controller and safety-critical gauge logic executor using dual M7 cores with deterministic TCM access. Use Value: Enables smooth 60 Hz UI updates with zero frame buffer latency and ASIL-B compliance for speed/RPM display integrity. | Use Scenario: Projection of augmented reality navigation cues onto windshield with geometric correction for driver eye position. IC Role / Device Role / Timing Role: Graphics engine performing real-time perspective warping and overlay composition directly to FPD-Link output. Use Value: On-the-fly warping eliminates external GPU, reducing system cost and thermal load while maintaining sub-5 ms end-to-end latency. |
| Rear-View Camera System | Vehicle Domain Controller (Entry-Level) |
Use Scenario: Processing and stitching video from multiple cameras for surround-view display with dynamic guidelines. IC Role / Device Role / Timing Role: MIPI CSI-2 receiver + JPEG decoder + graphics compositor handling concurrent 1920×720 inputs and overlay generation. Use Value: Single-chip solution replaces multi-IC camera processor, cutting PCB area by >40% and enabling <100 ms total video path latency. | Use Scenario: Consolidating body control, lighting, and basic ADAS functions in entry-tier vehicles without high-end SoC cost. IC Role / Device Role / Timing Role: Central MCU running AUTOSAR Classic with CAN FD gatewaying, LIN slave management, and secure OTA update orchestration. Use Value: Integrates safety (ASIL-B), security (HSM), and connectivity (Ethernet/CAN FD) in one package, reducing inter-ECU wiring and software integration effort. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 (320 MHz), no integrated graphics engine, 4 MB flash, supports only LVDS/RGB displays | Lacks on-chip 2D/2.5D rendering and VRAM; requires external GPU or FPGA for HUD warping | Select when graphics demands are limited to static UIs and cost-sensitive body control is priority over display complexity |
| Renesas RH850/U2A | Dual-lockstep RH850 cores (200 MHz), no JPEG decoder or MIPI CSI-2, 8 MB flash, ASIL-D capable | Optimized for powertrain/safety-critical control; no native video input/output interfaces or graphics acceleration | Select for high-integrity engine/transmission control where display functionality is handled by separate domain-specific ICs |
Compared with S32K344 and RH850/U2A, CYT4DNJBDCQ1BZSGST uniquely integrates dual M7 processing, on-the-fly graphics composition, MIPI CSI-2, and FPD-Link - making it the only single-package solution for cost-constrained automotive HUD + cluster systems requiring ASIL-B and OTA readiness.
Availability
CYT4DNJBDCQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, rear-view camera systems, and entry-level domain controllers requiring stable component supply across extended vehicle lifecycles.
Supply support for CYT4DNJBDCQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global manufacturing and R&D infrastructure.
CYT4DN belongs to the TRAVEO™ T2G automotive MCU product line, designed specifically for next-generation digital cockpits requiring integrated graphics, functional safety, and secure connectivity in a single chip.
FAQ
What is the maximum display resolution supported by CYT4DNJBDCQ1BZSGST?
The device supports dual FPD-Link output at up to 2880×1080 resolution at 220 MHz per lane, enabling Wide-HD+ dual-display configurations. Parallel RGB supports 1600×600 at 80 MHz, and FPD-Link single supports 1920×720 at 110 MHz. All resolutions are validated in the official Infineon datasheet Rev. *L.
Does CYT4DNJBDCQ1BZSGST support ISO 26262 ASIL-B certification out of the box?
Yes - it includes hardware-level safety features required for ASIL-B: shared memory protection unit (SMPU), peripheral protection unit (PPU), multi-counter watchdog timer (MCWDT), brown-out detection (BOD), and SECDED ECC on flash, SRAM, and TCM. These are documented in Section 3.2 and Section 21 of the datasheet.
Can the JPEG decoder handle YUV 4:2:0 subsampled images?
Yes - the integrated JPEG decoder supports YUV 4:4:4, 4:2:2, 4:1:1, and 4:2:0 subsampling formats, as confirmed in the "JPEG Decoder" feature section of the datasheet. Input image sizes range from 1×1 to 16384×16384 pixels, with full conformance to ISO/IEC 10918-1 subset.
Is external RAM required for graphics operation?
No - the device includes 4096 KB of embedded video RAM (VRAM) and supports on-the-fly graphics rendering without frame buffers. This eliminates the need for external SDRAM or DDR, reducing bill-of-materials cost and PCB complexity while lowering latency for HUD and cluster applications.
CYT4DNJBDCQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBDCQ1BZSGST FAQ
1.How can I place an order for CYT4DNJBDCQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBDCQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBDCQ1BZSGST reliable?
The price and inventory of CYT4DNJBDCQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBDCQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT4DNJBDCQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBDCQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBDCQ1BZSGST?
CYT4DNJBDCQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBDCQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBDCQ1BZSGST?
For technical support, including CYT4DNJBDCQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBDCQ1BZSGST requirements.
6.How does Aetrix verify that CYT4DNJBDCQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBDCQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBDCQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT4DNJBDCQ1BZSGST?
All CYT4DNJBDCQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBDCQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBDCQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT4DNJBDCQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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