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Infineon Technologies CYT4DNJBECQ1BZSGST
- Part No.:
- CYT4DNJBECQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBECQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:1,092
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Product details
Overview
CYT4DNJBECQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Cortex®-M0+ CPU, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096-KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880×1080 @ 220 MHz), and JPEG decoding - deployed in automotive instrument clusters and HUD systems.
For engineers reviewing the CYT4DNJBECQ1BZSGST datasheet, CYT4DNJBECQ1BZSGST pinout, CYT4DNJBECQ1BZSGST application, or CYT4DNJBECQ1BZSGST equivalent, key selection criteria include dual-core deterministic real-time performance, ASIL-B functional safety compliance, on-the-fly graphics composition without frame buffers, secure boot with eSHE/HSM, and multi-display timing control via dedicated display engine.
Technical Context
The CYT4DNJBECQ1BZSGST implements a heterogeneous multi-CPU architecture: two lockstep-capable Cortex®-M7 cores for primary application processing (with 16-KB I/D caches, FPUs, and TCM), plus a Cortex®-M0+ core dedicated to peripheral management and security services. Inter-processor communication is hardware-accelerated via dedicated mailbox and semaphore units.
Its graphics subsystem integrates a command sequencer, drawing engine, composition engine, and display engine - enabling real-time HUD warping, direct capture-to-display video feed, and simultaneous dual-display output via parallel RGB and dual-lane FPD-Link. All safety-critical memories employ SECDED ECC protection per ISO 26262 ASIL-B requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ |
| Flash Memory | 6336-KB code-flash with RWW, dual-bank FOTA support |
| SRAM | 640-KB with configurable retention granularity |
| Graphics RAM | 4096-KB embedded VRAM for on-the-fly rendering |
| Display Interfaces | Parallel RGB (1600×600 @ 80 MHz), FPD-Link dual (2880×1080 @ 220 MHz) |
| Networking | 4× CAN FD (up to 8 Mbps), 1× Gigabit Ethernet MAC (MII/RMII/RGMII) |
| Functional Safety | ASIL-B compliant with MPU/SMPU/PPU, SECDED ECC, MCWDT, CSV |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8-mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1-V regulated input; supports dual BOD thresholds (2.7 V / 3.0 V) for robust analog sensing |
| CLK_IN | External clock input | Accepts ECO or WCO crystal; enables precise timing for RTC and AVB synchronization |
| ETH_RXD[3:0] | Ethernet receive data bus | 4-bit RMII/GMII interface supporting IEEE-1588 PTP timestamping at line rate |
| CANFD_TX[3:0] | CAN FD transmit signals | Four independent CAN FD channels with ISO 11898-1:2015 and Bosch V1.0 compliance |
| FPDLP0_P/N | FPD-Link differential pair 0 | High-speed serialized video output supporting up to 220 MHz lane rate for HUD projection |
Key Features
| Feature | Design Value |
|---|---|
| Dual-display graphics engine | Enables simultaneous HUD and cluster display output with on-the-fly warping and layer composition - no external frame buffer required |
| Secure boot with eSHE/HSM | Hardware-accelerated RSA/ECC signature verification and AES-256 GCM decryption ensure authenticated firmware execution at power-on |
| ASIL-B safety mechanisms | Integrated SMPU, PPU, SECDED ECC on flash/SRAM/TCM, and multi-counter watchdog (MCWDT) meet ISO 26262 requirements |
| Flexible audio subsystem | Two PCM-PWM interfaces + five sound generator (SG) channels enable multi-zone audio synthesis and mixing without DSP offload |
| Runtime-reconfigurable SCBs | 12 serial communication blocks dynamically assignable as UART/I²C/SPI - simplifies protocol migration across vehicle variants |
Applications
| Automotive Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD dash panel. IC Role / Device Role / Timing Role: Primary application processor with dual M7 cores executing graphics composition and CAN FD message aggregation. Use Value: 6336-KB flash enables full AGL/Linux-based UI stack; 4096-KB VRAM allows triple-buffered 1280×480 rendering at 60 Hz without external memory bandwidth penalty. | Use Scenario: Projection of augmented reality overlays onto windshield with geometric correction for driver eyebox alignment. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and video timing generation synchronized to vehicle motion sensors. Use Value: Dedicated display engine generates precise pixel-clock and H/V sync for FPD-Link dual interface, enabling 2880×1080 @ 220 MHz output with sub-pixel warping latency < 2 ms. |
| Automotive Ethernet Gateway | Multi-Sensor Fusion Node |
Use Scenario: Aggregation and routing of CAN FD, LIN, and CXPI messages to central domain controller via time-synchronized Gigabit Ethernet. IC Role / Device Role / Timing Role: Network interface controller with IEEE-1588 PTP hardware timestamping and AVB traffic shaping (IEEE-802.1Qav/Qbb). Use Value: Hardware-accelerated packet filtering and VLAN tagging reduce CPU load by >70% versus software-only Ethernet stacks; RGMII interface ensures deterministic < 1 μs PHY-to-MAC latency. | Use Scenario: Synchronization and preprocessing of camera, radar, and ultrasonic sensor streams for ADAS perception pipeline. IC Role / Device Role / Timing Role: Image capture engine ingests MIPI CSI-2 (4-lane, 2880×1080 @ 220 MHz) while M0+ core handles secure sensor authentication and CRC validation. Use Value: Dual MIPI CSI-2 receivers with ITU-R BT.656 support allow concurrent front/rear camera input; JPEG decoder offloads host CPU by decompressing thumbnails at 60 fps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 core (320 MHz), 4 MB flash, no integrated graphics engine or VRAM | Targeted at body control and gateway functions - lacks HUD/instrument cluster graphics acceleration | Select when graphics rendering is handled externally or not required; lower BOM cost but higher system-level latency for display compositing |
| Renesas RH850/U2A | Tri-core lockstep (400 MHz), 12 MB flash, ASIL-D capable, no Ethernet MAC or JPEG decode | Focused on powertrain and chassis control; no multimedia or multi-display support | Choose for high-integrity motor control where display capability is irrelevant; requires external PHY and graphics IP for cluster/HUD use cases |
Compared with S32K344 and RH850/U2A, CYT4DNJBECQ1BZSGST uniquely integrates dual-M7 compute, on-die graphics, JPEG decode, and Gigabit Ethernet - enabling consolidated instrument cluster + HUD + gateway functionality in a single SoC without external co-processors or frame buffers.
Availability
CYT4DNJBECQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, domain controllers, and Ethernet gateways requiring stable component supply across extended vehicle lifecycles.
Supply support for CYT4DNJBECQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and automotive-grade manufacturing facilities.
CYT4DN belongs to the TRAVEO™ T2G product line - engineered specifically for automotive human-machine interface (HMI) systems requiring real-time graphics, functional safety, and multi-protocol connectivity in a single-chip solution.
FAQ
What is the maximum resolution supported by the FPD-Link dual interface?
The FPD-Link dual interface supports up to 2880 × 1080 pixels at 220 MHz lane rate, enabling Wide-HD resolution for head-up display projection with sub-millisecond warping latency. This configuration uses four differential pairs (two per link) and requires compatible FPD-Link III transceivers and timing calibration per Infineon's AN245677 guidelines.
Does CYT4DNJBECQ1BZSGST support secure over-the-air (OTA) firmware updates?
Yes - it supports FOTA via dual-bank flash architecture with Read-While-Write capability, hardware-accelerated AES-256-GCM decryption, and digital signature verification using RSA-3072/ECC secp384r1. The M0+ core isolates update validation from application execution, ensuring atomic rollback on signature failure.
How many CAN FD channels are implemented, and what is their physical layer compatibility?
CYT4DNJBECQ1BZSGST integrates four fully independent CAN FD controllers compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. Each channel supports data rates up to 8 Mbps and requires external CAN FD transceivers (e.g., Infineon TLE9251V); ISO 16845:2015 conformance testing is certified.
Is the JPEG decoder capable of real-time decoding for camera preview streams?
Yes - the hardware JPEG decoder processes YUV420/422/444 and RGB images up to 1920 × 1080 at 60 fps, with pipelined DMA transfers directly to VRAM. It supports progressive and baseline DCT modes per ISO/IEC 10918-1, enabling low-latency camera preview without CPU intervention or external memory bandwidth consumption.
CYT4DNJBECQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBECQ1BZSGST FAQ
1.How can I place an order for CYT4DNJBECQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBECQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBECQ1BZSGST reliable?
The price and inventory of CYT4DNJBECQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBECQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT4DNJBECQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBECQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBECQ1BZSGST?
CYT4DNJBECQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBECQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBECQ1BZSGST?
For technical support, including CYT4DNJBECQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBECQ1BZSGST requirements.
6.How does Aetrix verify that CYT4DNJBECQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBECQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBECQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT4DNJBECQ1BZSGST?
All CYT4DNJBECQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBECQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBECQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT4DNJBECQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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