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Infineon Technologies CYT4DNJBGCQ1BZSGST
- Part No.:
- CYT4DNJBGCQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBGCQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:3,013
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Product details
Overview
CYT4DNJBGCQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ CPU, 6336 KB code-flash, 640 KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880×1080 @ 220 MHz), and JPEG decoding - deployed in automotive instrument clusters and HUD systems.
For engineers reviewing the CYT4DNJBGCQ1BZSGST datasheet, CYT4DNJBGCQ1BZSGST pinout, CYT4DNJBGCQ1BZSGST application, or CYT4DNJBGCQ1BZSGST equivalent, key selection criteria include dual-core deterministic real-time performance, ASIL-B functional safety compliance, on-the-fly graphics composition without frame buffers, and hardware-accelerated crypto (AES-256, ECC, SHA-256) with eSHE/HSM support.
Technical Context
The CYT4DNJBGCQ1BZSGST implements a heterogeneous multi-CPU architecture: two lockstep-capable Cortex-M7 cores for primary application processing and safety-critical tasks, plus a dedicated Cortex-M0+ core handling peripheral management, secure boot, and cryptographic offload. Memory subsystem includes RWW flash supporting FOTA updates in dual-bank mode and SECDED ECC protection across SRAM, TCM, and flash.
Its graphics pipeline integrates capture (MIPI CSI-2 up to 4-lane), composition (layer blending), warping (HUD-specific perspective correction), and dual-display output (FPD-Link dual + RGB) - all synchronized via hardware command sequencer and display timing engine, eliminating software frame buffer dependency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ |
| Flash Memory | 6336 KB code-flash with 128 KB work-flash; supports Read-While-Write and dual-bank FOTA |
| SRAM | 640 KB with configurable retention granularity |
| Graphics Engine | 2D/2.5D rendering engine with 4096 KB VRAM; supports on-the-fly warping & direct capture-to-display feed |
| Video Interfaces | FPD-Link dual (2880×1080 @ 220 MHz), Parallel RGB (1600×600 @ 80 MHz), MIPI CSI-2 (4-lane) |
| Networking | 4× CAN FD (ISO 11898-1:2015 compliant, up to 8 Mbps), 1× Gigabit Ethernet MAC (RGMII/MII/RMII) |
| Security | HSM + eSHE; AES-128/192/256, ECC, RSA, SHA-256/512, TRNG, SECDED ECC on safety-critical memories |
| Safety Certification | ASIL-B compliant with MPU, SMPU, PPU, MCWDT, BOD, OVD, OCD, CSV, and hardware error correction |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V ±5 % regulated input; enables 12-bit SAR ADC sampling at up to 1 Msps |
| VDDD | Digital core supply | 1.1 V nominal core rail generated internally from 2.7–5.5 V input; powers M7/M0+ cores and digital logic |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Supports 1–50 MHz crystals for precise clock generation; used for ECO and WCO configurations |
| ETH_RXD0–3 / ETH_TXD0–3 | Gigabit Ethernet PHY data lanes | RGMII interface pins; enable IEEE-802.3az energy-efficient Ethernet with AVB/PTP timestamping |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 differential pair | High-speed CAN FD physical layer interface supporting up to 8 Mbps data rate per channel |
| FPDLP0_CLK / FPDLP0_DATA[0:7] | FPD-Link dual primary channel | Carries pixel data and timing for first display; supports Wide-HD (2880×1080) at 220 MHz DDR |
| CSI2_D0P/N – CSI2_D3P/N | MIPI CSI-2 4-lane differential input | Accepts camera video streams up to 2880×1080 @ 220 MHz; supports ITU-R BT.656 and YUV formats |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Two independent Cortex-M7 cores with separate 64 KB TCM each; enables time-critical task partitioning and lockstep redundancy |
| On-the-fly graphics composition | Hardware composition engine blends up to 8 layers without frame buffer memory - reduces latency and external DRAM dependency |
| Secure boot with fast authentication | Hardware-accelerated digital signature verification using ECC keys; boots verified firmware in <100 ms |
| ASIL-B safety mechanisms | Integrated SMPU, PPU, MCWDT, and SECDED ECC on all safety-critical memories - eliminates need for external safety monitors |
| Flexible display output | Simultaneous dual-display support via FPD-Link dual + RGB; enables HUD + cluster separation with independent timing control |
| Low-power wake-up granularity | 81 GPIOs and 10 dedicated pins capable of waking from Deep Sleep/Hibernate - enables ultra-low-power always-on monitoring |
Applications
| Automotive Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD dashboards. IC Role / Device Role / Timing Role: Primary application processor with graphics acceleration and CAN FD gateway for cluster data fusion. Use Value: Dual M7 cores execute UI stack and safety-critical gauges independently; 4096 KB VRAM enables smooth 60 Hz animation without external memory. | Use Scenario: Projection of speed, warnings, and AR navigation onto windshield with geometric correction. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and overlay composition synchronized to vehicle pitch/yaw sensors. Use Value: On-the-fly warping engine eliminates need for pre-rendered frames or GPU memory; reduces system latency to <16 ms. |
| Central Domain Controller | Camera-Based Driver Monitoring System (DMS) |
Use Scenario: Aggregation and preprocessing of CAN FD, LIN, Ethernet, and sensor data across vehicle domains. IC Role / Device Role / Timing Role: High-bandwidth interconnect hub with 4× CAN FD, 2× LIN, 2× CXPI, and Gigabit Ethernet MAC. Use Value: Hardware timestamping (IEEE-1588 PTP) and AVB (IEEE-802.1Qav) ensure deterministic cross-domain message scheduling. | Use Scenario: Capturing and preprocessing cabin-facing camera video for driver attention and drowsiness analysis. IC Role / Device Role / Timing Role: MIPI CSI-2 receiver + JPEG decoder + secure crypto engine for encrypted video stream processing. Use Value: 4-lane CSI-2 supports 1920×1080@30 fps input; hardware JPEG decode offloads CPU and reduces bandwidth to 1/10th raw data rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K398 | Single Cortex-M7 core (up to 320 MHz); no integrated graphics engine; 8 MB flash, 2 MB SRAM | Targeted at body control and gateway applications - lacks HUD/instrument cluster graphics acceleration | Select when graphics rendering is handled externally or not required; better suited for non-display domain controllers |
| Renesas RH850/U2A | Tri-core lockstep architecture (3× Cortex-R7); no JPEG decoder or MIPI CSI-2; 12 MB flash, 2.5 MB SRAM | Focused on powertrain and chassis control; no 2D graphics or dual-display timing engines | Prefer for ASIL-D safety-critical motor control; not viable for HUD/instrument cluster due to missing display subsystem |
Compared with NXP S32K398 and Renesas RH850/U2A, CYT4DNJBGCQ1BZSGST uniquely integrates dual M7 cores, on-the-fly graphics warping, FPD-Link dual, and MIPI CSI-2 - making it the only option among the three qualified for automotive HUD + cluster convergence without external GPUs or video processors.
Availability
CYT4DNJBGCQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, Head-Up Displays, central domain controllers, and camera-based DMS requiring stable component supply, long lifecycle support, and ASIL-B certified silicon.
Supply support for CYT4DNJBGCQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.
The TRAVEO™ T2G product line targets high-performance automotive human-machine interfaces, delivering integrated graphics, networking, and functional safety in a single SoC for next-generation digital cockpits.
FAQ
What is the maximum resolution supported by the FPD-Link dual interface?
The FPD-Link dual interface supports up to 2880 × 1080 pixels at 220 MHz DDR clock, enabling Wide-HD resolution for primary and secondary displays simultaneously. This capability is validated in the CYT4DN datasheet Rev. *L Section 3.4 and confirmed via Infineon's TRAVEO™ T2G evaluation platform timing reports.
Does CYT4DNJBGCQ1BZSGST support hardware-accelerated JPEG decoding?
Yes - it includes a dedicated JPEG decoder compliant with ISO/IEC 10918-1, supporting YUV 4:4:4/4:2:2/4:2:0 sub-sampling and image sizes up to 16384 × 16384 pixels. Decoded output is delivered directly to VRAM or display pipeline without CPU intervention.
How many CAN FD channels does this MCU implement, and what is their data rate limit?
CYT4DNJBGCQ1BZSGST integrates four independent CAN FD controllers, each supporting up to 8 Mbps data rate per channel under ISO 11898-1:2015 compliance. Physical layer speed depends on transceiver and bus topology, but controller-level arbitration and data phases are fully hardware-managed.
Is the crypto engine enabled on this specific part number?
Yes - CYT4DNJBGCQ1BZSGST includes full HSM + eSHE functionality: AES-128/192/256, SHA-256/512, ECC, RSA, TRNG, and Galois/Counter Mode (GCM). These features are active and documented in the device's security chapter (Section 3.6) and enabled by default in production silicon.
CYT4DNJBGCQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBGCQ1BZSGST FAQ
1.How can I place an order for CYT4DNJBGCQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBGCQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBGCQ1BZSGST reliable?
The price and inventory of CYT4DNJBGCQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBGCQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT4DNJBGCQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBGCQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBGCQ1BZSGST?
CYT4DNJBGCQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBGCQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBGCQ1BZSGST?
For technical support, including CYT4DNJBGCQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBGCQ1BZSGST requirements.
6.How does Aetrix verify that CYT4DNJBGCQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBGCQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBGCQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT4DNJBGCQ1BZSGST?
All CYT4DNJBGCQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBGCQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBGCQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT4DNJBGCQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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