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Infineon Technologies CYT4DNJBHCQ1BZSGST
- Part No.:
- CYT4DNJBHCQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBHCQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:2,615
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Product details
Overview
CYT4DNJBHCQ1BZSGST from Infineon is an automotive-grade 32-bit dual-core Arm® Cortex®-M7 microcontroller with integrated Arm® Cortex®-M0+ security core, 6336 KB code-flash, 640 KB SRAM, and hardware-accelerated 2D/2.5D graphics engine supporting dual FPD-Link outputs up to 2880 × 1080 @ 220 MHz - deployed in digital instrument clusters and AR-based Head-Up Displays (HUD).
For engineers reviewing the CYT4DNJBHCQ1BZSGST datasheet, CYT4DNJBHCQ1BZSGST pinout, CYT4DNJBHCQ1BZSGST application, or CYT4DNJBHCQ1BZSGST equivalent, key selection criteria include ASIL-B functional safety compliance, CAN FD (up to 8 Mbps) + Gigabit Ethernet AVB/PTP support, on-the-fly JPEG decode, and dual-display composition without frame buffers.
Technical Context
The CYT4DNJBHCQ1BZSGST implements a heterogeneous multi-core architecture: two lockstep-capable 320-MHz Cortex®-M7 CPUs handle real-time graphics and application processing, while a dedicated 100-MHz Cortex®-M0+ core manages peripheral control, secure boot, and HSM operations. Memory subsystem includes RWW flash with dual-bank FOTA capability and SECDED ECC on all safety-critical memories (SRAM, TCM, flash).
Its graphics pipeline integrates a command sequencer, drawing engine, composition engine, and display warping unit - enabling HUD-specific real-time perspective correction directly in hardware. The video path supports direct capture-to-display feed-through with overlay, eliminating external frame buffer memory for latency-sensitive applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ |
| Flash Memory | 6336 KB code-flash + 128 KB work-flash; supports Read-While-Write and dual-bank FOTA |
| Graphics Engine | Hardware-accelerated 2D/2.5D rendering; 4096 KB VRAM; on-the-fly display warping for HUD |
| Video Interfaces | Dual FPD-Link (2-lane + 4-lane); max 2880×1080 @ 220 MHz; parallel RGB up to 1600×600 @ 80 MHz |
| Networking | 4× CAN FD (up to 8 Mbps), 1× Gigabit Ethernet MAC with AVB/PTP/IEEE-802.1AS support |
| Safety Certification | ASIL-B compliant; MPU/SMPU/PPU protection; SECDED ECC on SRAM/flash/TCM; hardware watchdogs |
| Security | eSHE/HSM support; AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, GCM mode |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V ±5% regulated input; enables 12-bit SAR ADC sampling at 1 Msps |
| FPD_LX0_P/N | FPD-Link Channel 0 differential pair | Transmits pixel clock and data for primary display; supports 2880×1080 @ 220 MHz |
| ETH_RXD0–3 | Ethernet receive data lines | RGMII interface pins for 1000BASE-T operation with IEEE-1588 timestamp alignment |
| CANFD0_TX/RX | CAN FD channel 0 transceiver interface | Supports ISO 11898-1:2015 and Bosch CAN FD v1.0; up to 8 Mbps data rate |
| JTAG_TCK/TMS/TDO/TDI | IEEE-1149.1 debug interface | Enables boundary scan, SWD, and ETM instruction/data trace via standard debug tools |
Key Features
| Feature | Design Value |
|---|---|
| Dual-display graphics composition | Hardware layer blending and alpha compositing without external frame buffer memory |
| On-the-fly HUD warping | Real-time perspective correction of rendered graphics using dedicated geometry engine |
| Secure boot with fast authentication | Digital signature verification using RSA/ECC keys stored in protected eFuses |
| Low-latency capture-to-display path | Direct MIPI CSI-2 → graphics engine → FPD-Link output with <50 µs end-to-end latency |
| ASIL-B runtime monitoring | Hardware-enforced memory protection (MPU/SMPU), clock supervisor (CSV), and multi-counter watchdog (MCWDT) |
Applications
| Digital Instrument Cluster | AR Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, ADAS alerts, navigation arrows, and battery state on TFT-LCD dashboard displays. IC Role / Device Role / Timing Role: Primary application processor with dual Cortex®-M7 cores driving graphics pipeline and CAN FD communication stack. Use Value: Enables smooth 60 Hz UI updates with hardware-accelerated vector graphics and zero-frame-buffer composition. | Use Scenario: Projection of speed, lane guidance, and collision warnings onto windshield with geometric distortion correction. IC Role / Device Role / Timing Role: Graphics subsystem controller performing real-time perspective warping and overlay composition before FPD-Link output. Use Value: Eliminates need for external FPGA or GPU; achieves sub-millisecond warping latency using dedicated hardware engine. |
| Central Domain Controller | Automotive Audio Video Bridging Node |
Use Scenario: Integration hub aggregating CAN FD, LIN, CXPI, and Ethernet traffic across chassis, powertrain, and infotainment domains. IC Role / Device Role / Timing Role: Multi-protocol gateway with hardware-accelerated packet filtering and time-synchronized message routing. Use Value: Supports IEEE-1588 PTP timestamping and AVB traffic shaping across all interfaces for deterministic network behavior. | Use Scenario: Synchronization and streaming of high-fidelity audio and camera feeds across distributed ECUs in premium vehicles. IC Role / Device Role / Timing Role: Ethernet MAC endpoint with IEEE-802.1AS/1Qav/1Qbb compliance for time-aware traffic scheduling. Use Value: Guarantees <100 µs jitter for audio streams and <1 ms latency for camera video over shared Ethernet backbone. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics and networking MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K398 | Single Cortex®-M7 core (320 MHz); no integrated graphics engine; 4 MB flash; supports CAN FD + Ethernet AVB | Lacks hardware-accelerated 2D/2.5D graphics and HUD warping; requires external GPU or software rendering | Select when graphics requirements are minimal and focus is on safety-critical control + networking only. |
| Renesas RH850/U2A | Dual-lockstep Cortex®-M7 (300 MHz); no JPEG decoder or FPD-Link; 8 MB flash; supports CAN FD + Ethernet TSN | No native display output interfaces; relies on external SerDes or LVDS transmitter ICs for display connectivity | Select for high-integrity control applications where display functionality is offloaded to separate SoC or ASIC. |
Compared with S32K398 and RH850/U2A, CYT4DNJBHCQ1BZSGST uniquely integrates dual-display FPD-Link, on-the-fly JPEG decode, and HUD-specific warping - reducing BOM count and system latency in instrument cluster and HUD designs.
Availability
CYT4DNJBHCQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, AR head-up displays, central domain controllers, and Ethernet AVB gateway modules requiring stable component supply and long-term lifecycle support.
Supply support for CYT4DNJBHCQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and R&D centers.
The TRAVEO™ T2G product line targets next-generation automotive human-machine interfaces, delivering integrated graphics, safety, and high-speed networking in a single die for digital cockpits and ADAS visualization systems.
FAQ
What is the maximum resolution supported by the dual FPD-Link interface?
The CYT4DNJBHCQ1BZSGST supports up to 2880 × 1080 pixels at 220 MHz on its dual-lane FPD-Link interface, enabling Wide-HD output for primary and secondary displays simultaneously. Each FPD-Link channel operates independently with configurable timing parameters and built-in equalization for cable compensation.
Does CYT4DNJBHCQ1BZSGST support secure over-the-air (FOTA) firmware updates?
Yes - it features dual-bank flash architecture with Read-While-Write capability, enabling seamless background firmware updates without interrupting real-time operation. Secure boot validates digital signatures using RSA/ECC keys, and the HSM enforces cryptographic integrity during update execution.
How does the graphics subsystem reduce system-level latency in HUD applications?
The graphics engine performs on-the-fly perspective warping in hardware, bypassing frame buffer reads/writes. Combined with direct MIPI CSI-2 → display path and hardware composition, end-to-end latency from camera input to projected output is under 50 µs - critical for motion-parallax-free AR overlays.
Which Ethernet PHY interfaces are supported by the integrated MAC?
The Gigabit Ethernet MAC supports MII, RMII, and RGMII PHY interfaces. RGMII is recommended for 1000BASE-T operation with IEEE-1588 timestamp alignment, while RMII suffices for 100BASE-TX in space-constrained layouts. All modes support AVB traffic shaping per IEEE-802.1Qav.
CYT4DNJBHCQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBHCQ1BZSGST FAQ
1.How can I place an order for CYT4DNJBHCQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBHCQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBHCQ1BZSGST reliable?
The price and inventory of CYT4DNJBHCQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBHCQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT4DNJBHCQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBHCQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBHCQ1BZSGST?
CYT4DNJBHCQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBHCQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBHCQ1BZSGST?
For technical support, including CYT4DNJBHCQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBHCQ1BZSGST requirements.
6.How does Aetrix verify that CYT4DNJBHCQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBHCQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBHCQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT4DNJBHCQ1BZSGST?
All CYT4DNJBHCQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBHCQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBHCQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT4DNJBHCQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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