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Infineon Technologies CYT4DNJBJCQ1BZSGS
- Part No.:
- CYT4DNJBJCQ1BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBJCQ1BZSGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:2,079
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Product details
Overview
CYT4DNJBJCQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ security core, 6336 KB code-flash, 640 KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880×1080 @ 220 MHz), and JPEG decoding for HUD and digital instrument cluster applications.
For engineers reviewing the CYT4DNJBJCQ1BZSGS datasheet, CYT4DNJBJCQ1BZSGS pinout, CYT4DNJBJCQ1BZSGS application, or CYT4DNJBJCQ1BZSGS equivalent, key selection criteria include dual-core deterministic real-time performance, ASIL-B functional safety certification, on-the-fly graphics composition without frame buffers, secure boot with eSHE/HSM, and multi-display timing control via dedicated display engine.
Technical Context
The CYT4DNJBJCQ1BZSGS implements a heterogeneous multi-core architecture: two lockstep-capable Cortex®-M7 cores handle primary graphics and application processing, while the Cortex®-M0+ executes peripheral management and cryptographic operations including AES-128/192/256, SHA-256/512, and RSA/ECC via dedicated vector unit. All safety-critical memories employ SECDED ECC.
Its graphics subsystem integrates capture engine (MIPI CSI-2 4-lane, ITU-R BT.656), composition engine, drawing engine, command sequencer, and display engine - enabling direct video feed-through with overlay, perspective warping for HUD, and simultaneous dual-display output via parallel RGB and FPD-Link interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ for security/peripheral offload |
| Memory | 6336 KB code-flash (RWW, dual-bank FOTA), 640 KB SRAM with configurable retention |
| Graphics Engine | 2D/2.5D rendering with 4096 KB VRAM; supports on-the-fly composition and HUD warping |
| Display Interfaces | Parallel RGB (1600×600 @ 80 MHz), FPD-Link single (1920×720 @ 110 MHz), FPD-Link dual (2880×1080 @ 220 MHz) |
| Video Capture | MIPI CSI-2 4-lane (2880×1080 @ 220 MHz), ITU-R BT.656 (800×480), parallel RGB/YUV input |
| Networking | 4× CAN FD (ISO 11898-1:2015, up to 8 Mbps), 1× Gigabit Ethernet MAC (MII/RMII/RGMII, IEEE-1588 PTP) |
| Safety & Security | ASIL-B compliant; eSHE/HSM crypto engine; SECDED ECC on flash/SRAM/TCM; secure boot with digital signature |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V ±5% regulated supply; enables 12-bit SAR ADC sampling at 1 Msps with internal temperature/bandgap monitoring |
| GPIO_SMC[0..5] | Stepper motor control I/O | Supports ZPD and slew rate control; maps to 6 SMC channels for precise motor positioning in HUD actuation |
| ETH_RXD[0..3], ETH_TXD[0..3] | Gigabit Ethernet data lanes | RGMII interface; requires external PHY; enables time-synchronized AVB streaming per IEEE-802.1AS/Qav/Qbb |
| FPD_TXP/N[0..3] | FPD-Link differential video output | Dual-channel LVDS signaling; drives HUD and instrument cluster displays simultaneously at Wide-HD resolution |
| JTAG_TCK/TMS/TDO/TDI | Debug clock/control/data | IEEE-1149.1-compliant boundary scan; supports ETM instruction/data trace via JTAG or SWD |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Two Cortex®-M7 cores with independent 64 KB TCM each enable hard real-time graphics rendering and application logic isolation |
| On-the-fly graphics composition | Eliminates frame buffer memory overhead by composing layers directly to display engines during active video blanking |
| HUD-specific display warping | Hardware-accelerated perspective transformation applied in real time to compensate for curved windshield projection geometry |
| Secure firmware update | Dual-bank flash with RWW allows authenticated FOTA updates without interrupting HUD operation or instrument cluster UI |
| Multi-protocol automotive networking | Integrated CAN FD, LIN, CXPI, and AVB-capable Ethernet reduce external transceiver count and PCB routing complexity |
Applications
| Digital Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, ADAS alerts, navigation arrows, and battery state on TFT-LCD dashboard display. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant graphics stack and sensor fusion middleware. Use Value: Dual M7 cores deliver deterministic <10 ms UI refresh latency; FPD-Link dual interface drives high-resolution cluster and secondary warning display concurrently. | Use Scenario: Projection of speed, lane departure, and collision warnings onto windshield using DLP or LCoS optical engine. IC Role / Device Role / Timing Role: Graphics and timing controller performing real-time perspective warping and video synchronization with vehicle pitch/yaw sensors. Use Value: Dedicated warping engine eliminates GPU load; RGMII Ethernet enables OTA calibration updates without disrupting HUD visibility. |
| Central Domain Controller | Automotive Audio Gateway |
Use Scenario: Consolidating body control, lighting, HVAC, and infotainment communication over CAN FD and Ethernet backbone. IC Role / Device Role / Timing Role: High-integration domain MCU managing cross-domain message routing and secure firmware orchestration. Use Value: Integrated HSM and eSHE enforce secure boot and encrypted inter-domain messaging; 4× CAN FD ports eliminate external gateway ICs. | Use Scenario: Aggregating audio streams from microphones, Bluetooth, and USB, then distributing to amplifier and speaker nodes. IC Role / Device Role / Timing Role: Audio signal processor with five SG interfaces, two PCM mixers, and DAC for analog output to amplifier. Use Value: TDM/PCM-PWM interfaces support 8-channel audio I/O; JPEG decoder enables dynamic UI icons without external memory bandwidth penalty. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics and domain controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K398 | Single Cortex®-M7 core (320 MHz); no integrated graphics engine; 4 MB flash; supports ASIL-D but lacks VRAM and display engine | Targeted at safety-critical powertrain/braking control; not suitable for HUD/instrument cluster graphics rendering | Select when deterministic ASIL-D control dominates over graphical UI requirements |
| Renesas RH850/U2A | 32-bit RXv3 core (400 MHz); no hardware graphics acceleration; 12 MB flash; supports CAN FD and Ethernet but no JPEG decoder or VRAM | Focused on high-reliability powertrain ECU; lacks on-the-fly composition and HUD warping capability | Select for legacy AUTOSAR-based powertrain systems requiring long lifecycle support and no display output |
Compared with NXP S32K398 and Renesas RH850/U2A, CYT4DNJBJCQ1BZSGS uniquely delivers integrated 2D/2.5D graphics, dual-display timing control, and HUD-specific warping - making it the only option among the three qualified for automotive digital cockpit applications requiring concurrent high-resolution display outputs and secure real-time processing.
Availability
CYT4DNJBJCQ1BZSGS is available at Aetrix Electronics and suitable for digital instrument clusters, head-up displays, central domain controllers, and automotive audio gateways requiring stable component supply across extended automotive lifecycles.
Supply support for CYT4DNJBJCQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
CYT4DN belongs to the TRAVEO™ T2G family, designed specifically for automotive digital cockpit systems requiring integrated graphics, functional safety (ASIL-B), and multi-protocol connectivity in a single die.
FAQ
What is the maximum display resolution supported by CYT4DNJBJCQ1BZSGS?
CYT4DNJBJCQ1BZSGS supports up to 2880 × 1080 pixels via dual-channel FPD-Link at 220 MHz, enabling Wide-HD output to both instrument cluster and HUD displays simultaneously. Parallel RGB supports 1600 × 600 at 80 MHz, and single FPD-Link supports 1920 × 720 at 110 MHz. All interfaces operate with hardware-timed video generation and zero-frame-buffer composition.
Does CYT4DNJBJCQ1BZSGS support secure boot with cryptographic verification?
Yes. CYT4DNJBJCQ1BZSGS implements secure boot using digital signature verification via its integrated crypto engine, supporting ECDSA and RSA-2048/3072. The boot ROM validates signed firmware images before execution, and the Hardware Security Module (HSM) enforces key protection and runtime attestation per ISO/SAE 21434 requirements.
How many CAN FD interfaces does CYT4DNJBJCQ1BZSGS provide, and what is their data rate?
CYT4DNJBJCQ1BZSGS integrates four independent CAN FD controllers compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. Each channel supports data rates up to 8 Mbps in the data phase, with flexible bit-rate switching and error confinement. All controllers include dedicated message RAM and hardware filtering for deterministic real-time messaging.
Is CYT4DNJBJCQ1BZSGS qualified for automotive temperature grades?
Yes. CYT4DNJBJCQ1BZSGS is qualified for AEC-Q100 Grade 2 (−40 °C to +105 °C ambient) operation. Its thermal design includes junction temperature monitoring via calibrated diode input, low-power sleep modes with selective retention, and brown-out detection thresholds configurable for VDDD (2.7 V/3.0 V) and VCCD (1.1 V) rails.
CYT4DNJBJCQ1BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBJCQ1BZSGS FAQ
1.How can I place an order for CYT4DNJBJCQ1BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBJCQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBJCQ1BZSGS reliable?
The price and inventory of CYT4DNJBJCQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBJCQ1BZSGS is usually 5 days.
3.What payment methods are accepted for CYT4DNJBJCQ1BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBJCQ1BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBJCQ1BZSGS?
CYT4DNJBJCQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBJCQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBJCQ1BZSGS?
For technical support, including CYT4DNJBJCQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBJCQ1BZSGS requirements.
6.How does Aetrix verify that CYT4DNJBJCQ1BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBJCQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBJCQ1BZSGS meets industry standards.
7.What is the process for return or replacement of CYT4DNJBJCQ1BZSGS?
All CYT4DNJBJCQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBJCQ1BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBJCQ1BZSGS part is unused and in its original packaging.
Return procedure for CYT4DNJBJCQ1BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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