Infineon Technologies CYT4DNJBJCQ1BZSGST
- Part No.:
- CYT4DNJBJCQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBJCQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:

- Shipping:

Inventory:4,700
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Product details
Overview
CYT4DNJBJCQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ CPU, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880 × 1080 @ 220 MHz), and JPEG decoding for HUD and instrument cluster applications.
For engineers reviewing the CYT4DNJBJCQ1BZSGST datasheet, CYT4DNJBJCQ1BZSGST pinout, CYT4DNJBJCQ1BZSGST application, or CYT4DNJBJCQ1BZSGST equivalent, key selection criteria include dual-core deterministic real-time execution, ASIL-B functional safety compliance, on-the-fly display warping, secure boot with eSHE/HSM, and multi-display video output capability with MIPI CSI-2 capture support.
Technical Context
The CYT4DNJBJCQ1BZSGST implements a heterogeneous multi-CPU architecture: two lockstep-capable Cortex®-M7 cores handle primary application and graphics rendering tasks, while the Cortex®-M0+ manages peripheral control, security services, and low-power state coordination. Hardware inter-processor communication enables deterministic message passing without software overhead.
Its graphics subsystem integrates a command sequencer, drawing engine, composition engine, and display timing generator - all operating without frame buffers via direct video feed-through. The crypto engine supports AES-128/192/256, SHA-256/512, RSA/ECC, and GCM mode, with SECDED ECC applied to flash, SRAM, and TCM for ASIL-B compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+, enabling real-time separation of safety-critical and application workloads |
| Memory | 6336-KB code-flash (RWW, dual-bank), 640-KB SRAM with retention granularity control, 4096-KB dedicated VRAM |
| Graphics Output | FPD-Link dual interface supporting 2880 × 1080 @ 220 MHz for wide-HD HUD projection with on-the-fly warping |
| Video Capture | Two-/four-lane MIPI CSI-2 (1920 × 720 @ 110 MHz / 2880 × 1080 @ 220 MHz) plus ITU-656 and parallel RGB/YUV input paths |
| Networking | Four CAN FD channels (ISO 11898-1:2015 compliant, up to 8 Mbps), IEEE-802.3az Gigabit Ethernet MAC with RGMII/MII/RMII PHY support |
| Security | eSHE/HSM crypto engine with AES-256, SHA-512, RSA-4096, ECC NIST P-384, TRNG, and SECDED ECC on all safety-critical memories |
| Functional Safety | ASIL-B certified with SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, CSV, and hardware error correction across memory subsystems |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8-mm pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1-V regulated core supply with independent brown-out detection at 2.7 V / 3.0 V thresholds |
| GPIO_SMC[0..5] | Stepper motor control I/O | Hardware-accelerated ZPD and slew rate control for 6 stepper motor channels |
| MIPI_CSI2_CLK_P/N | Differential clock input | Supports two- or four-lane MIPI CSI-2 video capture up to 220 MHz lane rate |
| FPD_LINK_DUAL[0..11] | Dual-channel FPD-Link data lanes | Enables simultaneous wide-HD output to two displays (e.g., cluster + HUD) without external buffer |
| ETH_RGMII_TXD[0..3]/TX_CTL/TX_CLK | Gigabit Ethernet RGMII transmit | IEEE-802.3az-compliant 1000BASE-T interface with AVB (IEEE-802.1Qav) and PTP (IEEE-1588) support |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Real-time geometric correction for HUD projection onto curved windshields without frame buffer latency |
| Dual-display direct feed-through | Simultaneous pixel streaming from MIPI CSI-2 capture to FPD-Link outputs with overlay compositing |
| Secure boot with fast authentication | Digital signature verification using ECC-P384 and SHA-256 in <50 ms, enabling OTA firmware updates |
| ASIL-B hardware safety mechanisms | Integrated SMPU, PPU, and SECDED ECC on flash/SRAM/TCM - no external safety monitor required |
| Low-power deep-sleep wake-up | 81 GPIO pins configurable as Deep Sleep wakeup sources with per-pin event recognition bit |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Digital gauge rendering with animated speedometers, warning indicators, and ADAS overlays in automotive dashboards. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant GUI stack while managing CAN FD telemetry and SPI-driven TFT timing. Use Value: Dual Cortex-M7 cores enable concurrent rendering and sensor fusion; 4096-KB VRAM eliminates external graphics memory, reducing BOM cost and EMI. | Use Scenario: Projection of navigation, speed, and ADAS alerts onto vehicle windshield with distortion compensation. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and alpha-blended layer composition before FPD-Link transmission. Use Value: On-the-fly warping engine avoids frame buffering delay; dual FPD-Link output supports HUD + secondary display without external switch. |
| Multi-Camera ADAS Gateway | Audio-Video Bridging (AVB) Node |
Use Scenario: Aggregation and preprocessing of front/rear/side camera feeds for surround-view systems. IC Role / Device Role / Timing Role: MIPI CSI-2 receiver with hardware de-interleaving and JPEG decode acceleration feeding composited output to display or Ethernet. Use Value: Four-lane MIPI CSI-2 (2880 × 1080 @ 220 MHz) and JPEG decoder offload host CPU; ASIL-B safety ensures reliable camera fail-safe behavior. | Use Scenario: Time-synchronized audio/video streaming across vehicle infotainment network using IEEE-1588 PTP. IC Role / Device Role / Timing Role: Gigabit Ethernet MAC with IEEE-802.1AS timestamping and Qav traffic shaping for deterministic AVB packet delivery. Use Value: Hardware-accelerated PTP timestamp insertion and AVB queue management eliminate software jitter; RGMII interface enables direct PHY connection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex-M7 (320 MHz), no integrated graphics engine, 4 MB flash, 2 MB SRAM, supports CAN FD and Ethernet but lacks MIPI CSI-2 or FPD-Link | Targeted at body control and gateway functions - not suitable for HUD/instrument cluster display rendering | Select when graphics processing is handled externally or not required; better for safety-critical control-only nodes |
| Renesas RH850/U2A | Tri-core (3× 400-MHz RH850 cores), no GPU, 12 MB flash, 4 MB SRAM, supports CAN FD and Ethernet but no MIPI or display interfaces | Focused on powertrain and chassis control with high ASIL-D capability - no native display subsystem | Choose for high-integrity engine/transmission control where display functionality is absent or delegated to companion SoC |
Compared with S32K344 and RH850/U2A, CYT4DNJBJCQ1BZSGST uniquely integrates dual M7 cores, on-die 2D/2.5D graphics, MIPI CSI-2 capture, and dual FPD-Link output - making it the only option among the three capable of standalone HUD + cluster display implementation without external GPU or bridge ICs.
Availability
CYT4DNJBJCQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, multi-camera ADAS gateways, and AVB-enabled infotainment nodes requiring stable component supply across extended production lifecycles.
Supply support for CYT4DNJBJCQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D centers.
The TRAVEO™ T2G product line targets next-generation automotive human-machine interfaces, integrating high-performance compute, graphics, safety, and networking in a single chip for digital cockpits and ADAS visualization.
FAQ
What is the maximum resolution supported by the FPD-Link dual interface?
The FPD-Link dual interface supports up to 2880 × 1080 pixels at 220 MHz lane rate, enabling wide-HD output for head-up displays or dual independent displays such as instrument cluster + center console. This resolution is achieved using four differential pairs per channel with embedded clock recovery and automatic skew compensation.
Does CYT4DNJBJCQ1BZSGST support secure over-the-air (OTA) firmware updates?
Yes - it supports fast secure boot with digital signature verification using ECC-P384 and SHA-256, completing authentication in under 50 ms. Combined with Read-While-Write flash and dual-bank operation, this enables atomic, rollback-safe OTA updates without interrupting real-time operation.
How many MIPI CSI-2 lanes does the device support, and what is the maximum capture resolution?
The device supports two- or four-lane MIPI CSI-2 configurations. At four lanes, it captures up to 2880 × 1080 @ 220 MHz (total bandwidth ~1.9 Gbps), sufficient for high-resolution surround-view cameras. Lane count and data rate are configured per interface instance via register settings in the image sensor interface block.
Is the graphics subsystem capable of rendering without external frame buffers?
Yes - the graphics engine supports on-the-fly rendering directly to display interfaces using command sequencing and drawing acceleration, eliminating need for external frame buffers. This reduces system latency, PCB area, and power consumption while enabling real-time HUD warping and layer composition.
CYT4DNJBJCQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBJCQ1BZSGST FAQ
1.How can I place an order for CYT4DNJBJCQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBJCQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBJCQ1BZSGST reliable?
The price and inventory of CYT4DNJBJCQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBJCQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT4DNJBJCQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBJCQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBJCQ1BZSGST?
CYT4DNJBJCQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBJCQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBJCQ1BZSGST?
For technical support, including CYT4DNJBJCQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBJCQ1BZSGST requirements.
6.How does Aetrix verify that CYT4DNJBJCQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBJCQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBJCQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT4DNJBJCQ1BZSGST?
All CYT4DNJBJCQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBJCQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBJCQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT4DNJBJCQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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