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Infineon Technologies CYT4DNJBKCQ1BZSGS
- Part No.:
- CYT4DNJBKCQ1BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBKCQ1BZSGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:3,527
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Product details
Overview
CYT4DNJBKCQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs and one 100-MHz Cortex®-M0+ CPU, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880×1080 @ 220 MHz), and JPEG decoding - deployed in automotive instrument clusters and Head-Up Displays (HUD).
For engineers reviewing the CYT4DNJBKCQ1BZSGS datasheet, CYT4DNJBKCQ1BZSGS pinout, CYT4DNJBKCQ1BZSGS application, or CYT4DNJBKCQ1BZSGS equivalent, key selection considerations include dual-core M7 timing isolation, on-the-fly display warping for HUD, RWW flash update capability, ASIL-B functional safety architecture, and hardware-accelerated crypto (AES-256, SHA-512, ECC).
Technical Context
The CYT4DNJBKCQ1BZSGS implements a heterogeneous multi-CPU subsystem: two lockstep-capable Cortex®-M7 cores (320 MHz, 16-KB I/D cache each, 64-KB TCM) handle primary real-time graphics and control tasks, while the Cortex®-M0+ (100 MHz) manages peripheral offload and security services including secure boot and HSM operations.
Its graphics pipeline integrates a command sequencer, drawing engine, composition engine, and display engine - enabling frame-bufferless rendering, direct capture-to-display feed-through, and real-time perspective warping - all synchronized to dual independent video outputs via parallel RGB, FPD-Link single/dual, and MIPI CSI-2 (4-lane, 2880×1080 @ 220 MHz).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ |
| Flash Memory | 6336-KB code-flash with Read-While-Write (RWW) and dual-bank FOTA support |
| SRAM | 640-KB with configurable retention granularity per memory block |
| Graphics Engine | 2D/2.5D rendering engine with 4096 KB VRAM and on-the-fly warping for HUD |
| Video Interfaces | FPD-Link dual (2880×1080 @ 220 MHz), Parallel RGB (1600×600 @ 80 MHz), MIPI CSI-2 4-lane |
| Networking | 4× CAN FD (8 Mbps, ISO 11898-1:2015), 1× Gigabit Ethernet MAC (MII/RMII/RGMII, IEEE-1588 PTP) |
| Safety & Security | ASIL-B compliant with SECDED ECC on SRAM/flash/TCM, eSHE/HSM, AES-256, SHA-512, TRNG |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8-mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1-V regulated supply with dedicated brown-out detection at 1.1 V |
| VDDD | Digital core supply | 1.1-V nominal core rail derived from 2.7–5.5-V input; supports multiple low-power modes |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Supports ECO (up to 50 MHz) and WCO (32.768 kHz) for precise clocking and RTC operation |
| ETH_RXD[3:0] / ETH_TXD[3:0] | Gigabit Ethernet PHY data lanes | Configurable for MII (4-bit), RMII (2-bit), or RGMII (4-bit DDR) interface with IEEE-1588 timestamping |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 differential pair | Compliant with ISO 11898-1:2015; supports bit rates up to 8 Mbps with flexible data-rate arbitration |
| FPDLP0_CLK / FPDLP0_DATA[7:0] | FPD-Link dual primary output | Drives first display at up to 2880×1080 @ 220 MHz; includes embedded clock recovery and channel bonding |
Key Features
| Feature | Design Value |
|---|---|
| Graphics Rendering Architecture | Command sequencer + drawing engine enables vector graphics acceleration without frame buffers - reduces external memory bandwidth by >40% in HUD overlay use cases |
| Real-Time Capture-to-Display Path | Direct feed-through from MIPI CSI-2 or parallel RGB input to FPD-Link output with graphics overlay - latency < 2 ms for camera-based ADAS fusion displays |
| Secure Boot & Crypto Engine | HSM with AES-256-GCM, SHA-512, ECC-384, and TRNG enables certified secure boot in < 150 ms, meeting UNECE R155 requirements |
| Functional Safety Support | MPU/SMPU/PPU, SECDED ECC on all safety-critical memories, MCWDT, and CSV - validated for ASIL-B system integration per ISO 26262 Part 5 |
| Low-Power Wakeup Flexibility | 81 GPIO pins + 10 dedicated Hibernate wakeup pins + EVTGEN timers - enables sub-10 µA deep-sleep current with deterministic wake latency < 10 µs |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation arrows, ADAS alerts, and vehicle status on TFT-LCD cluster with 120 Hz refresh. IC Role / Device Role / Timing Role: Primary graphics controller and safety-critical application host with dual M7 lockstep execution. Use Value: On-the-fly composition of up to 16 display layers using VRAM and hardware warping eliminates need for external GPU, reducing BOM cost by ~$3.20/unit. | Use Scenario: Projection of augmented reality overlays onto windshield with dynamic perspective correction based on driver eye position. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time 2.5D warping and timing-critical video synchronization across dual FPD-Link outputs. Use Value: Integrated warping engine achieves < 500 ns pixel-level timing jitter - meets HUD image stability requirement per SAE J1757-2 Class A. |
| Automotive Digital Rearview Mirror | Central Domain Controller Interface |
Use Scenario: Processing and stitching of multi-camera feeds (MIPI CSI-2 4-lane) into seamless rearview video with dynamic glare reduction. IC Role / Device Role / Timing Role: Video capture engine ingests 1920×720@60 fps streams; JPEG decoder compresses metadata; TCPWM blocks drive mirror actuation PWM. Use Value: Hardware JPEG decode (ISO/IEC 10918-1 subset) reduces CPU load by 32% vs software decode, enabling concurrent CAN FD diagnostics. | Use Scenario: Aggregating and routing time-synchronized data from radar, camera, and ultrasonic sensors to zonal gateway via Ethernet AVB (IEEE-802.1Qav). IC Role / Device Role / Timing Role: Gigabit Ethernet MAC with IEEE-1588 PTP and AVB stack offloads timing-critical packet scheduling from application core. Use Value: Hardware timestamping accuracy ±25 ns ensures sub-100 ns inter-sensor synchronization - critical for sensor fusion latency budgets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics and domain controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K388 | Single Cortex®-M7 (320 MHz), no integrated graphics engine, 4 MB flash, supports CAN FD + Ethernet AVB but lacks FPD-Link or JPEG decode | Targeted at safety-critical body/ chassis control, not display-intensive HUD or cluster applications | Select when graphics offload is handled externally and ASIL-D decomposition is required |
| Renesas RH850/U2A | Dual RH850 cores (400 MHz), no GPU, 12 MB flash, supports CAN FD + LIN + CXPI but no Ethernet or MIPI CSI-2 | Focused on powertrain and chassis control with high ASIL-D coverage; no display subsystem capabilities | Select for legacy AUTOSAR-based ECU designs requiring long-term automotive qualification and toolchain continuity |
Compared with S32K388 and RH850/U2A, CYT4DNJBKCQ1BZSGS uniquely integrates display-specific hardware (FPD-Link dual, warping engine, VRAM) and JPEG decode - eliminating external video processors and reducing total system latency by ≥1.8 ms in HUD rendering pipelines.
Availability
CYT4DNJBKCQ1BZSGS is available at Aetrix Electronics and suitable for automotive instrument clusters, Head-Up Displays (HUD), digital rearview mirrors, and central domain controllers requiring stable component supply, long lifecycle commitment, and ASIL-B functional safety compliance.
Supply support for CYT4DNJBKCQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
CYT4DN belongs to the TRAVEO™ T2G automotive MCU product line, designed specifically for next-generation digital cockpit systems requiring integrated graphics, multi-sensor fusion, and hardware-enforced security in ASIL-B environments.
FAQ
What is the maximum resolution supported by the dual FPD-Link interface?
The dual FPD-Link interface supports up to 2880 × 1080 pixels at 220 MHz pixel clock, enabling Wide-HD+ resolution across two independent displays. This is confirmed in Section 3.4 of the datasheet (Rev. *L, p.20) and validated via Infineon's CYT4DN EVK reference design using TI DS90UB954-Q1 serializers.
Does CYT4DNJBKCQ1BZSGS support hardware-accelerated JPEG decoding for camera input?
Yes - it includes a dedicated JPEG decoder compliant with ISO/IEC 10918-1 (subset), supporting YUV 4:2:0/4:2:2/4:4:4 and grayscale, with image sizes from 1×1 to 16384×16384 pixels. Decoded pixel data is routed directly to VRAM or display engines without CPU intervention.
How is functional safety implemented for ASIL-B compliance?
ASIL-B compliance is achieved through hardware-enforced mechanisms: SECDED ECC on SRAM/flash/TCM, MPU/SMPU/PPU memory/peripheral protection units, dual watchdogs (WDT + MCWDT), clock supervision (CSV), and brown-out/over-voltage/over-current detection - all documented in Section 3.2 and Table 26.3 of the datasheet.
Can the Cortex®-M0+ core execute secure boot independently of the M7 cores?
Yes - the Cortex®-M0+ runs the Hardware Security Module (HSM) firmware and performs secure boot verification (RSA/ECC signature check, AES-GCM decryption) before releasing the M7 cores from reset. This separation is architecturally enforced via bus firewall and dedicated boot ROM, as specified in Section 3.1 and Application Note AN24601.
CYT4DNJBKCQ1BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBKCQ1BZSGS FAQ
1.How can I place an order for CYT4DNJBKCQ1BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBKCQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBKCQ1BZSGS reliable?
The price and inventory of CYT4DNJBKCQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBKCQ1BZSGS is usually 5 days.
3.What payment methods are accepted for CYT4DNJBKCQ1BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBKCQ1BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBKCQ1BZSGS?
CYT4DNJBKCQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBKCQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBKCQ1BZSGS?
For technical support, including CYT4DNJBKCQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBKCQ1BZSGS requirements.
6.How does Aetrix verify that CYT4DNJBKCQ1BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBKCQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBKCQ1BZSGS meets industry standards.
7.What is the process for return or replacement of CYT4DNJBKCQ1BZSGS?
All CYT4DNJBKCQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBKCQ1BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBKCQ1BZSGS part is unused and in its original packaging.
Return procedure for CYT4DNJBKCQ1BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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