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Infineon Technologies CYT4DNJBKCQ1BZSGST

Part No.:
CYT4DNJBKCQ1BZSGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
327-LFBGA
Datasheet:
AetrixCYT4DNJBKCQ1BZSGST.pdf
Description:
TRAVEO-2 CLUST.2.5DGRAPH
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,699

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Product details

Overview

CYT4DNJBKCQ1BZSGST from Infineon is an automotive-grade 32-bit TRAVEO™ T2G microcontroller built on Arm® Cortex®-M7 dual-core (320 MHz) and Cortex®-M0+ (100 MHz) architecture, featuring integrated 2D/2.5D graphics engine, CAN FD (up to 8 Mbps), Gigabit Ethernet MAC, and hardware crypto acceleration (AES-128/192/256, SHA-256/512, ECC, RSA). It targets instrument clusters and HUD systems requiring real-time rendering, secure boot, and multi-display support up to 2880 × 1080.

For engineers reviewing the CYT4DNJBKCQ1BZSGST datasheet, CYT4DNJBKCQ1BZSGST pinout, CYT4DNJBKCQ1BZSGST application, or CYT4DNJBKCQ1BZSGST equivalent, key selection criteria include dual-M7 core timing determinism, FPD-Link dual-channel video output capability, ASIL-B functional safety compliance, JPEG decode acceleration, and RWW flash with FOTA-ready dual-bank mode.

Technical Context

The CYT4DNJBKCQ1BZSGST implements a heterogeneous multi-core subsystem: two lockstep-capable Cortex®-M7 CPUs handle primary graphics and application processing with 16-KB I/D caches and 64-KB TCM each, while the Cortex®-M0+ manages peripheral control, security services, and low-power state transitions. Inter-processor communication uses dedicated hardware mailboxes and shared memory with SMPU enforcement.

Its graphics pipeline integrates a command sequencer, drawing engine, composition engine, and display engine - enabling frameless on-the-fly rendering to dual displays without external frame buffers. Video input supports MIPI CSI-2 (2-/4-lane), ITU-R BT.656, or parallel RGB/YUV, with real-time warping for HUD optical correction.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoresDual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+, enabling real-time separation of safety-critical and graphics workloads
Graphics Memory4096 KB embedded VRAM supporting simultaneous dual-display output at up to 2880×1080 via FPD-Link dual
Communication4× CAN FD (ISO 11898-1:2015 compliant, up to 8 Mbps), 2× LIN, 2× CXPI, IEEE-802.3az Gigabit Ethernet MAC with RGMII/MII/RMII PHY support
SecurityHSM with eSHE, AES-128/192/256, SHA-256/512, ECC/RSA, TRNG, SECDED ECC on SRAM/flash/TCM, ASIL-B certified memory protection
Memory6336 KB code-flash (RWW, dual-bank FOTA), 128 KB work-flash, 640 KB SRAM with configurable retention granularity
Analog12-bit SAR ADC with 48 external channels, 1 Msps sampling, internal temp/voltage monitoring, and autonomous sequencer
Power Range2.7 V to 5.5 V operation with Hibernate, Deep Sleep, Low-power Sleep, and Active modes; BOD thresholds at 1.1 V (VCCD), 2.7/3.0 V (VDDD/VDDA_ADC)

Pinout & Package

Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3 (MSL3).

Pin/TerminalCircuit RoleDesign Meaning
VDDIO0–VDDIO7I/O Power SupplyEight independent 1.8–3.3 V I/O banks enabling mixed-voltage interface routing (e.g., 1.8 V MIPI CSI-2 + 3.3 V CAN FD)
VDDA_ADCAnalog ADC Reference3.0 V ±5 % supply for 12-bit SAR ADC; decoupling required to meet 1 Msps sampling accuracy
CLK_IN0 / CLK_IN1External Clock InputDedicated differential inputs for ECO (up to 50 MHz) or LPECO; used for clock redundancy in ASIL-B timing paths
ETH_RXD[3:0] / ETH_TXD[3:0]Gigabit Ethernet DataRGMII interface pins supporting 1000BASE-T with IEEE-1588 PTP timestamping and AVB (802.1Qav/Qbb) traffic shaping
FPD_TX0_P/N, FPD_TX1_P/NFPD-Link Differential PairsTwo independent FPD-Link lanes driving dual displays; each pair supports 220 MHz pixel clock for 2880×1080@60 Hz
CSI_D[7:0], CSI_CLK, CSI_SYNCMIPI CSI-2 Parallel InterfaceLegacy parallel camera interface supporting ITU-R BT.656 or RGB/YUV capture up to 1600×600@80 MHz

Key Features

FeatureDesign Value
On-the-fly Graphics RenderingEliminates need for external frame buffer memory by composing and outputting layers directly to FPD-Link or RGB interfaces
Dual-Channel FPD-Link OutputEnables independent drive of HUD and main cluster displays with synchronized timing and warping correction per channel
Firmware Update Over The Air (FOTA)Dual-bank flash architecture allows atomic firmware swap during runtime without system interruption or data loss
Hardware JPEG DecoderOffloads CPU by decoding ISO/IEC 10918-1 JPEG images (up to 16384×16384 px) into pixel data in YUV422/RGB formats
ASIL-B Functional Safety SupportIncludes SMPU, PPU, MCWDT, SECDED ECC on all safety-critical memories, and hardware-enforced isolation between M7 and M0+ domains

Applications

Instrument Cluster DisplayHead-Up Display (HUD)

Use Scenario: Real-time rendering of vehicle speed, RPM, ADAS alerts, and navigation overlays on TFT-LCD dashboard display.

IC Role / Device Role / Timing Role: Primary graphics controller and application processor executing AUTOSAR-compliant instrument cluster software stack.

Use Value: Dual M7 cores deliver deterministic 60 Hz UI refresh; on-the-fly rendering reduces latency to <16 ms for critical warning indicators.

Use Scenario: Projection of speed, navigation, and driver assistance data onto windshield using optical combiner and DLP/LCoS microdisplay.

IC Role / Device Role / Timing Role: HUD-specific graphics engine with real-time perspective warping and gamma correction for optical distortion compensation.

Use Value: Integrated warping engine eliminates need for external FPGA; supports dynamic focus adjustment based on driver eye position input.

Multi-Display Automotive GatewaySecure In-Vehicle Infotainment (IVI) Core

Use Scenario: Aggregation and routing of CAN FD, LIN, and Ethernet data between instrument cluster, HUD, and central domain controller.

IC Role / Device Role / Timing Role: Domain gateway MCU with time-synchronized Ethernet (IEEE-1588) and deterministic CAN FD message scheduling.

Use Value: Hardware timestamping and AVB QoS enable sub-100 µs jitter for audio/video streaming across multiple displays.

Use Scenario: Secure boot and runtime authentication of IVI applications, including media playback, voice assistant, and OTA update services.

IC Role / Device Role / Timing Role: Root-of-trust execution environment with HSM-managed key storage and encrypted SMIF XIP from external flash.

Use Value: AES-GCM encryption enables authenticated decryption of firmware images during boot, preventing unauthorized code injection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive graphics and domain controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344Single Cortex®-M7 core (320 MHz), no integrated graphics engine, 2× CAN FD, no FPD-Link, 2 MB flashTargeted at body control and gateway functions - lacks HUD-specific warping and dual-display outputSelect when graphics offload is handled externally or not required; lower BOM cost but higher system-level integration effort
Renesas RH850/U2A32-bit RXv3 core (400 MHz), no Arm architecture, no hardware JPEG decoder, 1× CAN FD, no Ethernet MACFocused on powertrain and chassis control; lacks multimedia interfaces and ASIL-B-certified graphics pipelinePrefer for legacy AUTOSAR powertrain ECUs where graphics and Ethernet are irrelevant; not suitable for HUD/instrument cluster convergence

Compared with S32K344 and RH850/U2A, CYT4DNJBKCQ1BZSGST uniquely integrates dual-M7 graphics processing, FPD-Link dual output, and ASIL-B-certified JPEG decode - making it the only option among the three capable of standalone HUD + cluster dual-display implementation without external ASICs.

Availability

CYT4DNJBKCQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, domain gateways, and secure IVI systems requiring stable component supply, long lifecycle commitment, and ASIL-B functional safety certification.

Supply support for CYT4DNJBKCQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D centers across Europe, Asia, and the Americas.

The TRAVEO™ T2G product line was designed specifically for next-generation automotive human-machine interfaces, integrating graphics, networking, and functional safety into a single SoC to replace multi-chip instrument cluster and HUD architectures.

FAQ

What is the maximum resolution supported by the FPD-Link dual interface?

The FPD-Link dual interface supports up to 2880 × 1080 pixels at 60 Hz with a 220 MHz pixel clock. This enables simultaneous drive of two high-definition displays - for example, a 1920 × 720 HUD and a 2880 × 1080 main cluster - using separate lanes with independent timing and warping control.

Does CYT4DNJBKCQ1BZSGST support secure boot with public-key verification?

Yes. It implements fast secure boot using digital signature verification with asymmetric cryptography (RSA/ECC) via its hardware crypto engine. Public keys are stored in one-time-programmable (OTP) memory, and signature validation occurs before any user code execution, ensuring chain-of-trust integrity from reset vector.

Can the JPEG decoder process images larger than 4096 × 4096 pixels?

Yes. The hardware JPEG decoder supports image dimensions from 1 × 1 up to 16384 × 16384 pixels, conforming to ISO/IEC 10918-1. It handles YUV444/422/420/411 subsampling and outputs decoded pixel data directly to VRAM or SRAM for overlay composition without CPU intervention.

How many CAN FD channels are implemented, and what is their physical layer compatibility?

CYT4DNJBKCQ1BZSGST integrates four fully independent CAN FD controllers compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0. Each channel supports data rates up to 8 Mbps (dependent on transceiver and topology), and all are certified to ISO 16845:2015 conformance test requirements.

CYT4DNJBKCQ1BZSGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
327-LFBGA
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 320MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
168
Program Memory Size:
6.19MB (6.19M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 48x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT4DNJBKCQ1BZSGST FAQ

1.How can I place an order for CYT4DNJBKCQ1BZSGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT4DNJBKCQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT4DNJBKCQ1BZSGST reliable?

The price and inventory of CYT4DNJBKCQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBKCQ1BZSGST is usually 5 days.

3.What payment methods are accepted for CYT4DNJBKCQ1BZSGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBKCQ1BZSGST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT4DNJBKCQ1BZSGST?

CYT4DNJBKCQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT4DNJBKCQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT4DNJBKCQ1BZSGST?

For technical support, including CYT4DNJBKCQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBKCQ1BZSGST requirements.

6.How does Aetrix verify that CYT4DNJBKCQ1BZSGST is sourced from the original manufacturer or authorized distributors?

All CYT4DNJBKCQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBKCQ1BZSGST meets industry standards.

7.What is the process for return or replacement of CYT4DNJBKCQ1BZSGST?

All CYT4DNJBKCQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBKCQ1BZSGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT4DNJBKCQ1BZSGST part is unused and in its original packaging.

Return procedure for CYT4DNJBKCQ1BZSGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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