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Infineon Technologies CYT4DNJBLCQ1BZSGST

Part No.:
CYT4DNJBLCQ1BZSGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
327-LFBGA
Datasheet:
AetrixCYT4DNJBLCQ1BZSGST.pdf
Description:
TRAVEO-2 CLUST.2.5DGRAPH
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,403

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Product details

Overview

CYT4DNJBLCQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ security core, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880×1080 @ 220 MHz), and JPEG decoding - deployed in automotive instrument clusters and HUD systems.

For engineers reviewing the CYT4DNJBLCQ1BZSGST datasheet, CYT4DNJBLCQ1BZSGST pinout, CYT4DNJBLCQ1BZSGST application, or CYT4DNJBLCQ1BZSGST equivalent, key selection criteria include dual-core deterministic real-time execution, ASIL-B functional safety compliance, on-the-fly display warping for HUD, secure boot with eSHE/HSM, and multi-interface video capture (MIPI CSI-2 up to 4-lane) and output.

Technical Context

The CYT4DNJBLCQ1BZSGST implements a heterogeneous multi-core architecture: two lock-step-capable Cortex®-M7 cores handle primary graphics and control tasks with 16-KB I/D caches and 64-KB TCM each, while the Cortex®-M0+ manages peripheral offload, crypto acceleration, and secure boot verification. Hardware inter-processor communication enables deterministic message passing between domains.

Its graphics subsystem includes a composition engine, drawing engine, command sequencer, and display timing generator - all operating without frame buffers via direct video feed-through from MIPI CSI-2 or parallel RGB capture to dual FPD-Link outputs. The crypto engine supports AES-128/192/256, SHA-256/512, ECC, RSA, and GCM authenticated encryption with SECDED ECC on flash, SRAM, and TCM.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+
Memory6336-KB code-flash (RWW, dual-bank), 640-KB SRAM (retention-granular)
Graphics Engine2D/2.5D rendering, 4096 KB VRAM, on-the-fly warping, no frame buffer required
Video I/OFPD-Link dual (2880×1080 @ 220 MHz), MIPI CSI-2 4-lane (1920×720 @ 110 MHz)
Networking4× CAN FD (8 Mbps), 1× Gigabit Ethernet MAC (MII/RMII/RGMII), IEEE-1588 PTP support
Safety & SecurityASIL-B compliant, eSHE/HSM, secure boot with digital signature, SECDED ECC on all safety-critical memories
Power Range2.7 V to 5.5 V operation; Deep Sleep, Hibernate, and Low-power Active modes with configurable BOD thresholds

Pinout & Package

Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8-mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
VDDA_ADCAnalog supply for ADC1.1-V regulated input; supports 12-bit SAR ADC sampling at 1 Msps with internal temperature/bandgap monitoring
GPIO_SMC[0..5]Stepper motor control I/ODirect interface to stepper drivers; supports ZPD and slew rate control for precise motor positioning
MIPI_CSI2_CLK_P/NDifferential clock inputAccepts 110–220 MHz differential clock for 2-/4-lane MIPI CSI-2 video capture
FPD_LINK0_TX0_P/NFPD-Link differential outputFirst lane of dual FPD-Link interface driving high-resolution HUD displays up to 2880×1080
ETH_MDIO / ETH_MDCEthernet management interfaceIEEE-802.3-compliant MDIO/MDC pair for PHY configuration and status monitoring
SWDIO / SWCLKSerial Wire Debug interface2-pin debug port supporting full ETM instruction/data trace and secure firmware update

Key Features

FeatureDesign Value
Dual-core deterministic executionTwo Cortex®-M7 cores with hardware inter-processor messaging enable time-critical HUD rendering and cluster UI logic in parallel
On-the-fly display warpingReal-time geometric correction applied during video feed-through - eliminates need for external GPU or frame buffer memory
Secure boot with eSHE/HSMHardware-enforced authentication using ECDSA signatures and AES-GCM decryption prevents unauthorized firmware execution
Multi-protocol serial connectivity12 reconfigurable SCBs support simultaneous UART/I²C/SPI across instrument cluster peripherals, sensors, and infotainment bridges
ASIL-B functional safety architectureMPU, SMPU, PPU, MCWDT, and SECDED ECC on flash/SRAM/TCM satisfy ISO 26262 requirements without software overhead

Applications

Automotive Instrument ClusterHead-Up Display (HUD)

Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD dashboards with animated transitions.

IC Role / Device Role / Timing Role: Primary application processor executing cluster GUI stack, managing CAN FD bus telemetry, and synchronizing display updates via PWM-controlled backlight dimming.

Use Value: Dual M7 cores deliver deterministic sub-10-ms frame latency; integrated graphics engine eliminates external display controller, reducing BOM cost and PCB area.

Use Scenario: Projection of speed, warnings, and AR navigation onto windshield with dynamic perspective correction based on driver eye position.

IC Role / Device Role / Timing Role: Graphics subsystem performs real-time warping and overlay composition directly from camera feed or map data, synchronized to vehicle motion sensors.

Use Value: On-the-fly warping engine avoids frame buffering and external FPGA, enabling compact HUD ECU design with <50-ms end-to-end latency.

Automotive Digital Rearview MirrorCentral Domain Controller Interface

Use Scenario: Processing wide-angle camera input (MIPI CSI-2 4-lane) and rendering mirrored video with dynamic contrast enhancement and blind-spot highlighting.

IC Role / Device Role / Timing Role: Video capture engine ingests 1920×720@60fps, JPEG decoder decompresses metadata overlays, and graphics engine composites UI elements onto live feed.

Use Value: Integrated MIPI CSI-2 + JPEG decode + composition eliminates need for companion SoC, lowering power and thermal load in mirror housing.

Use Scenario: Aggregating and routing sensor data (CAN FD, LIN, CXPI), audio streams (TDM/PCM), and Ethernet AVB traffic between zonal ECUs in SDV architectures.

IC Role / Device Role / Timing Role: Central protocol bridge with hardware-accelerated packet filtering, timestamping (IEEE-1588), and QoS scheduling for time-sensitive AVB streams.

Use Value: Single-chip integration of 4× CAN FD, 2× LIN, 2× CXPI, and Gigabit Ethernet reduces inter-ECU wiring complexity and meets ASIL-B domain controller requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive graphics and domain controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344Single Cortex®-M7 core (320 MHz), no integrated graphics engine, 4 MB flash, supports CAN FD/Ethernet but lacks MIPI CSI-2 or FPD-LinkTargeted at gateway and motor control - not suitable for HUD/instrument cluster display renderingSelect when graphics acceleration is unnecessary and functional safety focus is on control-loop determinism over visual processing
Renesas R-Car H3ARM Cortex-A57/A53 quad-core, PowerVR GPU, 8 GB DDR4 support, Linux-capable - significantly higher power and thermal envelopeDesigned for infotainment head units, not ASIL-B-certified instrument clusters or HUDsSelect only for full-featured IVI systems requiring Android/Linux; not viable for safety-critical cluster or HUD due to certification scope and power constraints

Compared with NXP S32K344 and Renesas R-Car H3, CYT4DNJBLCQ1BZSGST uniquely delivers ASIL-B-certified dual M7 performance with on-die graphics, video I/O, and security - enabling compact, low-power, safety-compliant instrument clusters and HUDs without external GPUs or companion processors.

Availability

CYT4DNJBLCQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, Head-Up Displays (HUD), digital rearview mirrors, and central domain controllers requiring stable component supply, long lifecycle support, and ASIL-B compliance.

Supply support for CYT4DNJBLCQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D centers.

The TRAVEO™ T2G product line targets automotive human-machine interface (HMI) systems, delivering integrated graphics, real-time control, and functional safety in a single chip for instrument clusters, HUDs, and digital mirrors.

FAQ

What is the maximum resolution supported by the dual FPD-Link interface?

The dual FPD-Link interface supports up to 2880 × 1080 pixels at 220 MHz pixel clock, enabling Wide-HD+ resolution for automotive HUD applications with minimal latency. This capability is verified in the device's graphics subsystem specification and validated through Infineon's TRAVEO™ T2G evaluation platform timing analysis.

Does CYT4DNJBLCQ1BZSGST support secure over-the-air (OTA) firmware updates?

Yes - it supports Firmware Update Over The Air (FOTA) via dual-bank flash architecture with Read-While-Write capability, enabling seamless background updates without system interruption. Secure boot verifies digital signatures using ECDSA and AES-GCM before execution, ensuring only authenticated firmware runs.

Can the MIPI CSI-2 interface accept raw Bayer data from automotive image sensors?

Yes - the MIPI CSI-2 receiver supports 2- and 4-lane configurations with programmable data types including RAW-8/10/12, YUV422, and RGB, enabling direct ingestion of Bayer-pattern output from CMOS image sensors used in surround-view and rearview camera systems.

Is the JPEG decoder capable of real-time decoding for video overlay use cases?

Yes - the hardware JPEG decoder processes images up to 16384 × 16384 pixels with sub-frame latency, supporting real-time overlay of icons, warnings, and navigation glyphs onto live video feeds. Throughput is sufficient for 60 fps overlay rendering at 1920 × 720 resolution in typical HUD use cases.

CYT4DNJBLCQ1BZSGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
327-LFBGA
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 320MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
168
Program Memory Size:
6.19MB (6.19M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 48x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT4DNJBLCQ1BZSGST FAQ

1.How can I place an order for CYT4DNJBLCQ1BZSGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT4DNJBLCQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT4DNJBLCQ1BZSGST reliable?

The price and inventory of CYT4DNJBLCQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBLCQ1BZSGST is usually 5 days.

3.What payment methods are accepted for CYT4DNJBLCQ1BZSGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBLCQ1BZSGST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT4DNJBLCQ1BZSGST?

CYT4DNJBLCQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT4DNJBLCQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT4DNJBLCQ1BZSGST?

For technical support, including CYT4DNJBLCQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBLCQ1BZSGST requirements.

6.How does Aetrix verify that CYT4DNJBLCQ1BZSGST is sourced from the original manufacturer or authorized distributors?

All CYT4DNJBLCQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBLCQ1BZSGST meets industry standards.

7.What is the process for return or replacement of CYT4DNJBLCQ1BZSGST?

All CYT4DNJBLCQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBLCQ1BZSGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT4DNJBLCQ1BZSGST part is unused and in its original packaging.

Return procedure for CYT4DNJBLCQ1BZSGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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