My Inquiry
My Account
Infineon Technologies CYT4DNJBNCQ1BZSGS
- Part No.:
- CYT4DNJBNCQ1BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBNCQ1BZSGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:2,420
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT4DNJBNCQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ CPU, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096-KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), and dual FPD-Link for HUD and instrument cluster display systems.
For engineers reviewing the CYT4DNJBNCQ1BZSGS datasheet, CYT4DNJBNCQ1BZSGS pinout, CYT4DNJBNCQ1BZSGS application, or CYT4DNJBNCQ1BZSGS equivalent, key selection criteria include dual-core deterministic real-time performance, ASIL-B functional safety compliance, on-the-fly JPEG decoding, hardware-accelerated graphics composition, and secure boot with eSHE/HSM support.
Technical Context
The CYT4DNJBNCQ1BZSGS implements a heterogeneous multi-CPU architecture: two lockstep-capable Cortex®-M7 cores for primary application processing and a dedicated Cortex®-M0+ core for peripheral management and security services. Inter-processor communication is handled via hardware mailbox and shared memory with SMPU enforcement.
Its graphics subsystem includes a command sequencer, drawing engine, composition engine, and display engine - enabling frame-bufferless rendering to dual displays (FPD-Link dual at 2880×1080@220 MHz) with real-time warping for HUD optical correction. The crypto engine delivers AES-128/192/256, SHA-256/512, RSA/ECC, and TRNG with SECDED ECC on all safety-critical memories.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+, each with MPU and cache |
| Memory | 6336-KB code-flash (RWW, dual-bank), 128-KB work-flash, 640-KB SRAM with retention control |
| Graphics Engine | 2D/2.5D rendering with 4096-KB VRAM; supports on-the-fly warping and direct capture-to-display feed |
| Communication | 4× CAN FD (8 Mbps), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 1× Gigabit Ethernet MAC (MII/RMII/RGMII) |
| Security | eSHE/HSM crypto engine: AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, SECDED ECC on flash/SRAM/TCM |
| Safety | ASIL-B compliant: SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, CSV, hardware error correction |
| Package | 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8-mm pitch |
Pinout & Package
Package: 327-ball BGA (17 mm × 17 mm × 1.70 mm, 0.8-mm pitch), RoHS-compliant, automotive-grade (AEC-Q100 Grade 2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O power supply banks | Eight independent 1.8-V/3.3-V I/O voltage domains supporting mixed-voltage interface operation |
| VDDD/VDDA_ADC | Digital/analog core supply | 1.1-V nominal core rail with dual BOD thresholds (2.7 V / 3.0 V); 1.1-V ADC reference with dedicated BOD |
| XTAL_IN/XTAL_OUT | External crystal oscillator input/output | Supports 1–60 MHz ECO; enables precise clock sourcing for CAN FD timing and AVB synchronization |
| ETH_RXD0–ETH_RXD3, ETH_TXD0–ETH_TXD3 | Gigabit Ethernet PHY interface | RGMII-compliant 8-bit data lanes for deterministic low-latency AVB/PTP traffic handling |
| FPD_LCLK, FPD_LDATA[0:7], FPD_RCLK, FPD_RDATA[0:7] | Dual FPD-Link video output | Two independent 8-bit LVDS channels supporting simultaneous Wide-HD (2880×1080) HUD + cluster displays |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Lockstep-capable M7 cores with shared TCM enable ASIL-B real-time control without software redundancy overhead |
| Frame-bufferless graphics pipeline | Command sequencer + drawing engine render directly to dual FPD-Link outputs - eliminates external DRAM dependency |
| Secure over-the-air update | Dual-bank flash + RWW + HSM-verified signature validation enable atomic, rollback-safe FOTA in production vehicles |
| Hardware-accelerated JPEG decode | On-chip decoder processes ISO/IEC 10918-1 JPEG up to 16384×16384 pixels into RGB/YUV for HUD icon overlays |
| AVB/PTP-ready Ethernet | IEEE-802.1AS/1Qav/1Qbb and IEEE-1588 PTP support enable time-synchronized audio/video streaming across vehicle networks |
Applications
| Instrument Cluster Display | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, navigation, ADAS alerts, and vehicle status on TFT-LCD clusters with <100-ms latency. IC Role / Device Role / Timing Role: Primary application processor with dual M7 cores executing AUTOSAR Classic + graphics middleware. Use Value: Dual FPD-Link output drives primary cluster and secondary rear-seat display simultaneously at 1920×720@60 Hz. | Use Scenario: Optical projection of speed, ADAS warnings, and navigation cues onto windshield with dynamic perspective correction. IC Role / Device Role / Timing Role: Graphics subsystem performs on-the-fly warping and overlay composition using internal VRAM and command sequencer. Use Value: Eliminates need for external FPGA or GPU; warping executed in real time without frame buffering. |
| Automotive Gateway with AVB | Digital Cockpit Domain Controller |
Use Scenario: Time-synchronized bridging of CAN FD, LIN, and Ethernet domains for infotainment, ADAS, and body control networks. IC Role / Device Role / Timing Role: Gigabit Ethernet MAC with IEEE-1588 PTP and AVB stack offload handles deterministic audio/video transport. Use Value: Hardware timestamping and traffic shaping reduce jitter to <1 μs - meets IEEE-802.1AS Class A requirements. | Use Scenario: Consolidation of instrument cluster, HUD, and rear-seat entertainment onto single SoC platform with isolated execution environments. IC Role / Device Role / Timing Role: Cortex®-M0+ enforces security boundaries while M7 cores run RTOS partitions with SMPU-protected memory regions. Use Value: eSHE/HSM enables certified secure boot and runtime attestation per UNECE R155/R156 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive display controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 core (320 MHz), no integrated graphics engine, 4 MB flash, 2 MB SRAM | Targeted at gateway/centralized control - lacks VRAM, JPEG decode, and FPD-Link interfaces | Select when display functionality is handled externally or not required; better for pure CAN FD/LIN routing with ASIL-D support. |
| Renesas RH850/U2A | 32-bit RXv3 core (400 MHz), 8 MB flash, no hardware graphics acceleration, no Ethernet MAC | Focused on powertrain and chassis control - no video I/O, no JPEG decode, no AVB/PTP capability | Select for high-integrity motor control where display integration is unnecessary and legacy toolchain compatibility is critical. |
Compared with S32K344 and RH850/U2A, CYT4DNJBNCQ1BZSGS uniquely integrates dual-display video output, on-the-fly graphics warping, and AVB-ready Ethernet - making it purpose-built for HUD + cluster consolidation without external co-processors.
Availability
CYT4DNJBNCQ1BZSGS is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, digital cockpit gateways, and AVB-enabled domain controllers requiring stable component supply across extended vehicle lifecycles.
Supply support for CYT4DNJBNCQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line targets next-generation automotive human-machine interfaces, delivering integrated graphics, real-time control, and functional safety in a single chip for instrument clusters and HUD systems.
FAQ
What is the maximum display resolution supported by CYT4DNJBNCQ1BZSGS?
The device supports dual FPD-Link output at up to 2880×1080@220 MHz (Wide-HD+) for simultaneous HUD and instrument cluster rendering. Parallel RGB supports 1600×600@80 MHz, and single FPD-Link supports 1920×720@110 MHz. All interfaces operate without external frame buffers.
Does CYT4DNJBNCQ1BZSGS support secure boot with cryptographic verification?
Yes - it implements fast secure boot using digital signature verification via its integrated Hardware Security Module (HSM) and Enhanced Secure Hardware Extension (eSHE). Supported algorithms include ECDSA with NIST P-256 and SHA-256, enabling UNECE R155/R156-compliant firmware authentication.
Can the CYT4DNJBNCQ1BZSGS execute code directly from external flash memory?
Yes - the Serial Memory Interface (SMIF) supports Execute-In-Place (XIP) from external octal SPI or xSPI flash. On-the-fly AES-256 decryption is applied during fetch, allowing secure execution of encrypted firmware images stored off-chip.
What functional safety certifications apply to CYT4DNJBNCQ1BZSGS?
The part is designed to meet ASIL-B per ISO 26262:2018, with hardware safety mechanisms including SMPU, PPU, MCWDT, SECDED ECC on flash/SRAM/TCM, and analog BOD/LVD/OVD/OCD monitoring. Certification documentation and FMEDA reports are available under NDA from Infineon.
CYT4DNJBNCQ1BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBNCQ1BZSGS FAQ
1.How can I place an order for CYT4DNJBNCQ1BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBNCQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBNCQ1BZSGS reliable?
The price and inventory of CYT4DNJBNCQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBNCQ1BZSGS is usually 5 days.
3.What payment methods are accepted for CYT4DNJBNCQ1BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBNCQ1BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBNCQ1BZSGS?
CYT4DNJBNCQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBNCQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBNCQ1BZSGS?
For technical support, including CYT4DNJBNCQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBNCQ1BZSGS requirements.
6.How does Aetrix verify that CYT4DNJBNCQ1BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBNCQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBNCQ1BZSGS meets industry standards.
7.What is the process for return or replacement of CYT4DNJBNCQ1BZSGS?
All CYT4DNJBNCQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBNCQ1BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBNCQ1BZSGS part is unused and in its original packaging.
Return procedure for CYT4DNJBNCQ1BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT4DNJBNCQ1BZSGS Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
