My Inquiry
My Account
Infineon Technologies CYT4DNJBNCQ1BZSGST
- Part No.:
- CYT4DNJBNCQ1BZSGST
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBNCQ1BZSGST.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:4,619
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYT4DNJBNCQ1BZSGST from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ CPU, 6336 KB code-flash, 640 KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), and dual FPD-Link video output (up to 2880 × 1080 @ 220 MHz), targeting instrument clusters and HUD systems.
For engineers reviewing the CYT4DNJBNCQ1BZSGST datasheet, CYT4DNJBNCQ1BZSGST pinout, CYT4DNJBNCQ1BZSGST application, or CYT4DNJBNCQ1BZSGST equivalent, key selection criteria include dual-core deterministic real-time performance, ASIL-B functional safety compliance, on-the-fly JPEG decode, hardware-accelerated graphics composition, and secure boot with eSHE/HSM support.
Technical Context
The device implements a heterogeneous multi-CPU architecture: two lockstep-capable Cortex®-M7 cores handle primary application and graphics rendering, while the Cortex®-M0+ manages peripheral control, security services, and low-power state transitions. Inter-processor communication is hardware-accelerated via dedicated mailbox and shared memory interfaces.
Graphics processing occurs in a dedicated subsystem with command sequencer, drawing engine, composition engine, and display timing generator - enabling frame-bufferless rendering directly to parallel RGB or dual FPD-Link outputs. Video capture supports MIPI CSI-2 (2/4-lane), ITU-R BT.656, and parallel RGB/YUV inputs up to 2880 × 1080.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ |
| Memory | 6336 KB code-flash (RWW, dual-bank), 640 KB SRAM (retention-configurable) |
| Graphics Engine | 2D/2.5D rendering with 4096 KB VRAM, on-the-fly warping for HUD, no frame buffer required |
| Video I/O | Dual FPD-Link (2880×1080@220 MHz), parallel RGB (1600×600@80 MHz), MIPI CSI-2 (4-lane) |
| Networking | 4× CAN FD (8 Mbps, ISO 11898-1:2015), 1× Gigabit Ethernet MAC (MII/RMII/RGMII, IEEE-1588 PTP) |
| Security | eSHE/HSM crypto engine: AES-128/192/256, SHA-256/512, RSA/ECC, TRNG, SECDED ECC on all safety-critical memories |
| Safety | ASIL-B compliant: SMPU, PPU, MCWDT, LVD/BOD/OVD/OCD, CSV, hardware error correction |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1 V ±3% regulated input; enables 12-bit SAR ADC sampling at 1 Msps with internal temperature/bandgap monitoring |
| FPD_LINK0_P/N | Differential video output lane 0 | LVDS-based high-speed serial video interface supporting 220 MHz symbol rate for Wide-HD display output |
| CANFD0_TX/RX | CAN FD channel 0 differential pair | Supports 8 Mbps data phase; requires external transceiver; compliant with ISO 11898-1:2015 physical layer requirements |
| ETH_MDIO/MDC | Ethernet management interface | Provides PHY register access and clock synchronization for IEEE-802.3az-compliant Gigabit Ethernet operation |
| JTAG_TCK/TMS/TDO/TDI | IEEE-1149.1 debug interface | Enables boundary-scan testing, flash programming, and real-time trace via Arm® SWD or JTAG with ETM support |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Two independent Cortex®-M7 cores with separate 64 KB TCM each enable time-critical HUD rendering and cluster UI logic without interference |
| Hardware-accelerated graphics pipeline | Command sequencer + drawing engine + composition engine offloads CPU from pixel-level operations, enabling real-time 2.5D warping for curved HUD projection |
| Secure boot with HSM | Hardware Security Module enforces authenticated firmware load using ECDSA signatures and AES-GCM decryption before execution begins |
| ASIL-B safety mechanisms | Shared MPU (SMPU), Peripheral Protection Unit (PPU), and SECDED ECC on flash/SRAM/TCM satisfy ISO 26262 diagnostic coverage requirements |
| Flexible power management | Five low-power modes (Hibernate to Low-power Active) with configurable BOD thresholds (2.7 V / 3.0 V on VDDD/VDDA_ADC) support extended battery-off operation in automotive gateways |
Applications
| Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Digital gauge rendering with animated speedometers, fuel indicators, ADAS alerts, and vehicle status overlays. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant UI stack and real-time graphics composition engine. Use Value: Dual M7 cores deliver deterministic frame rates >60 FPS at 1280×480 resolution; on-the-fly warping eliminates need for external GPU or frame buffer memory. | Use Scenario: Projection of speed, navigation, and collision warnings onto windshield with optical distortion compensation. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and alpha-blending of multiple layers before output to FPD-Link interface. Use Value: Dedicated 2.5D rendering engine achieves sub-millisecond latency for dynamic warping updates, critical for driver response time in AR-HUD systems. |
| Automotive Gateway | ADAS Domain Controller Interface |
Use Scenario: Aggregation and protocol translation between CAN FD, LIN, CXPI, and Ethernet networks in zonal architectures. IC Role / Device Role / Timing Role: Network hub managing time-synchronized message routing with IEEE-1588 PTP timestamping across domains. Use Value: Integrated Gigabit Ethernet MAC with RGMII and four CAN FD controllers reduce external PHY/transceiver count by ≥3 components per node. | Use Scenario: Pre-processing camera feeds (MIPI CSI-2) and sensor fusion data before forwarding to central ADAS SoC. IC Role / Device Role / Timing Role: Vision front-end processor performing JPEG decode, image scaling, and metadata tagging prior to Ethernet transport. Use Value: Hardware JPEG decoder processes 1920×1080 images in <15 ms, enabling real-time camera stream conditioning without CPU overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single Cortex®-M7 core (320 MHz), no integrated graphics engine, 4 MB flash, supports CAN FD + Ethernet AVB but lacks FPD-Link output | Targeted at body control and gateway functions only; not suitable for HUD/instrument cluster display generation | Select when display subsystem is handled externally and deterministic dual-core graphics is unnecessary |
| Renesas RH850/U2A | Tri-core lockstep architecture (3× 400 MHz), 12 MB flash, ASIL-D capable, no JPEG decode or VRAM, limited video interface support (no FPD-Link) | Focused on powertrain and chassis control; lacks multimedia acceleration and dual-display timing generators | Prefer for high-integrity motor control or braking systems where graphics and vision preprocessing are absent |
Compared with S32K344 and RH850/U2A, CYT4DNJBNCQ1BZSGST uniquely integrates dual M7 cores with hardware graphics pipeline and dual FPD-Link - making it the only option among the three that natively supports AR-HUD rendering without external ASICs or frame buffers.
Availability
CYT4DNJBNCQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, and zonal gateway modules requiring stable component supply, long-term lifecycle assurance, and ASIL-B certified silicon.
Supply support for CYT4DNJBNCQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D centers.
The TRAVEO™ T2G product line was designed specifically for next-generation automotive human-machine interfaces, integrating graphics, audio, networking, and functional safety into a single scalable platform for digital cockpits.
FAQ
What is the maximum supported resolution for dual-display output?
CYT4DNJBNCQ1BZSGST supports dual FPD-Link output at up to 2880 × 1080 pixels per display at 220 MHz symbol rate, or parallel RGB at 1600 × 600 @ 80 MHz. The graphics engine performs real-time composition and warping without frame buffers, enabling simultaneous high-resolution HUD and instrument cluster rendering.
Does this MCU support secure over-the-air (OTA) firmware updates?
Yes. CYT4DNJBNCQ1BZSGST supports Firmware Update Over The Air (FOTA) via its dual-bank flash architecture (code-flash + work-flash), RWW capability, and hardware-accelerated AES-GCM decryption. Secure boot validates ECDSA signatures before loading updated firmware into active bank.
Which video input standards does the capture engine support?
The capture engine supports ITU-R BT.656 (up to 800 × 480), parallel RGB/YUV (1600 × 600 @ 80 MHz), and MIPI CSI-2 with 2- or 4-lane configurations (1920 × 720 @ 110 MHz or 2880 × 1080 @ 220 MHz). All inputs feed directly into the graphics pipeline for overlay and composition.
Is IEEE-1588 Precision Time Protocol supported in hardware?
Yes. The integrated Gigabit Ethernet MAC includes full hardware support for IEEE-1588 PTP timestamping, including transparent clock and end-to-end delay measurement. This enables sub-microsecond time synchronization across automotive Ethernet domains for AVB-compliant audio/video streaming and sensor fusion.
CYT4DNJBNCQ1BZSGST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBNCQ1BZSGST FAQ
1.How can I place an order for CYT4DNJBNCQ1BZSGST through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBNCQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBNCQ1BZSGST reliable?
The price and inventory of CYT4DNJBNCQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBNCQ1BZSGST is usually 5 days.
3.What payment methods are accepted for CYT4DNJBNCQ1BZSGST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBNCQ1BZSGST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBNCQ1BZSGST?
CYT4DNJBNCQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBNCQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBNCQ1BZSGST?
For technical support, including CYT4DNJBNCQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBNCQ1BZSGST requirements.
6.How does Aetrix verify that CYT4DNJBNCQ1BZSGST is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBNCQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBNCQ1BZSGST meets industry standards.
7.What is the process for return or replacement of CYT4DNJBNCQ1BZSGST?
All CYT4DNJBNCQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBNCQ1BZSGST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBNCQ1BZSGST part is unused and in its original packaging.
Return procedure for CYT4DNJBNCQ1BZSGST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYT4DNJBNCQ1BZSGST Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
