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Infineon Technologies CYT4DNJBQCQ1BZSGS
- Part No.:
- CYT4DNJBQCQ1BZSGS
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 327-LFBGA
- Datasheet:
-
CYT4DNJBQCQ1BZSGS.pdf
- Description:
- TRAVEO-2 CLUST.2.5DGRAPH
- Quantity:
- Payment:
- Shipping:
Inventory:4,875
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Product details
Overview
CYT4DNJBQCQ1BZSGS from Infineon is a TRAVEO™ T2G 32-bit automotive microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs, one 100-MHz Cortex®-M0+ security core, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096 KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880 × 1080 @ 220 MHz), and JPEG decoding for HUD and digital instrument cluster applications.
For engineers reviewing the CYT4DNJBQCQ1BZSGS datasheet, CYT4DNJBQCQ1BZSGS pinout, CYT4DNJBQCQ1BZSGS application, or CYT4DNJBQCQ1BZSGS equivalent, key selection criteria include dual-core deterministic real-time performance, ASIL-B functional safety compliance, on-the-fly graphics composition without frame buffers, secure boot with eSHE/HSM, and multi-display timing support via dedicated display engine and warping hardware.
Technical Context
The device implements a heterogeneous multi-core architecture: two lock-step-capable Cortex®-M7 cores handle primary graphics and application processing, while the Cortex®-M0+ executes peripheral management, crypto offload, and secure boot verification. Hardware inter-processor communication (IPC) enables deterministic message passing between domains.
Its graphics subsystem integrates a command sequencer, drawing engine, composition engine, and display engine - enabling real-time HUD warping, direct capture-to-display video feed, and layer-based scene composition - all operating at pixel rates up to 220 MHz on dual FPD-Link outputs without external frame buffer memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+ |
| Flash Memory | 6336-KB code-flash with RWW, dual-bank FOTA support |
| SRAM | 640-KB with configurable retention granularity |
| Graphics Engine | 2D/2.5D rendering, 4096 KB embedded VRAM, on-the-fly warping & composition |
| Display Interfaces | FPD-Link dual (2880×1080 @ 220 MHz), Parallel RGB (1600×600 @ 80 MHz) |
| Video Capture | MIPI CSI-2 (2-/4-lane), ITU-656, parallel RGB/YUV input up to 2880×1080 |
| Networking | 4× CAN FD (8 Mbps), 1× Gigabit Ethernet MAC (MII/RMII/RGMII), 2× LIN, 2× CXPI |
| Safety & Security | ASIL-B compliant, SECDED ECC on flash/SRAM/TCM, eSHE/HSM, AES-128/192/256, SHA-256/512, TRNG |
Pinout & Package
Package: 327-ball BGA, 17 mm × 17 mm × 1.70 mm, 0.8-mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_ADC | Analog supply for ADC | 1.1-V regulated supply with dual BOD thresholds (2.7 V / 3.0 V) for robust analog conversion |
| VDDD | Digital core supply | 1.1-V nominal core rail derived from 2.7–5.5-V input; monitored by BOD/OVD/OCD |
| CLK_IN | External clock input | Accepts ECO or WCO crystal (1–60 MHz); feeds PLL/FLL for system clock generation |
| ETH_RXD[3:0] | Ethernet receive data | 4-bit RGMII/MII interface supporting IEEE-1588 PTP and AVB (802.1AS/Qav/Qbb) |
| CANFD0_TX | CAN FD channel 0 transmit | Differential output compliant with ISO 11898-1:2015; supports non-ISO Bosch CAN FD V1.0 |
| FPDLP0_CLK | FPD-Link clock output | 220-MHz differential clock for dual-link FPD-Link video transmission (2880×1080) |
| VRAM_A[15:0] | VRAM address bus | 16-bit multiplexed address/data bus for 4096-KB embedded video RAM access |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core deterministic execution | Two Cortex®-M7 cores with independent 64-KB TCM, cache, and MPU enable time-critical HUD rendering and safety monitoring in parallel |
| Hardware-accelerated graphics | Drawing engine + composition engine + command sequencer eliminate CPU load for vector graphics, layer blending, and real-time warping |
| Secure boot & runtime protection | eSHE/HSM with AES-GCM, SHA-512, RSA/ECC acceleration, and SECDED ECC on all safety-critical memories |
| Multi-display timing control | Dedicated display engine generates precise video timing (H/V sync, blanking) for dual independent displays without software intervention |
| Flexible low-power operation | Five power modes (Active to Hibernate); 10-pin wakeup from Hibernate; 81-GPIO wakeup from Deep Sleep with event-triggered TCPWM |
| Automotive interface integration | 4× CAN FD, 2× LIN, 2× CXPI, Gigabit Ethernet with AVB/PTP, and SMIF with XIP + on-the-fly encryption |
Applications
| Digital Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, ADAS alerts, navigation overlays, and 3D gauges on TFT-LCD clusters with <100-ms latency. IC Role / Device Role / Timing Role: Primary application processor with dual M7 cores executing AUTOSAR-compliant graphics stack and CAN FD telemetry ingestion. Use Value: On-the-fly composition engine renders layered UI elements directly to display interfaces without frame buffer memory, reducing BOM cost and latency. | Use Scenario: Projection of augmented reality navigation, speed, and collision warnings onto windshield with dynamic perspective correction. IC Role / Device Role / Timing Role: Graphics subsystem performs real-time warping and overlay compositing; display engine generates precise timing for DMD/LCoS projection drivers. Use Value: Integrated warping hardware eliminates need for external FPGA or GPU, enabling compact HUD ECU design with sub-frame latency. |
| Central Domain Controller | Infotainment Gateway |
Use Scenario: Consolidating body control, HVAC, lighting, and driver monitoring functions into single ECU with ASIL-B safety partitioning. IC Role / Device Role / Timing Role: Cortex®-M0+ handles secure peripheral arbitration and crypto services; M7 cores run RTOS partitions with SMPU/PPU-enforced isolation. Use Value: Shared memory protection unit (SMPU) and peripheral protection unit (PPU) enforce strict domain separation without hypervisor overhead. | Use Scenario: Bridging infotainment head unit (Linux/QNX) with vehicle network (CAN FD, LIN, Ethernet) for OTA updates and remote diagnostics. IC Role / Device Role / Timing Role: Gigabit Ethernet MAC with IEEE-1588 PTP synchronizes audio/video streams; SMIF with XIP loads encrypted firmware from external flash. Use Value: On-the-fly SMIF encryption/decryption secures firmware updates without CPU involvement, meeting UNECE R155 cybersecurity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K388 | Single Cortex®-M7 core (320 MHz), no integrated graphics engine, 4 MB flash, 2 MB SRAM | Lacks hardware warping/composition; requires external GPU or software rendering for HUD | Select when graphics workload is minimal and safety-critical control dominates over display complexity |
| Renesas RH850/U2A | Tri-core (RH850-G3M + dual G3KH), 200 MHz, no VRAM, no JPEG decoder, no Ethernet MAC | Optimized for motor control and powertrain; no native display interface or multimedia acceleration | Select for high-integrity powertrain or chassis control where display capability is handled by separate SoC |
Compared with S32K388 and RH850/U2A, CYT4DNJBQCQ1BZSGS uniquely integrates dual M7 cores, 4096 KB VRAM, on-the-fly warping, and Gigabit Ethernet with AVB/PTP - making it the only option among the three capable of standalone HUD + cluster + gateway functionality in a single package.
Availability
CYT4DNJBQCQ1BZSGS is available at Aetrix Electronics and suitable for automotive digital instrument clusters, head-up displays, central domain controllers, and infotainment gateways requiring stable component supply across extended production lifecycles.
Supply support for CYT4DNJBQCQ1BZSGS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.
The TRAVEO™ T2G product line targets next-generation automotive human-machine interfaces, delivering integrated graphics, networking, and functional safety in a single die for digital cockpits and ADAS visualization systems.
FAQ
What is the maximum resolution supported by the dual FPD-Link interface?
The dual FPD-Link interface supports up to 2880 × 1080 pixels at 220 MHz pixel clock, enabling Wide-HD+ resolution for dual-display configurations such as full-width digital instrument clusters with side-by-side zones or HUD + cluster pairing. This is implemented via two independent FPD-Link channels with synchronized timing generated by the dedicated display engine.
Does CYT4DNJBQCQ1BZSGS support secure over-the-air (OTA) firmware updates?
Yes. It supports FOTA via dual-bank flash architecture with Read-While-Write capability, enabling seamless background update of one bank while executing from the other. Secure boot verifies digital signatures using RSA/ECC acceleration and AES-GCM decryption of encrypted firmware images loaded via SMIF or Ethernet.
How does the graphics subsystem achieve zero-frame-buffer rendering?
The command sequencer orchestrates the drawing engine and composition engine to generate pixel data on-the-fly, feeding directly to display interfaces without intermediate frame storage. This is enabled by 4096 KB of dedicated VRAM used as streaming buffer and scratchpad, eliminating external DRAM and reducing latency for HUD warping and gauge animation.
What functional safety mechanisms are implemented for ASIL-B compliance?
ASIL-B compliance is achieved through hardware-enforced memory protection (MPU/SMPU/PPU), SECDED ECC on flash, SRAM, and TCM, redundant clock supervision (CSV), multi-counter watchdog (MCWDT), brown-out/over-voltage/over-current detection, and lock-step capable Cortex®-M7 cores with error injection testing support per ISO 26262 Part 5.
CYT4DNJBQCQ1BZSGS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 327-LFBGA
- Series:
- Traveo™ T2G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+, ARM® Cortex®-M7F
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 100MHz, 320MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, Temp Sensor, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 6.19MB (6.19M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CYT4DNJBQCQ1BZSGS FAQ
1.How can I place an order for CYT4DNJBQCQ1BZSGS through Aetrix?
Please submit a Request for Quotation (RFQ) for CYT4DNJBQCQ1BZSGS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYT4DNJBQCQ1BZSGS reliable?
The price and inventory of CYT4DNJBQCQ1BZSGS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBQCQ1BZSGS is usually 5 days.
3.What payment methods are accepted for CYT4DNJBQCQ1BZSGS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBQCQ1BZSGS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYT4DNJBQCQ1BZSGS?
CYT4DNJBQCQ1BZSGS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYT4DNJBQCQ1BZSGS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYT4DNJBQCQ1BZSGS?
For technical support, including CYT4DNJBQCQ1BZSGS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBQCQ1BZSGS requirements.
6.How does Aetrix verify that CYT4DNJBQCQ1BZSGS is sourced from the original manufacturer or authorized distributors?
All CYT4DNJBQCQ1BZSGS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBQCQ1BZSGS meets industry standards.
7.What is the process for return or replacement of CYT4DNJBQCQ1BZSGS?
All CYT4DNJBQCQ1BZSGS units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBQCQ1BZSGS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYT4DNJBQCQ1BZSGS part is unused and in its original packaging.
Return procedure for CYT4DNJBQCQ1BZSGS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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