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Infineon Technologies CYT4DNJBQCQ1BZSGST

Part No.:
CYT4DNJBQCQ1BZSGST
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
327-LFBGA
Datasheet:
AetrixCYT4DNJBQCQ1BZSGST.pdf
Description:
TRAVEO-2 CLUST.2.5DGRAPH
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,245

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Product details

Overview

CYT4DNJBQCQ1BZSGST from Infineon is an automotive-grade 32-bit TRAVEO™ T2G microcontroller featuring dual 320-MHz Arm® Cortex®-M7 CPUs and a 100-MHz Cortex®-M0+ security core, 6336-KB code-flash, 640-KB SRAM, and integrated 2D/2.5D graphics engine with 4096-KB VRAM. It supports CAN FD (up to 8 Mbps), Gigabit Ethernet (IEEE-802.3az), FPD-Link dual (2880×1080 @ 220 MHz), and JPEG decoding for HUD and digital instrument cluster applications.

For engineers reviewing the CYT4DNJBQCQ1BZSGST datasheet, CYT4DNJBQCQ1BZSGST pinout, CYT4DNJBQCQ1BZSGST application, or CYT4DNJBQCQ1BZSGST equivalent, key selection criteria include dual-core deterministic real-time performance, ASIL-B functional safety compliance, on-the-fly display warping, secure boot with eSHE/HSM, and multi-display video output with MIPI CSI-2 capture support.

Technical Context

The CYT4DNJBQCQ1BZSGST implements a heterogeneous multi-core architecture: two lockstep-capable Cortex®-M7 cores handle primary graphics and application processing, while the Cortex®-M0+ executes peripheral management and cryptographic operations. Hardware inter-processor communication enables deterministic message passing without software overhead.

Its graphics subsystem includes a dedicated drawing engine, composition engine, and command sequencer-enabling frame-bufferless rendering directly to parallel RGB or dual FPD-Link outputs. The JPEG decoder supports full ISO/IEC10918-1 subset with YUV 4:2:0/4:2:2/4:4:4 and up to 16384×16384 pixel input resolution.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+
Flash Memory6336-KB code-flash with RWW, dual-bank FOTA support
SRAM640-KB with configurable retention granularity
Graphics RAM4096-KB embedded VRAM for layer composition and on-the-fly warping
Video OutputDual FPD-Link (2880×1080 @ 220 MHz) + Parallel RGB (1600×600 @ 80 MHz)
Video InputTwo-/four-lane MIPI CSI-2 (1920×720 / 2880×1080) + ITU-R BT.656
CAN FDUp to four channels compliant with ISO 11898-1:2015, 8 Mbps data rate
Ethernet10/100/1000 Mbps MAC with RGMII/MII/RMII PHY interface and IEEE-1588 PTP

Pinout & Package

This device uses a 327-ball BGA package (17 mm × 17 mm × 1.70 mm, 0.8-mm pitch) with ball-type terminations. Pin functions are defined per Infineon's official pin assignment documentation (Rev. *L, pages 31–40).

Pin/TerminalCircuit RoleDesign Meaning
VDDA_ADCAnalog supply for ADC1.1-V regulated supply with independent brown-out detection at 1.1 V
VDDDDigital core supply1.1-V nominal core rail derived from 2.7–5.5-V input; supports all power modes
XTAL_IN / XTAL_OUTExternal crystal oscillator interfaceSupports ECO up to 50 MHz; required for precise clock generation and IEEE-1588 synchronization
MDIO / MDCPHY management interfaceEnables configuration and status monitoring of external Ethernet PHY devices
RMII_RXD0 / RMII_RXD1Ethernet receive data linesPart of reduced media-independent interface supporting 10/100 Mbps operation
FPD_TX0_P / FPD_TX0_NFPD-Link differential video output pairFirst lane of dual FPD-Link interface driving high-resolution HUD displays

Key Features

FeatureDesign Value
On-the-fly display warpingHardware-accelerated geometric correction for curved HUD projection surfaces without frame buffer overhead
Dual-channel FPD-Link outputSimultaneous drive of two independent Wide-HD displays (2880×1080 total) with synchronized timing
Secure boot with eSHE/HSMHardware-enforced authentication using RSA/ECC signatures and AES-GCM decryption before code execution
ASIL-B functional safetyIntegrated SMPU, PPU, SECDED ECC on flash/SRAM/TCM, and dual watchdog timers with independent clock domains
JPEG decode accelerationFixed-function hardware block supporting YUV 4:2:0/4:2:2/4:4:4 and arbitrary image sizes up to 16384×16384 pixels

Applications

Digital Instrument ClusterHead-Up Display (HUD)

Use Scenario: Real-time rendering of vehicle speed, ADAS alerts, navigation arrows, and battery state in a driver-facing TFT panel.

IC Role / Device Role / Timing Role: Primary graphics processor and system controller executing AUTOSAR-compliant firmware with deterministic latency under ASIL-B constraints.

Use Value: Dual M7 cores enable concurrent UI rendering and sensor fusion processing; VRAM and composition engine eliminate external frame buffer memory.

Use Scenario: Projection of augmented reality overlays onto windshield with optical distortion compensation.

IC Role / Device Role / Timing Role: Graphics subsystem performs real-time perspective warping and direct video feed-through from camera to optical combiner.

Use Value: On-the-fly warping engine eliminates need for GPU offload or external FPGA; FPD-Link dual ensures low-latency, noise-immune video transmission.

Central Domain ControllerMulti-Sensor Video Aggregation

Use Scenario: Integration point for CAN FD, LIN, CXPI, and Ethernet networks in zonal architecture with OTA update capability.

IC Role / Device Role / Timing Role: Application processor managing cross-domain communication, secure firmware updates, and time-synchronized diagnostics via IEEE-1588 PTP.

Use Value: Four CAN FD channels and Gigabit Ethernet MAC enable high-bandwidth domain bridging; dual-bank flash allows seamless FOTA with zero downtime.

Use Scenario: Simultaneous ingestion of front-facing ADAS camera (MIPI CSI-2), rear-view camera (ITU-R BT.656), and surround-view stitching.

IC Role / Device Role / Timing Role: Video capture engine with multi-format support and hardware JPEG decode for thumbnail generation and metadata tagging.

Use Value: Single-chip solution replaces discrete video processor + JPEG codec; MIPI CSI-2 lanes scale to 4-lane mode for 4K-class input at 220 MHz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive graphics and domain control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32G399ASingle 2.2-GHz Cortex-A53 + dual Cortex-M7; lacks integrated VRAM and on-the-fly warping engineTargeted at gateway/routing; requires external GPU for HUD renderingChoose when Ethernet routing and virtualization are primary; avoid if HUD warping or low-latency graphics are required.
Renesas RH850/U2A400-MHz RH850 core; no graphics engine, no MIPI CSI-2, no JPEG decode, no FPD-LinkFocused on powertrain and chassis control; not suitable for display-intensive systemsChoose only for non-graphic ASIL-D control tasks; cannot replace CYT4DNJBQCQ1BZSGST in instrument cluster or HUD roles.

Compared with NXP S32G399A and Renesas RH850/U2A, CYT4DNJBQCQ1BZSGST uniquely integrates display warping, dual FPD-Link, and JPEG decode in a single ASIL-B-certified MCU-eliminating external video processors and reducing BOM count for HUD and cluster designs.

Availability

CYT4DNJBQCQ1BZSGST is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, central domain controllers, and multi-sensor video aggregation systems requiring stable component supply across extended production lifecycles.

Supply support for CYT4DNJBQCQ1BZSGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.

The TRAVEO™ T2G product line was designed specifically for automotive human-machine interface (HMI) systems requiring high-resolution graphics, functional safety, and multi-protocol connectivity-including digital clusters, HUDs, and centralized domain controllers.

FAQ

What power supply rails does CYT4DNJBQCQ1BZSGST require?

The device requires three primary supplies: VDDD (1.1-V core), VDDA_ADC (1.1-V analog for ADC), and VCCD (1.1-V for digital peripherals). All are generated internally from a single 2.7–5.5-V input. Independent brown-out detection thresholds apply-2.7 V and 3.0 V for VDDD/VDDA_ADC, and 1.1 V for VCCD-ensuring robust startup and fault response across automotive voltage transients.

Does CYT4DNJBQCQ1BZSGST support IEEE-1588 Precision Time Protocol?

Yes, the integrated Gigabit Ethernet MAC fully supports IEEE-1588 PTP in hardware, including timestamping of ingress/egress frames at the MAC layer. It operates with MII, RMII, and RGMII PHY interfaces and complies with IEEE-802.1AS for time-synchronized audio-video bridging-critical for deterministic inter-domain communication in zonal architectures.

How many MIPI CSI-2 lanes does the video capture engine support?

The video capture engine supports either two or four MIPI CSI-2 lanes, selectable at runtime. At 110 MHz per lane, two lanes support up to 1920×720 capture; at 220 MHz per lane, four lanes support up to 2880×1080. Lane count and clock rate are configured via register settings in the MIPI CSI-2 controller block, with automatic protocol alignment and error detection.

Is secure boot implemented in hardware or firmware?

Secure boot is implemented entirely in hardware using the integrated Crypto Engine. It verifies digital signatures (RSA-2048/3072 or ECC NIST P-256/P-384) of the boot image before loading into TCM, enforces AES-128/192/256-GCM decryption of encrypted firmware, and leverages eSHE-compliant key storage. No software intervention is required-the process initiates automatically on reset and is tamper-resistant by design.

CYT4DNJBQCQ1BZSGST Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
327-LFBGA
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 320MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
168
Program Memory Size:
6.19MB (6.19M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 48x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT4DNJBQCQ1BZSGST FAQ

1.How can I place an order for CYT4DNJBQCQ1BZSGST through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT4DNJBQCQ1BZSGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT4DNJBQCQ1BZSGST reliable?

The price and inventory of CYT4DNJBQCQ1BZSGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBQCQ1BZSGST is usually 5 days.

3.What payment methods are accepted for CYT4DNJBQCQ1BZSGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBQCQ1BZSGST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYT4DNJBQCQ1BZSGST?

CYT4DNJBQCQ1BZSGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT4DNJBQCQ1BZSGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT4DNJBQCQ1BZSGST?

For technical support, including CYT4DNJBQCQ1BZSGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBQCQ1BZSGST requirements.

6.How does Aetrix verify that CYT4DNJBQCQ1BZSGST is sourced from the original manufacturer or authorized distributors?

All CYT4DNJBQCQ1BZSGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBQCQ1BZSGST meets industry standards.

7.What is the process for return or replacement of CYT4DNJBQCQ1BZSGST?

All CYT4DNJBQCQ1BZSGST units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBQCQ1BZSGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT4DNJBQCQ1BZSGST part is unused and in its original packaging.

Return procedure for CYT4DNJBQCQ1BZSGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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