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Infineon Technologies CYT4DNJBRCR1BZSGSTXUMA1

Part No.:
CYT4DNJBRCR1BZSGSTXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
327-LFBGA
Datasheet:
AetrixCYT4DNJBRCR1BZSGSTXUMA1.pdf
Description:
TRAVEO-2 CLUST.2.5DGRAPH
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,702

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Product details

Overview

CYT4DNJBRCR1BZSGSTXUMA1 from Infineon is an automotive-grade 32-bit TRAVEO™ T2G microcontroller built on Arm® Cortex®-M7 dual-core (320 MHz) + M0+ (100 MHz) architecture, featuring integrated 2D/2.5D graphics engine, JPEG decoder, dual FPD-Link video output (up to 2880×1080), and CAN FD (up to 8 Mbps). It includes 6336 KB code-flash, 640 KB SRAM, hardware crypto engine (AES-128/192/256, SHA-256/512, ECC, RSA), and ASIL-B functional safety support for instrument cluster and HUD systems.

For engineers reviewing the CYT4DNJBRCR1BZSGSTXUMA1 datasheet, CYT4DNJBRCR1BZSGSTXUMA1 pinout, CYT4DNJBRCR1BZSGSTXUMA1 application, or CYT4DNJBRCR1BZSGSTXUMA1 equivalent, key selection criteria include dual-display timing control with on-the-fly warping, secure boot with eSHE/HSM, low-power Deep Sleep wake-up via 81 GPIOs, and IEEE-1588 Ethernet MAC with RGMII/MII/RMII PHY interface compatibility.

Technical Context

The CYT4DNJBRCR1BZSGSTXUMA1 implements a heterogeneous multi-CPU subsystem: two lockstep-capable Cortex-M7 cores for primary real-time graphics and control tasks, plus a dedicated Cortex-M0+ core for peripheral management, security services, and interrupt offloading. Its graphics pipeline integrates a command sequencer, drawing engine, composition engine, and display engine - enabling frame-bufferless rendering directly to dual FPD-Link or RGB outputs.

Functional safety is architected at silicon level with SMPU, PPU, SECDED ECC on all safety-critical memories (SRAM, flash, TCM), MCWDT, CSV, and BOD/OVD/OCD monitoring across all power modes. The crypto engine supports full AES-GCM, SHA-512, ECC-384, and RSA-4096 acceleration with TRNG/PRNG and secure boot verification using digital signatures.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual 320-MHz Arm® Cortex®-M7 + single 100-MHz Cortex®-M0+, enabling parallel real-time graphics and security processing
Graphics Engine2D/2.5D rendering with perspective warping, 4096 KB VRAM, and direct capture-to-display feed-through for HUD latency reduction
Video InterfacesDual FPD-Link (2880×1080 @ 220 MHz), Parallel RGB (1600×600 @ 80 MHz), MIPI CSI-2 (4-lane, 2880×1080 capture)
Memory6336 KB code-flash (RWW, dual-bank FOTA), 128 KB work-flash, 640 KB SRAM with configurable retention granularity
Crypto AccelerationAES-128/192/256-GCM, SHA-256/512, ECC-256/384, RSA-2048/4096, TRNG/PRNG, and eSHE-compliant HSM
Automotive Interfaces4× CAN FD (8 Mbps, ISO 11898-1:2015), 12× SCB (I²C/SPI/UART), 2× LIN, 2× CXPI, 1× Gigabit Ethernet MAC (IEEE-1588, AVB)
Safety CertificationASIL-B compliant with MPU/SMPU/PPU, SECDED ECC on SRAM/flash/TCM, MCWDT, CSV, BOD/OVD/OCD, and low-voltage detection

Pinout & Package

This device is housed in a 327-ball BGA package (17 mm × 17 mm × 1.70 mm, 0.8 mm pitch), optimized for automotive thermal and EMI performance with dedicated power/ground ball arrays and high-speed I/O routing zones.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO_0–VDDIO_7I/O Power SupplyEight independent 1.8–3.3 V domains supporting mixed-voltage I/O banks with programmable drive strength
VDDD/VDDA_ADCDigital/Core & ADC Analog Supply1.1 V nominal core rail (regulated internally); 2.7–5.5 V input range with dual BOD thresholds (2.7 V / 3.0 V)
CLK_IN0/CLK_IN1External Clock InputsSupports ECO (1–50 MHz), WCO (32.768 kHz), and LPECO for low-power clocking with automatic failover
MDIO/MDCEthernet Management InterfaceIEEE-802.3-compliant MDIO/MDC pair for PHY configuration and status monitoring
RGMII_TXD[3:0]/RXD[3:0]Gigabit Ethernet PHY InterfaceReduced Gigabit Media-Independent Interface with 125 MHz DDR clock, supporting precise IEEE-1588 timestamp alignment
FPD_LINK0_P/N, FPD_LINK1_P/NDual FPD-Link Video OutputDifferential LVDS pairs driving up to two automotive displays simultaneously with embedded clock recovery

Key Features

FeatureDesign Value
On-the-fly Display WarpingHardware-accelerated geometric correction for HUD projection onto curved windshields without frame buffer overhead
Secure Boot with eSHEImmutable root-of-trust execution path verified via ECDSA signature before any user code runs
Frame-Bufferless RenderingDirect pixel streaming from graphics engine to dual FPD-Link outputs, reducing SRAM footprint and latency
Multi-Mode Low-Power Wake-Up81 GPIOs + 10 dedicated pins + RTC/SCB/EVTGEN sources enable selective Deep Sleep/Hibernate exit with sub-10 µs latency
Configurable Safety Memory ProtectionSMPU enforces memory access rules across CPU clusters; PPU isolates peripheral register access by privilege level

Applications

Instrument ClusterHead-Up Display (HUD)

Use Scenario: Real-time rendering of speed, RPM, navigation, and ADAS alerts on TFT-LCD dashboards with animated transitions.

IC Role / Device Role / Timing Role: Primary graphics controller with dual-display timing generation, JPEG decompression for map tiles, and CAN FD data ingestion.

Use Value: Eliminates external GPU and frame buffer memory; achieves <15 ms end-to-end rendering latency with ASIL-B safety isolation.

Use Scenario: Projection of vehicle speed, lane departure, and collision warnings onto windshield with dynamic distortion compensation.

IC Role / Device Role / Timing Role: Graphics engine performing real-time perspective warping and overlay compositing on captured camera feeds.

Use Value: Hardware warping reduces CPU load by >70%; dual FPD-Link enables simultaneous HUD + rearview camera output.

Central Gateway with AVBDigital Rearview Mirror

Use Scenario: Aggregation and time-synchronized routing of audio/video streams across CAN FD, LIN, and Ethernet domains in zonal architectures.

IC Role / Device Role / Timing Role: Ethernet MAC with IEEE-1588 PTP and AVB (802.1Qav/Qbb) stack offload, synchronized to CAN FD timestamps.

Use Value: Enables deterministic <100 µs audio-video bridging latency; eliminates need for external AVB switch or timing controller.

Use Scenario: High-resolution video processing from rear-facing camera with dynamic contrast enhancement and mirror geometry correction.

IC Role / Device Role / Timing Role: MIPI CSI-2 capture engine + JPEG decoder + graphics composition engine driving LCD mirror display.

Use Value: Single-chip solution replaces FPGA + codec + display controller; supports 1920×1080@60 fps with HDR tone mapping.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive graphics and connectivity applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344Single Cortex-M7 (320 MHz), no integrated graphics engine, no FPD-Link, JPEG decode only via software libraryTargeted at gateway/control ECU; lacks HUD-specific warping and dual-display timingSelect when graphics offload is unnecessary and CAN FD/LIN/Ethernet connectivity is primary requirement
Renesas RH850/U2ATri-core (RH850 + 2x RISC-V), no hardware JPEG decoder, no Ethernet MAC, no ASIL-B certified crypto engineFocused on powertrain and chassis control; no display subsystem or AVB supportSelect for high-integrity motor control where display and networking are handled by companion SoC

Compared with S32K344 and RH850/U2A, CYT4DNJBRCR1BZSGSTXUMA1 uniquely integrates dual-display timing, on-the-fly warping, JPEG decode acceleration, and ASIL-B-certified crypto-making it the only single-die solution for automotive HUD and instrument cluster with Ethernet AVB gateway capability.

Availability

CYT4DNJBRCR1BZSGSTXUMA1 is available at Aetrix Electronics and suitable for automotive instrument clusters, Head-Up Displays (HUD), central domain gateways, and digital rearview mirrors requiring stable component supply, long lifecycle commitment, and AEC-Q100 Grade 2 qualification.

Supply support for CYT4DNJBRCR1BZSGSTXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D centers across Europe, Asia, and the Americas.

The TRAVEO™ T2G product line was designed specifically for automotive human-machine interface (HMI) systems requiring integrated graphics, real-time control, functional safety, and secure connectivity - targeting next-generation digital cockpits and ADAS visualization platforms.

FAQ

What is the maximum resolution supported by the dual FPD-Link interface?

The CYT4DNJBRCR1BZSGSTXUMA1 supports up to 2880 × 1080 pixels per display over dual FPD-Link at 220 MHz, enabling Wide-HD output to two independent automotive displays simultaneously. This is confirmed in Section 3.4 of the datasheet (Rev. *L, p.20), with timing constraints validated for automotive-grade LVDS transceivers meeting JEDEC JESD22-A114.

Does this MCU support secure boot with public-key verification?

Yes - the device implements secure boot using ECDSA-based digital signature verification on boot images stored in code-flash, enforced by the hardware security module (HSM) and Enhanced Secure Hardware Extension (eSHE). This is documented in Section 3.1 and Feature List (p.2), with cryptographic acceleration for ECC-256/384 and SHA-256/512.

Can the JPEG decoder handle YUV 4:2:0 subsampled images?

Yes - the integrated JPEG decoder fully supports YUV 4:2:0, 4:2:2, 4:4:4, and grayscale color spaces per ISO/IEC 10918-1 subset compliance (Datasheet p.2). Input image sizes range from 1×1 to 16384×16384 pixels, with decoded pixel data routed directly to VRAM or display engines.

How many CAN FD channels does CYT4DNJBRCR1BZSGSTXUMA1 support, and what is the max data rate?

This part supports four independent CAN FD channels operating up to 8 Mbps, compliant with ISO 11898-1:2015 and Bosch CAN FD Specification V1.0 (non-ISO). Physical layer limitations apply based on transceiver and topology - details are specified in Section 3.3 (p.16) and validated per ISO 16845:2015 conformance testing.

CYT4DNJBRCR1BZSGSTXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
327-LFBGA
Series:
Traveo™ T2G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 320MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
168
Program Memory Size:
6.19MB (6.19M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 48x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CYT4DNJBRCR1BZSGSTXUMA1 FAQ

1.How can I place an order for CYT4DNJBRCR1BZSGSTXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CYT4DNJBRCR1BZSGSTXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYT4DNJBRCR1BZSGSTXUMA1 reliable?

The price and inventory of CYT4DNJBRCR1BZSGSTXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYT4DNJBRCR1BZSGSTXUMA1 is usually 5 days.

3.What payment methods are accepted for CYT4DNJBRCR1BZSGSTXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYT4DNJBRCR1BZSGSTXUMA1 transactions.

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4.How is shipping managed for CYT4DNJBRCR1BZSGSTXUMA1?

CYT4DNJBRCR1BZSGSTXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYT4DNJBRCR1BZSGSTXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYT4DNJBRCR1BZSGSTXUMA1?

For technical support, including CYT4DNJBRCR1BZSGSTXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYT4DNJBRCR1BZSGSTXUMA1 requirements.

6.How does Aetrix verify that CYT4DNJBRCR1BZSGSTXUMA1 is sourced from the original manufacturer or authorized distributors?

All CYT4DNJBRCR1BZSGSTXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYT4DNJBRCR1BZSGSTXUMA1 meets industry standards.

7.What is the process for return or replacement of CYT4DNJBRCR1BZSGSTXUMA1?

All CYT4DNJBRCR1BZSGSTXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with CYT4DNJBRCR1BZSGSTXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYT4DNJBRCR1BZSGSTXUMA1 part is unused and in its original packaging.

Return procedure for CYT4DNJBRCR1BZSGSTXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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