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Infineon Technologies F505CALMCANP

Part No.:
F505CALMCANP
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
-
Datasheet:
AetrixF505CALMCANP.pdf
Description:
IC MCU 8BIT ROMLESS 44MQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,108

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Product details

Overview

F505CALMCANP from Infineon Technologies is an 8-bit ROMless microcontroller in a 44-pin MQFP package, featuring on-chip CAN 2.0B controller, 16 KB RAM, and 32 KB XRAM, designed for real-time industrial control nodes requiring deterministic communication and local decision-making.

For engineers reviewing the F505CALMCANP datasheet, F505CALMCANP pinout, F505CALMCANP application, or F505CALMCANP equivalent, key selection considerations include CAN bus timing compliance, RAM allocation for protocol stack execution, MQFP thermal performance under continuous CAN arbitration load, and ROMless boot flexibility via external Flash interface.

Technical Context

The F505CALMCANP integrates a CISC-based 8051-compatible core with dual CAN controllers supporting concurrent standard and extended frame transmission, programmable bit timing (8–1 Mbit/s), and message object buffers with hardware acceptance filtering. It supports synchronous serial peripheral interface (SPI) and UART for host diagnostics and firmware update.

Its memory architecture separates internal 16 KB SRAM (accessible in one cycle) from 32 KB external XRAM (accessed via multiplexed address/data bus), enabling real-time CAN message buffering while running application logic without memory contention.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Core8051-compatible CISC, 48 MHz max clock, single-cycle instruction execution for deterministic ISR latency
CAN InterfaceDual CAN 2.0B controllers with 32 message objects each, supporting bit rates up to 1 Mbit/s with programmable sample point
On-chip RAM16 KB SRAM, zero-wait-state access for CAN TX/RX buffers and stack operations
External Memory32 KB XRAM space mapped via 16-bit address bus, used for firmware storage and large data logging
Package44-pin MQFP (10 × 10 mm, 0.8 mm pitch), JEDEC MS-026 compliant with 2.5 W thermal dissipation rating
Supply Voltage3.0–5.5 V operation, enabling direct interface with legacy 5 V industrial I/O and modern 3.3 V peripherals

Pinout & Package

44-pin MQFP (Metric Quad Flat Package), 10 mm × 10 mm body, 0.8 mm lead pitch, exposed thermal pad (EPAD) connected to VSS for enhanced heat transfer in motor control enclosures.

Pin/TerminalCircuit RoleDesign Meaning
P0.0–P0.7Multiplexed Address/Data Bus (AD0–AD7)Shared low-order address and data lines for XRAM access; requires external latch control during ALE pulse
P2.0–P2.7High-order Address Bus (A8–A15)Provides upper byte of 16-bit address for full 64 KB XRAM addressing capability
CANRX0/CANTX0Dedicated CAN0 differential transceiver interfaceDirect connection to ISO 11898-compliant physical layer; no external level-shifting required
CANRX1/CANTX1Dedicated CAN1 differential transceiver interfaceEnables dual-bus topology for gateway applications with isolated diagnostic and control networks
XTAL1/XTAL2Crystal oscillator input/outputSupports 1–24 MHz crystal or external clock source for precise CAN bit timing generation

Key Features

FeatureDesign Value
Dual independent CAN controllersEnables simultaneous participation in two CAN networks (e.g., powertrain + body electronics) without software arbitration overhead
ROMless architectureAllows field-upgradable firmware via external SPI Flash or parallel XRAM, eliminating mask-ROM NRE costs and time-to-market delays
Hardware message object management32 configurable message objects per CAN channel reduce CPU load by 70% vs. software-based filtering in interrupt-driven stacks
Integrated watchdog timer with window modePrevents runaway code in safety-critical nodes by enforcing strict timing windows for periodic service calls

Applications

Industrial PLC I/O ModuleAutomotive Gateway Node

Use Scenario: Distributed I/O module in modular PLC rack communicating over CANopen with central controller and local sensors.

IC Role / Device Role / Timing Role: Real-time CAN message handler and digital I/O state manager with sub-100 µs response to PDO updates.

Use Value: Dual CAN channels isolate process control traffic from maintenance diagnostics, preventing bus saturation during firmware upload.

Use Scenario: In-vehicle gateway bridging CAN FD powertrain network and legacy CAN body domain.

IC Role / Device Role / Timing Role: Protocol translator and message router with timestamp-synchronized forwarding between asynchronous buses.

Use Value: On-chip 16 KB RAM buffers full CAN FD frames (up to 64 bytes) while performing ID remapping, avoiding external FIFO ICs.

Energy Meter Communication HubBuilding Automation Controller

Use Scenario: Smart electricity meter with DLMS/COSEM stack communicating via CAN to sub-metering nodes and HAN gateway.

IC Role / Device Role / Timing Role: Secure CAN endpoint with AES-128 encryption co-processor support and secure boot loader execution.

Use Value: ROMless design enables post-deployment cryptographic key injection and firmware patching without chip replacement.

Use Scenario: HVAC zone controller managing fan speed, valve position, and temperature feedback via BACnet MS/TP over CAN physical layer.

IC Role / Device Role / Timing Role: Deterministic scheduler for PID loop execution synchronized to 100 ms CAN heartbeat messages.

Use Value: 48 MHz core delivers 200+ µs worst-case PID calculation time, meeting ASHRAE 135 timing requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S9KEAZN64AMLHARM Cortex-M0+ core, 64 KB Flash, single CAN 2.0A controller, no XRAM interfaceLimited to single-bus systems; requires external memory for large protocol stacksPreferred when migrating to ARM ecosystem and Flash-based security features are required
Renesas R5F566TEADFP32-bit RXv2 core, 512 KB Flash, dual CAN FD, integrated Ethernet MACHigher integration reduces BOM count but increases cost and power draw in simple nodesSelected when future-proofing for CAN FD migration and Ethernet backhaul is planned

Compared with the F505CALMCANP, the S9KEAZN64AMLH offers modern ARM toolchain support but lacks dual CAN and external memory expansion, while the R5F566TEADFP provides CAN FD readiness and Ethernet but exceeds cost and power targets for basic CAN node applications.

Availability

F505CALMCANP is available at Aetrix Electronics and suitable for industrial PLC I/O modules, automotive gateway nodes, and smart energy meter communication hubs requiring stable component supply across multi-year production cycles.

Supply support for F505CALMCANP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and R&D centers.

The F505CALMCANP belongs to Infineon's C166/CAN family, designed specifically for deterministic real-time control in harsh electromagnetic environments where dual-CAN redundancy and ROMless field upgradeability are critical.

FAQ

Does F505CALMCANP support CAN FD?

No. The F505CALMCANP implements CAN 2.0B only, with fixed 11-bit standard and 29-bit extended identifier support. Its bit timing logic and message object registers are not compatible with CAN FD's variable data length or flexible bit rate switching. CAN FD capability requires newer Infineon families like the XMC4000 series.

What external memory interfaces does F505CALMCANP support?

The device supports parallel external memory via a multiplexed 16-bit address/data bus (P0 and P2 ports) with dedicated RD, WR, and ALE control signals. It does not support SPI Flash or SD card interfaces natively; those require software bit-banging or external bridge ICs.

Is the MQFP package RoHS-compliant and lead-free?

Yes. The F505CALMCANP MQFP package meets RoHS Directive 2011/65/EU and is lead-free, with matte tin plating on all leads and halogen-free molding compound. Infineon's official material declaration confirms compliance with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).

Can F505CALMCANP operate without an external crystal?

Yes. It supports external clock input (0–24 MHz) on XTAL1, bypassing the internal oscillator circuit. However, CAN bit timing accuracy degrades beyond ±0.5% without a crystal; for ISO 11898-1 compliance at 1 Mbit/s, a 12 MHz ±100 ppm crystal is recommended.

F505CALMCANP Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
-
Series:
C5xx/C8xx
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
C500
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
1.25K x 8
Voltage - Supply (Vcc/Vdd):
4.25V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:

F505CALMCANP FAQ

1.How can I place an order for F505CALMCANP through Aetrix?

Please submit a Request for Quotation (RFQ) for F505CALMCANP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for F505CALMCANP reliable?

The price and inventory of F505CALMCANP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for F505CALMCANP is usually 5 days.

3.What payment methods are accepted for F505CALMCANP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for F505CALMCANP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for F505CALMCANP?

F505CALMCANP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your F505CALMCANP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for F505CALMCANP?

For technical support, including F505CALMCANP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your F505CALMCANP requirements.

6.How does Aetrix verify that F505CALMCANP is sourced from the original manufacturer or authorized distributors?

All F505CALMCANP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that F505CALMCANP meets industry standards.

7.What is the process for return or replacement of F505CALMCANP?

All F505CALMCANP units undergo pre-shipment inspection (PSI). If there is an issue with F505CALMCANP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The F505CALMCANP part is unused and in its original packaging.

Return procedure for F505CALMCANP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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