Infineon Technologies IDP2308HXUMA1

Overview

IDP2308HXUMA1 from Infineon Technologies is a digital multi-mode PFC + LLC combo controller in PG-DSO-14 package, integrating 600 V HV startup cell, floating high-side driver (HSGD), and UART-configurable OTP memory. It delivers synchronous burst-mode control for <30 mW standby power, supports 75–300 W LCD-TV SMPS, and implements configurable non-linear VCO curve and X-cap discharge via HV pin.

For engineers reviewing the IDP2308HXUMA1 datasheet, IDP2308HXUMA1 pinout, IDP2308HXUMA1 application, or IDP2308HXUMA1 equivalent, key selection criteria include integrated HV startup eliminating auxiliary supply, dual current-sense inputs (CS0/CS1) with confirmed peak sink currents (800 mA / 500 mA), UART-based in-circuit configuration, and PFC+LLC co-optimization across load range.

Technical Context

The IDP2308HXUMA1 embeds a 66 MHz NanoDSP processor executing independent PFC and half-bridge LLC control loops. Its digital engine enables real-time mode switching (CCM/DCM/CrCM for PFC; TCO-to-VCO transition for LLC) and implements brown-in/brown-out detection using sampled HV pin voltage.

Protection architecture includes eight PFC-specific safeguards (e.g., PFCOCLP, PFCCCMP) and five LLC-specific protections (e.g., LLCOCP1/LLCOCP2, LLCOLP), all configurable via OTP. The HSGD driver operates with 0.52 A source / 1.3 A sink capability referenced to HSGND, supplied by bootstrap-connected HSVCC.

Key Specifications

Pinout & Package

Package: PG-DSO-14 (150 mil), surface-mount, thermally enhanced exposed pad variant per Infineon standard outline drawing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PFC+LLC combo controller applications.

Compared with UCC28070DR and ICE2PCS01G, IDP2308HXUMA1 reduces component count by ≥7 parts, enables in-field parameter updates via UART, and achieves lower standby power through synchronized digital burst control - critical for CoC Tier 2 and Energy Star 8.0 compliance.

Availability

IDP2308HXUMA1 is available at Aetrix Electronics and suitable for LCD-TV power supplies, industrial SMPS, medical equipment PSUs, and LED video wall drivers requiring stable component supply and long-term lifecycle support.

Supply support for IDP2308HXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in high-voltage analog and digital power controllers.

IDP2308HXUMA1 belongs to Infineon's digital AC-DC controller product line, designed specifically for high-efficiency, low-standby-power resonant SMPS targeting display, industrial, and medical applications.

FAQ

What is the function of the HV pin on IDP2308HXUMA1?

The HV pin serves three confirmed functions: (1) provides 600 V-rated input for the internal startup cell to charge VCC without auxiliary winding; (2) discharges X-capacitors via internal circuitry during standby; and (3) enables sampled AC line voltage sensing for brown-in/brown-out detection using an external resistor divider. It is not a power input but a high-impedance sensing/startup node.

Does IDP2308HXUMA1 support both PFC and LLC control in a single chip?

Yes - IDP2308HXUMA1 integrates a complete digital PFC controller (supporting CCM/CrCM/DCM modes) and a half-bridge LLC resonant controller (with TCO/VCO operation and smooth transition) on one die. Both loops share the same NanoDSP core and OTP memory, enabling coordinated burst mode and unified protection handling.

How is configuration performed on IDP2308HXUMA1?

Configuration uses the MFIO pin as a half-duplex UART interface. Parameters-including soft-start time, VCO curve points, protection thresholds, and burst entry conditions-are programmed once into OTP memory using Infineon's dedicated configuration tool. No external EEPROM or JTAG is required; runtime read-back of configured values is supported.

What thermal considerations apply to the PG-DSO-14 package?

The PG-DSO-14 package features an exposed thermal pad that must be soldered to a minimum 120 mm² copper pour on the PCB for effective heat dissipation. Junction-to-case thermal resistance is 25°C/W; maximum junction temperature is 150°C. Layout must maintain ≥0.3 mm clearance between HSGND and GND traces to prevent coupling-induced latch-up.