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Infineon Technologies KX161CS32F40FBBANT

Part No.:
KX161CS32F40FBBANT
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixKX161CS32F40FBBANT.pdf
Description:
IC MCU 16BIT 256KB FLASH 144TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,457

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Product details

Overview

KX161CS32F40FBBANT from Infineon Technologies is a 16-bit single-chip microcontroller based on the C166SV2 core, featuring 256 KB on-chip Flash, 12 KB total SRAM (2 KB DPRAM + 4 KB DSRAM + 6 KB PSRAM), and operation up to 40 MHz CPU clock. It integrates TwinCAN (Rev. 2.0B), dual ASC/SSC interfaces, 12-channel 10-bit ADC (2.55 µs conversion), and supports automotive-grade temperature range (−40 °C to +125 °C) in a 144-pin TQFP package. Used in engine control units and industrial motion controllers requiring deterministic real-time I/O handling.

For engineers reviewing the KX161CS32F40FBBANT datasheet, KX161CS32F40FBBANT pinout, KX161CS32F40FBBANT application, or KX161CS32F40FBBANT equivalent, key selection criteria include CAN 2.0B dual-node support, 50 ns interrupt sample rate, on-chip PLL with 1:0.15–1:10 multiplication, 16-priority-level interrupt system, and RoHS-compliant green TQFP-144 packaging with 0.5 mm pitch.

Technical Context

The XC161CS-32F implements a 5-stage pipelined C166SV2 CPU core delivering single-cycle execution for most instructions, including 1-cycle 16×16 multiply and MAC operations. Its memory subsystem includes separate 2 KB dual-port RAM for concurrent CPU/peripheral access and 6 KB program/data SRAM with configurable wait-state control via IMBCTRL register.

Peripheral integration centers on deterministic real-time control: the GPT12E timer unit provides five independent timers with capture/compare capability; CAPCOM1/2 offer 32 I/O pins across two 16-channel units; TwinCAN supports 32 message objects per node with gateway functionality between CAN0 and CAN1; and the A/D converter offers programmable resolution (8-/10-bit) and conversion time down to 2.55 µs at full resolution.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core C166SV2 16-bit RISC-like core with 5-stage pipeline, enabling 25 ns instruction cycle at 40 MHz.
Flash Memory 256 KB on-chip Flash with configurable wait states; supports in-system programming and erase cycles ≥10k.
SRAM Total 12 KB distributed: 2 KB DPRAM (dual-port for CPU+DMA), 4 KB DSRAM, 6 KB PSRAM (program/data unified).
ADC Resolution & Speed 12-channel, software-selectable 8-bit or 10-bit mode; min conversion time 2.15 µs (8-bit) / 2.55 µs (10-bit).
CAN Interface Dual CAN nodes (CAN0/CAN1), Rev. 2.0B active, 32 message objects per node, integrated gateway logic.
Interrupt Latency 50 ns minimum sample rate; 16 priority levels with 73 interrupt sources including peripheral-triggered events.
Package 144-pin TQFP (Green, RoHS-compliant), 0.5 mm pitch, thermal resistance RΘJC = 20 °C/W (typ).

Pinout & Package

Package: 144-pin Thin Quad Flat Package (TQFP), RoHS-compliant green molding compound, 0.5 mm lead pitch, body size 20 mm × 20 mm.

Pin/Terminal Circuit Role Design Meaning
P0.0–P0.15 Port 0 bidirectional I/O 16-bit general-purpose port with selectable input thresholds and hysteresis; multiplexed with external bus address/data lines.
P1.0–P1.15 Port 1 bidirectional I/O 16-bit port supporting alternate functions including ASC0/ASC1 TX/RX, SSC0/SSC1 CLK/MOSI/MISO, and CAN0/CAN1 RX/TX.
XTAL1/XTAL3 Crystal oscillator inputs XTAL1 accepts external crystal (1–20 MHz) or clock source; XTAL3 connects to VDDI domain for internal oscillator biasing.
TRST JTAG test reset Active-low asynchronous reset for OCDS debug interface; required for on-chip debug initialization and boundary scan.
VDDI/VSS Internal analog supply/ground VDDI powers internal PLL, ADC, and RTC oscillator; must be decoupled separately from digital VDD to minimize noise coupling.

Key Features

Feature Design Value
On-chip Debug Support (OCDS) JTAG-based real-time debugging with hardware breakpoints, trace buffer, and non-intrusive program execution monitoring.
Peripheral Event Controller (PEC) 8-channel DMA controller with 24-bit addressing; enables single-cycle data transfers between peripherals and memory without CPU intervention.
Power Management Modes Three low-power states: Idle (CPU halted, peripherals active), Sleep (peripherals clock-gated), Power Down (full retention with RTC wake-up).
Real-Time Clock (RTC) Dedicated 32.768 kHz oscillator input; maintains timekeeping during Power Down mode with <1 µA current draw.
Bootstrap Loader ROM-resident serial loader enabling field firmware updates via ASC0 without external programmer.

Applications

Engine Control Unit (ECU) Industrial Motion Controller

Use Scenario: Real-time acquisition of crankshaft position, throttle angle, and oxygen sensor signals in gasoline/diesel powertrain systems.

IC Role / Device Role / Timing Role: Central control unit executing closed-loop fuel injection and ignition timing algorithms with sub-50 ns interrupt response to crank sensor edges.

Use Value: Integrated TwinCAN enables direct communication with transmission and ABS ECUs; 10-bit ADC resolves sensor inputs with ≤1 LSB INL error at 2.55 µs conversion.

Use Scenario: Synchronized multi-axis servo drive coordination in CNC machine tools and robotic arms.

IC Role / Device Role / Timing Role: Deterministic motion profile generator using GPT12E timers and CAPCOM units to produce PWM outputs with <100 ns jitter across 8 axes.

Use Value: Dual ASC/SSC interfaces support encoder feedback (RS-422) and host HMI (SPI) simultaneously; PEC offloads 90% of position data movement from CPU.

Automotive Body Control Module (BCM) Energy Metering Gateway

Use Scenario: Centralized management of lighting, door locks, window lifts, and HVAC actuators in passenger vehicles.

IC Role / Device Role / Timing Role: Low-power coordinator using Sleep mode between LIN/CAN wake events; handles 99 GPIO lines with programmable hysteresis for noisy automotive environments.

Use Value: −40 °C to +125 °C operating range ensures reliability under hood conditions; watchdog timer with oscillator supervision prevents firmware lockup during voltage transients.

Use Scenario: Smart grid endpoint aggregating kWh, voltage, and current measurements from multiple CT/PT sensors before forwarding via CAN or RS-485.

IC Role / Device Role / Timing Role: High-accuracy metering hub performing simultaneous sampling across 12 ADC channels with timestamping via RTC.

Use Value: On-chip 256 KB Flash stores dual firmware images for secure over-the-air updates; I²C interface manages external RTC and EEPROM for tamper-proof logging.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
SAK-XC2267-104F80F 32-bit TriCore™ core, 80 MHz max, 1 MB Flash, 128 KB RAM; higher performance but larger code footprint and power consumption. Targets next-gen ECU platforms requiring ISO 26262 ASIL-B compliance and complex motor control algorithms. Select when migrating from legacy 16-bit to scalable 32-bit architecture with safety certification path.
SAF-XC164CS-32F40F Same C166SV2 core, identical peripheral set, but enhanced ESD tolerance (±4 kV HBM) and extended Flash endurance (≥20k cycles). Preferred for new designs in harsh industrial environments where long-term field reliability outweighs minor cost premium. Choose for drop-in replacement where improved robustness and lifecycle assurance are critical.

Compared with SAK-XC2267-104F80F, KX161CS32F40FBBANT offers lower power and smaller memory footprint ideal for cost-sensitive ECUs; versus SAF-XC164CS-32F40F, it trades slightly lower ESD rating for broader legacy toolchain compatibility and mature production availability.

Availability

KX161CS32F40FBBANT is available at Aetrix Electronics and suitable for engine control units, industrial motion controllers, automotive body control modules, and energy metering gateways requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for KX161CS32F40FBBANT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, headquartered in Munich with global design and manufacturing infrastructure.

The XC161 family was engineered specifically for deterministic real-time control in automotive powertrain and chassis systems, emphasizing low-latency interrupt handling, integrated CAN networking, and high-reliability operation across extended temperature ranges.

FAQ

What is the maximum operating frequency of the KX161CS32F40FBBANT CPU core?

The C166SV2 core operates at up to 40 MHz CPU clock frequency, achieving a 25 ns instruction cycle time with single-cycle execution for most instructions. This frequency is sustained using the on-chip PLL configured with multiplication factors from 1:0.15 to 1:10, and requires proper Flash wait-state configuration (WSFLASH bits in IMBCTRL) to match access timing.

Does the KX161CS32F40FBBANT support CAN FD or only classical CAN?

The KX161CS32F40FBBANT implements TwinCAN compliant with ISO 11898-1:2003 (CAN 2.0B active), supporting standard 11-bit identifiers and extended 29-bit identifiers at bit rates up to 1 Mbit/s. It does not support CAN FD features such as flexible data-rate or extended payload length; its CAN modules are strictly classical CAN with 32 message objects per node.

How is the 12-channel ADC calibrated and what accuracy is guaranteed?

The ADC includes factory-trimmed offset and gain calibration stored in on-chip Flash; users apply these values via software during initialization. At 10-bit resolution, typical integral nonlinearity (INL) is ±0.5 LSB and differential nonlinearity (DNL) is ±0.3 LSB over the full temperature range (−40 °C to +125 °C), with conversion time fixed at 2.55 µs per channel.

Can the KX161CS32F40FBBANT operate without an external crystal?

Yes - the device supports both external crystal (via XTAL1/XTAL3) and external clock input modes. When no crystal is used, a CMOS-level clock signal (1–20 MHz) may be applied directly to XTAL1, while XTAL3 is left unconnected or tied to VDDI. The on-chip PLL remains functional in either configuration, enabling precise clock synthesis for CPU and peripheral domains.

KX161CS32F40FBBANT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
144-LQFP
Series:
XC16x
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
C166SV2
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PWM, WDT
Number of I/O:
99
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
12K x 8
Voltage - Supply (Vcc/Vdd):
2.35V ~ 2.7V
Data Converters:
A/D 12x8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

KX161CS32F40FBBANT FAQ

1.How can I place an order for KX161CS32F40FBBANT through Aetrix?

Please submit a Request for Quotation (RFQ) for KX161CS32F40FBBANT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for KX161CS32F40FBBANT reliable?

The price and inventory of KX161CS32F40FBBANT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for KX161CS32F40FBBANT is usually 5 days.

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4.How is shipping managed for KX161CS32F40FBBANT?

KX161CS32F40FBBANT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your KX161CS32F40FBBANT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for KX161CS32F40FBBANT?

For technical support, including KX161CS32F40FBBANT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your KX161CS32F40FBBANT requirements.

6.How does Aetrix verify that KX161CS32F40FBBANT is sourced from the original manufacturer or authorized distributors?

All KX161CS32F40FBBANT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that KX161CS32F40FBBANT meets industry standards.

7.What is the process for return or replacement of KX161CS32F40FBBANT?

All KX161CS32F40FBBANT units undergo pre-shipment inspection (PSI). If there is an issue with KX161CS32F40FBBANT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The KX161CS32F40FBBANT part is unused and in its original packaging.

Return procedure for KX161CS32F40FBBANT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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