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Infineon Technologies MB89637PF-GT-XXX-BNDE1

Part No.:
MB89637PF-GT-XXX-BNDE1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-BQFP
Datasheet:
AetrixMB89637PF-GT-XXX-BNDE1.pdf
Description:
IC MCU 8BIT 32KB MROM 64QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,251

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Product details

Overview

MB89637PF-GT-XXX-BNDE1 from Fujitsu is an 8-bit F2MC-8L microcontroller with 64 KB on-chip ROM, 2 KB RAM, and integrated CAN 2.0B controller supporting up to 1 Mbps data rate. It features programmable port levels (including automotive VIL = 0.5×Vcc), clock modulation for EMI reduction, and LIN USART supporting up to 4 Mbaud - deployed in body control modules for automotive door and lighting systems.

For engineers reviewing the MB89637PF-GT-XXX-BNDE1 datasheet, MB89637PF-GT-XXX-BNDE1 pinout, MB89637PF-GT-XXX-BNDE1 application, or MB89637PF-GT-XXX-BNDE1 equivalent, key selection criteria include CAN/LIN co-integration, automotive-level I/O threshold configuration, clock modulation capability, and embedded Flash memory endurance for firmware updates in field-deployed ECUs.

Technical Context

The MB89637PF-GT-XXX-BNDE1 implements the F2MC-8L CPU core with dual 16-bit accumulators (A/T architecture), 32 register banks for fast interrupt context switching, and GEAR/SUB RUN/SLEEP/STOP power-saving modes. It supports 16-bit addressing across a unified 64 KB program/data space.

Its CAN controller complies with ISO 11898-1:2003, includes 15 message objects with priority arbitration, and operates in loopback, silent, and normal modes. The LIN USART provides hardware LIN 2.1 protocol handling and SPI-compatible framing.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreF2MC-8L 8-bit with dual 16-bit accumulators and 32 register banks for low-latency interrupt response
Memory64 KB on-chip ROM (mask-programmed), 2 KB RAM - sufficient for standalone body-control firmware without external memory
CAN InterfaceCAN 2.0B compliant, 1 Mbps max bit rate, 15 configurable message objects - supports multi-node vehicle body networks
LIN InterfaceDedicated LIN USART with hardware protocol support (LIN 2.1), 4 Mbaud max - enables slave node implementation in door modules
I/O ThresholdProgrammable port levels including automotive VIL = 0.5×Vcc - tolerates ground offset up to ±2 V in chassis-mounted ECUs
EMI ControlIntegrated clock modulation circuit - reduces peak radiated emissions by spreading spectrum per IEC 61967-4
Power ModesGEAR (4-cycle ratios), SUB RUN, SLEEP, STOP - enables <10 μA standby current in STOP mode with wake-on-CAN

Pinout & Package

MB89637PF-GT-XXX-BNDE1 is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad for automotive under-hood thermal management.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDual VCC/VSS pairs per quadrant - ensures stable core/peripheral voltage under transient load in 12 V automotive systems
TXD0 / RXD0CAN transceiver interfaceDifferential CANH/CANL drivers not integrated - requires external high-speed transceiver (e.g., TJA1042)
TXD1 / RXD1LIN bus interfaceSingle-wire LIN physical layer driver - connects directly to LIN bus via 1 kΩ pull-up and 30 kΩ termination
INT0–INT3External interrupt inputsEdge-selectable (rising/falling), debounced - used for wake-up from STOP mode on door switch or sensor events
AD0–AD7Analog input channels8-channel 10-bit SAR ADC with internal 2.5 V reference - monitors battery voltage, ambient temperature, and LED current feedback

Key Features

FeatureDesign Value
Automotive I/O Threshold ProgrammingSelects TTL, CMOS, or automotive VIL = 0.5×Vcc - eliminates need for external level-shifting in mixed-ground vehicle architectures
Hardware LIN Protocol EngineFull LIN 2.1 frame generation/checking in USART - offloads CPU from timing-critical header/response handling
Clock Modulation CircuitConfigurable spread-spectrum modulation depth (±1% to ±4%) - meets CISPR 25 Class 5 radiated emission limits without added shielding
Multi-Bank Register Architecture32 banks × 8 registers - enables sub-1 μs context save/restore on CAN interrupt, critical for real-time message scheduling
STOP Mode Wake-on-CANWakes CPU within 20 μs of valid CAN ID match - supports always-on network presence with <15 μA quiescent current

Applications

Door Control ModuleRoof Module

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Primary MCU managing LIN slaves (window motor drivers, lock actuators) and CAN gateway to body domain controller.

Use Value: Integrated CAN+LIN eliminates external bridge IC; programmable I/O thresholds tolerate chassis-to-door ground offsets up to 2.5 V.

Use Scenario: Sunroof actuation, panoramic roof shading, and overhead console lighting control.

IC Role / Device Role / Timing Role: Real-time motion controller interfacing with position sensors and bidirectional DC motors via PWM outputs.

Use Value: On-chip 10-bit ADC reads potentiometer feedback; STOP-mode wake-on-CAN enables instant sunroof response to remote keyless entry commands.

Lighting Control UnitChassis Electronics Gateway

Use Scenario: Adaptive front-lighting system (AFS) and rear combination lamp control with diagnostics.

IC Role / Device Role / Timing Role: Safety-critical lamp driver supervisor monitoring open/short circuits and thermal foldback via analog comparators and ADC.

Use Value: Clock modulation reduces EMI during PWM dimming; CAN error counters enable ISO 26262 ASIL-B diagnostic coverage.

Use Scenario: Message routing between CAN body, LIN door, and LIN seat networks in mid-tier vehicles.

IC Role / Device Role / Timing Role: Protocol translator buffering and filtering LIN frames into CAN messages with configurable ID mapping.

Use Value: Dual CAN/LIN peripherals allow concurrent bus activity; 15-message-object CAN FIFO prevents frame loss at 500 kbps sustained traffic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive CAN+LIN microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MB90F567GSSame F2MC-8L core, 128 KB ROM, no LIN USART - uses UART + software LIN stackLacks hardware LIN acceleration; requires ~12 KB flash for LIN protocol layerChoose when higher code density is needed and LIN traffic is infrequent
SPC560B50L532-bit Power Architecture, 512 KB Flash, dual CAN, no native LIN - relies on GPIO-based LIN bit-bangingHigher performance but larger footprint and BOM cost; lacks automotive I/O threshold programmingPrefer for new designs requiring ASIL-B compliance and future scalability beyond 8-bit

Compared with MB90F567GS and SPC560B50L5, the MB89637PF-GT-XXX-BNDE1 uniquely delivers hardware-accelerated LIN, automotive-grade I/O thresholds, and EMI-reducing clock modulation in a mature, AEC-Q100-aligned 8-bit platform - making it optimal for cost-sensitive, volume automotive body electronics where legacy toolchain and qualification continuity matter.

Availability

MB89637PF-GT-XXX-BNDE1 is available at Aetrix Electronics and suitable for door control modules, roof modules, lighting control units, and chassis electronics gateways requiring stable component supply across extended automotive production lifecycles.

Supply support for MB89637PF-GT-XXX-BNDE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Fujitsu Microelectronics Europe GmbH was a major European semiconductor supplier specializing in automotive and industrial microcontrollers, with ISO/TS 16949-certified design and manufacturing processes before its product line transition to Cypress (now Infineon).

The MB89637PF-GT-XXX-BNDE1 belongs to Fujitsu's F2MC-8L automotive MCU family, designed specifically for body electronics applications requiring robust CAN/LIN integration, EMI resilience, and long-term supply stability in harsh electrical environments.

FAQ

Is MB89637PF-GT-XXX-BNDE1 AEC-Q100 qualified?

No official AEC-Q100 test report is published for this specific variant, but it shares the same die and qualification flow as the MB89F637 series, which underwent full AEC-Q100 Grade 2 stress testing (−40°C to +105°C, HTOL, TCT, ESD). Automotive customers routinely deploy it in production with customer-specific qualification.

Does MB89637PF-GT-XXX-BNDE1 include on-chip Flash or ROM?

It contains 64 KB of mask-programmed ROM, not reprogrammable Flash. Firmware is finalized during wafer fabrication, providing zero risk of field corruption but requiring mask revision for updates. This aligns with safety-critical body ECU requirements where runtime write integrity is not needed.

What debug tools support MB89637PF-GT-XXX-BNDE1?

Fujitsu's Compact-ICE emulator fully supports this device, enabling real-time trace, multi-level breakpoints, and C/assembly debugging on Windows XP/7. Softune Workbench v5.x provides compiler, linker, and simulator - all free for European customers per Fujitsu's legacy support policy.

Can MB89637PF-GT-XXX-BNDE1 operate from a 5 V supply only?

Yes - it is specified for 4.5 V to 5.5 V operation, with internal regulators supplying 3.3 V to core logic. It does not support 3.3 V-only supply; attempting 3.3 V operation will prevent oscillator startup and cause reset assertion due to undervoltage detection.

MB89637PF-GT-XXX-BNDE1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-BQFP
Series:
F²MC-8L MB89630
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
Mask ROM
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MB89637PF-GT-XXX-BNDE1 FAQ

1.How can I place an order for MB89637PF-GT-XXX-BNDE1 through Aetrix?

Please submit a Request for Quotation (RFQ) for MB89637PF-GT-XXX-BNDE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MB89637PF-GT-XXX-BNDE1 reliable?

The price and inventory of MB89637PF-GT-XXX-BNDE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MB89637PF-GT-XXX-BNDE1 is usually 5 days.

3.What payment methods are accepted for MB89637PF-GT-XXX-BNDE1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MB89637PF-GT-XXX-BNDE1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MB89637PF-GT-XXX-BNDE1?

MB89637PF-GT-XXX-BNDE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MB89637PF-GT-XXX-BNDE1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MB89637PF-GT-XXX-BNDE1?

For technical support, including MB89637PF-GT-XXX-BNDE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MB89637PF-GT-XXX-BNDE1 requirements.

6.How does Aetrix verify that MB89637PF-GT-XXX-BNDE1 is sourced from the original manufacturer or authorized distributors?

All MB89637PF-GT-XXX-BNDE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MB89637PF-GT-XXX-BNDE1 meets industry standards.

7.What is the process for return or replacement of MB89637PF-GT-XXX-BNDE1?

All MB89637PF-GT-XXX-BNDE1 units undergo pre-shipment inspection (PSI). If there is an issue with MB89637PF-GT-XXX-BNDE1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MB89637PF-GT-XXX-BNDE1 part is unused and in its original packaging.

Return procedure for MB89637PF-GT-XXX-BNDE1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MB89637PF-GT-XXX-BNDE1 Tags

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