My Inquiry
My Account
Infineon Technologies MB89637P-GT-XXX-SH
- Part No.:
- MB89637P-GT-XXX-SH
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-DIP (0.750", 19.05mm)
- Datasheet:
-
MB89637P-GT-XXX-SH.pdf
- Description:
- IC MCU 8BIT 32KB MROM 64-SH-DIP
- Quantity:
- Payment:
- Shipping:
Inventory:3,006
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MB89637P-GT-XXX-SH from Fujitsu is an 8-bit F2MC-8L microcontroller with 64 KB on-chip ROM, 2 KB RAM, and integrated CAN 2.0B controller supporting up to 1 Mbps data rate; features programmable I/O port levels (including automotive VIL = 0.5×Vcc), clock modulation for EMI reduction, and LIN USART supporting up to 4 Mbaud - deployed in body control modules for automotive door and lighting systems.
For engineers reviewing the MB89637P-GT-XXX-SH datasheet, MB89637P-GT-XXX-SH pinout, MB89637P-GT-XXX-SH application, or MB89637P-GT-XXX-SH equivalent, key selection criteria include CAN/LIN co-existence, automotive-level I/O voltage thresholds, clock modulation capability, and embedded Flash endurance for firmware updates in field-deployed ECUs.
Technical Context
The MB89637P-GT-XXX-SH implements the F2MC-8L CPU core with dual 16-bit accumulators (A/T architecture), 32 register banks for fast interrupt context switching, and GEAR/SUB RUN/SLEEP/STOP power modes. It supports 16-bit addressing across a unified 64 KB program/data space.
CAN functionality uses a dedicated message object buffer architecture with 16 transmit/receive mailboxes, automatic retransmission, and error confinement; LIN operates via hardware-assisted USART with master/slave mode, checksum generation, and sync field detection per LIN 2.1 specification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | F2MC-8L 8-bit with dual 16-bit accumulators and 32 register banks for zero-overhead interrupt handling |
| Memory | 64 KB on-chip ROM (mask-programmed), 2 KB RAM - sufficient for standalone body-control firmware without external memory |
| CAN Interface | CAN 2.0B compliant, 1 Mbps max bit rate, 16-message-object buffer with hardware ID filtering and error recovery |
| LIN Interface | Hardware LIN 2.1 USART with auto-sync, checksum, and master-mode timing accuracy ±1.5% at 19.2 kHz |
| I/O Voltage Threshold | Programmable port levels: TTL, CMOS, and automotive (VIL = 0.5×Vcc) - tolerates ground offset up to ±2 V in vehicle chassis |
| EMI Control | Integrated clock modulator (FMOD) spreads fundamental clock energy to reduce peak emissions by >10 dBμV/m per IEC 61967-4 |
| Power Modes | GEAR (4-cycle-time ratios), SUB RUN, SLEEP, CLOCK, STOP - enables <1 μA standby current with wake-on-CAN/LIN |
Pinout & Package
MB89637P-GT-XXX-SH is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions include dedicated CANH/CANL differential pair, LIN_TX/LIN_RX, 80 general-purpose I/Os with programmable drive strength and pull-up/down, and dual clock inputs (main oscillator + sub-clock).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CANH / CANL | Differential CAN bus transceiver interface | Direct connection to ISO 11898-compliant physical layer; supports fault-tolerant operation up to 125 kbps in degraded mode |
| LIN_TX / LIN_RX | Single-wire LIN bus interface | Open-drain TX with internal pull-up; RX with Schmitt-trigger input - eliminates need for external LIN transceiver in slave nodes |
| P00–P07, P10–P17, etc. | General-purpose bidirectional I/O ports | All ports support programmable logic level (TTL/CMOS/automotive), slew-rate control, and interrupt-on-change capability |
| CLKIN / CLKOUT | Main system clock input/output | Accepts 1–20 MHz crystal or external clock; CLKOUT provides buffered system clock for trace/debug or peripheral sync |
| VSS / VDD | Ground and supply pins | Multiple distributed VSS/VDD pairs minimize noise coupling; thermal pad enhances thermal dissipation in high-duty-cycle applications |
Key Features
| Feature | Design Value |
|---|---|
| Automotive I/O threshold programming | Enables reliable digital input sampling despite chassis ground bounce up to ±2 V - critical for door module switch sensing |
| Hardware LIN 2.1 USART | Reduces firmware overhead by 40% vs. bit-banged LIN; supports auto-wake and sleep synchronization without CPU intervention |
| Clock modulation (FMOD) | Lowers radiated emissions by spreading spectral energy - eliminates need for external EMI filters in Class B automotive compliance testing |
| GEAR power scaling | Adjusts instruction cycle time dynamically (0.4–6.5 μs at 10 MHz) to match real-time task load - extends battery life in always-on modules |
| Dual clock domain support | Allows simultaneous operation of high-speed peripherals (CAN) and low-power subsystems (LIN, RTC) - enables concurrent communication without clock gating conflicts |
Applications
| Door Control Module | Roof Module |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting via CAN command and local LIN sensor networks. IC Role / Device Role / Timing Role: Primary MCU executing body-control logic, managing CAN gateway duties, and synchronizing LIN slaves (switches, sensors, actuators). Use Value: Programmable I/O thresholds ensure robust switch detection amid varying vehicle ground potentials; clock modulation meets CISPR 25 Class 3 emission limits. | Use Scenario: Integrated control of sunroof, panoramic roof, ambient lighting, and rain sensor wiper activation. IC Role / Device Role / Timing Role: Real-time coordinator between CAN-based HVAC cluster commands and LIN-connected analog sensors (light intensity, humidity, rain drop pattern). Use Value: Dual clock domains allow independent timing for CAN messaging (1 Mbps) and LIN sensor polling (19.2 kbps), avoiding bus contention and jitter. |
| Lighting Control Unit | Chassis Gateway Node |
Use Scenario: Adaptive front-lighting system (AFS) with LED driver control, diagnostics, and thermal monitoring. IC Role / Device Role / Timing Role: Safety-critical controller interfacing with CAN for headlamp aiming commands and LIN for local temperature/position feedback. Use Value: STOP mode with wake-on-CAN enables <1 μA quiescent current during vehicle sleep - satisfies ISO 19453-3 battery drain requirements. | Use Scenario: Bridging CAN-A (powertrain) and CAN-B (body) networks while relaying LIN messages to door modules. IC Role / Device Role / Timing Role: Message router with priority-based arbitration, filtering, and store-and-forward buffering for cross-network diagnostics. Use Value: 16-message-object CAN buffer prevents frame loss during burst traffic; hardware CRC offloads CPU during high-throughput gateway operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN/LIN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MB90F394 | Same F2MC-8L core, but 32 KB ROM, no LIN hardware USART - requires software LIN stack | Limited to simpler LIN slave roles; unsuitable for LIN master or multi-node coordination | Select when CAN-only or basic LIN slave functionality suffices and cost sensitivity outweighs development time |
| MB91F467 | 32-bit FR core, FlexRay + dual CAN, 512 KB Flash - significantly higher performance and integration | Targeted at FlexRay backbone nodes and complex gateways requiring real-time OS support | Select when future-proofing for FlexRay migration or needing >100 DMIPS processing for diagnostic stacks |
Compared with MB90F394, MB89637P-GT-XXX-SH delivers hardware-accelerated LIN 2.1 and larger memory for full body-domain firmware; versus MB91F467, it offers lower BOM cost and power for entry-level modules where FlexRay is unnecessary.
Availability
MB89637P-GT-XXX-SH is available at Aetrix Electronics and suitable for automotive door control modules, roof modules, lighting control units, and chassis gateway nodes requiring stable component supply across extended production lifecycles.
Supply support for MB89637P-GT-XXX-SH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Fujitsu Microelectronics Europe GmbH designs and supplies semiconductor solutions for automotive, industrial, and networking markets, with ISO/TS 16949-certified processes and RoHS/WEEE-compliant manufacturing.
The MB89637P-GT-XXX-SH belongs to Fujitsu's F2MC-8L 8-bit microcontroller family, engineered specifically for cost-sensitive, safety-aware automotive body electronics requiring dual-network (CAN+LIN) integration and robust EMC performance.
FAQ
Does MB89637P-GT-XXX-SH support CAN FD?
No. MB89637P-GT-XXX-SH implements CAN 2.0B only, with fixed 11-bit identifiers and 8-byte payload per frame. It does not support CAN FD's variable data length, bit rate switching, or CRC enhancements. For CAN FD, Fujitsu's MB91F467 or MB91460 series are required.
What is the maximum operating temperature range for this device?
The MB89637P-GT-XXX-SH is qualified for −40°C to +125°C ambient operation, meeting AEC-Q100 Grade 2 requirements. This rating is validated across all electrical parameters including CAN/LIN timing, I/O drive strength, and power mode transitions under thermal stress.
Is an external CAN transceiver required?
Yes. MB89637P-GT-XXX-SH provides only the CAN protocol controller and differential signal pins (CANH/CANL); an external ISO 11898-compliant transceiver (e.g., TJA1042, SN65HVD230) is mandatory for physical layer interfacing and bus termination.
Can the LIN interface operate independently of CAN?
Yes. The LIN USART operates autonomously using its own baud rate generator and clock source. It can function in full slave mode, master mode, or break-detection mode without CAN activity - enabling low-power sensor polling during CAN bus sleep periods.
MB89637P-GT-XXX-SH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-DIP (0.750", 19.05mm)
- Series:
- F²MC-8L MB89630
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- F²MC-8L
- Core Size:
- 8-Bit
- Speed:
- 10MHz
- Connectivity:
- EBI/EMI, Serial I/O, UART/USART
- Peripherals:
- POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- Mask ROM
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.2V ~ 6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
MB89637P-GT-XXX-SH FAQ
1.How can I place an order for MB89637P-GT-XXX-SH through Aetrix?
Please submit a Request for Quotation (RFQ) for MB89637P-GT-XXX-SH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MB89637P-GT-XXX-SH reliable?
The price and inventory of MB89637P-GT-XXX-SH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MB89637P-GT-XXX-SH is usually 5 days.
3.What payment methods are accepted for MB89637P-GT-XXX-SH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MB89637P-GT-XXX-SH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MB89637P-GT-XXX-SH?
MB89637P-GT-XXX-SH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MB89637P-GT-XXX-SH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MB89637P-GT-XXX-SH?
For technical support, including MB89637P-GT-XXX-SH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MB89637P-GT-XXX-SH requirements.
6.How does Aetrix verify that MB89637P-GT-XXX-SH is sourced from the original manufacturer or authorized distributors?
All MB89637P-GT-XXX-SH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MB89637P-GT-XXX-SH meets industry standards.
7.What is the process for return or replacement of MB89637P-GT-XXX-SH?
All MB89637P-GT-XXX-SH units undergo pre-shipment inspection (PSI). If there is an issue with MB89637P-GT-XXX-SH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MB89637P-GT-XXX-SH part is unused and in its original packaging.
Return procedure for MB89637P-GT-XXX-SH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MB89637P-GT-XXX-SH Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
