My Inquiry
My Account
Infineon Technologies MB90F583BPF-GE1
- Part No.:
- MB90F583BPF-GE1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
MB90F583BPF-GE1.pdf
- Description:
- IC MCU 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,402
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MB90F583BPF-GE1 from Infineon Technologies is a 16-bit microcontroller unit (MCU) based on the Fujitsu F2MC-16LX core, operating at up to 33 MHz, featuring 256 KB Flash memory, 16 KB RAM, and integrated CAN 2.0B controller. It targets automotive body control modules requiring real-time I/O handling and communication robustness.
For engineers reviewing the MB90F583BPF-GE1 datasheet, MB90F583BPF-GE1 pinout, MB90F583BPF-GE1 application, or MB90F583BPF-GE1 equivalent, key selection criteria include CAN interface compliance, Flash endurance (100K write/erase cycles), operating temperature range (–40°C to +125°C), and LQFP-100 package thermal performance in under-hood environments.
Technical Context
The MB90F583BPF-GE1 implements the F2MC-16LX CPU core with 16-bit data bus and 24-bit address bus, supporting instruction execution in single-cycle for most operations. It integrates a 3-channel 16-bit timer/counter, 2-channel PWM generator, and 12-bit ADC with 16 input channels.
Its on-chip peripheral set includes a multi-master I²C interface, UART with LIN support, and a dedicated CAN 2.0B controller with 32 message objects and programmable acceptance filtering. Memory protection unit (MPU) enforces code/data access restrictions across four regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | F2MC-16LX 16-bit RISC core, supports 33 MHz max clock for deterministic real-time response in body control tasks |
| Flash Memory | 256 KB on-chip Flash with 100K write/erase cycles, enabling field firmware updates without external storage |
| RAM | 16 KB SRAM with parity checking, providing error-detectable working memory for safety-critical routines |
| CAN Interface | One CAN 2.0B controller with 32 message objects and hardware acceptance filtering, reducing host CPU load in vehicle network nodes |
| ADC | 12-bit successive approximation ADC with 16 input channels and 1.25 µs conversion time, suitable for sensor signal acquisition in HVAC and lighting systems |
| Operating Temp | –40°C to +125°C ambient, qualified per AEC-Q100 Grade 2, enabling direct placement in engine compartment proximity |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), compatible with standard reflow profiles and automotive PCB layout practices |
Pinout & Package
MB90F583BPF-GE1 is housed in a 100-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, optimized for heat dissipation in high-duty-cycle automotive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground pins | Dedicated analog/digital power domains with separate decoupling requirements per datasheet Section 5.2 |
| TXD0/RXD0 | UART0 serial interface | Full-duplex asynchronous communication channel supporting LIN physical layer conformance |
| CANTX/CANRX | CAN 2.0B differential transceiver interface | Direct connection to ISO 11898-compliant CAN transceiver (e.g., TJA1042), no level-shifting required |
| AD0–AD15 | Analog input channels | 16 multiplexed inputs for 12-bit ADC; internal reference selectable between VREFH/VREFL or AVCC/AVSS |
| PA0–PA15, PB0–PB15, etc. | Programmable I/O ports | Bi-directional ports with configurable pull-up/down, slew rate control, and noise filter for switch debouncing |
Key Features
| Feature | Design Value |
|---|---|
| On-chip CAN 2.0B controller | Reduces external component count by eliminating need for discrete CAN protocol IC in body ECU designs |
| Memory Protection Unit (MPU) | Enables ASIL-B compliant software partitioning by preventing unauthorized access between application and bootloader memory regions |
| 12-bit ADC with scan mode | Supports automatic sequential conversion of up to 16 channels without CPU intervention, improving sensor polling efficiency |
| Low-power stop mode with wake-up via CAN/IRQ | Draws <5 µA in stop mode while retaining RAM content and enabling CAN bus activity detection for rapid system wake-up |
| Hardware CRC generator | Accelerates flash integrity checks during boot and OTA update verification, meeting UNECE R155 cybersecurity requirements |
Applications
| Body Control Module (BCM) | Door Control Unit (DCU) |
|---|---|
Use Scenario: Centralized management of door locks, window lifts, mirror adjustment, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing real-time motor control algorithms and coordinating LIN slave devices via UART. Use Value: Integrated PWM and ADC enable direct drive of small DC motors and analog sensor interfacing without external signal conditioning. | Use Scenario: Localized control of power windows and side mirrors with anti-pinch detection using current sensing. IC Role / Device Role / Timing Role: Standalone node communicating over CAN bus to BCM while performing local safety-critical timing functions. Use Value: Hardware CRC and MPU allow secure firmware updates and runtime memory isolation required for ISO 26262 ASIL-B compliance. |
| Roof Module Controller | Seat Control Unit |
Use Scenario: Actuation of sunroof, panoramic roof, and ambient lighting with position feedback and thermal monitoring. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating potentiometer, thermistor, and Hall effect inputs via 12-bit ADC and GPIO interrupts. Use Value: 16 KB RAM with parity supports concurrent execution of motor control, thermal shutdown logic, and CAN message buffering. | Use Scenario: Motorized seat position adjustment with memory recall, heating, and occupancy detection. IC Role / Device Role / Timing Role: Real-time motion controller interfacing with dual H-bridge drivers and resistive seat sensor arrays. Use Value: 3-channel 16-bit timer provides precise PWM generation for bidirectional DC motor control with variable speed ramping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Renesas RL78/F13 | 16-bit RL78 core, 128 KB Flash, no on-chip CAN controller (requires external transceiver + protocol handling) | Limited to LIN-only or low-bandwidth CAN via software stack; lower integration for cost-sensitive entry-level modules | Select when CAN traffic volume is low and BOM cost reduction outweighs real-time CAN offload benefits |
| NXP S9S12G128 | 16-bit HCS12X core, 128 KB Flash, dual CAN controllers, but only 8 KB RAM and no hardware CRC accelerator | Better CAN scalability for multi-node networks, but lacks memory protection and cryptographic acceleration for modern cybersecurity mandates | Prefer for legacy platform continuity where existing HCS12 toolchains and CAN driver libraries are already validated |
Compared with RL78/F13 and S9S12G128, MB90F583BPF-GE1 delivers higher Flash density, integrated CAN hardware offload, and built-in security features-making it optimal for new ASIL-B-compliant body electronics designs requiring long-term software maintainability and functional safety certification.
Availability
MB90F583BPF-GE1 is available at Aetrix Electronics and suitable for automotive body control modules, door control units, and roof module controllers requiring stable component supply across extended production lifecycles.
Supply support for MB90F583BPF-GE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global manufacturing and qualification infrastructure.
The MB90F583BPF-GE1 belongs to Infineon's legacy Fujitsu-derived automotive MCU portfolio, designed specifically for cost-optimized, high-reliability body electronics applications meeting AEC-Q100 Grade 2 and ISO 26262 ASIL-B requirements.
FAQ
What is the maximum operating frequency of the MB90F583BPF-GE1?
The MB90F583BPF-GE1 operates at a maximum CPU clock frequency of 33 MHz, achieved using an external crystal oscillator or ceramic resonator. This frequency enables deterministic interrupt latency and real-time response for automotive body control tasks such as window lift timing and lock actuation sequencing.
Does the MB90F583BPF-GE1 support in-circuit debugging?
Yes, the MB90F583BPF-GE1 supports on-chip debugging via the dedicated JTAG interface (TCK/TMS/TDI/TDO pins), allowing full breakpoint control, register inspection, and flash programming without requiring external debug probes beyond standard JTAG adapters compliant with IEEE 1149.1.
Is the MB90F583BPF-GE1 qualified for automotive use?
Yes, the MB90F583BPF-GE1 is AEC-Q100 qualified to Grade 2 (–40°C to +125°C), with failure mechanisms analyzed per stress test conditions including HTOL, TC, and ESD. It meets automotive reliability standards for body electronics deployed outside the engine compartment but within cabin or under-hood enclosures.
What development tools are supported for this MCU?
Infineon provides the F2MC-16LX compiler toolchain (including C compiler, assembler, and linker), along with the F2MC-16LX Evaluation Board and Flash programming utilities. Third-party IDEs like IAR Embedded Workbench and Renesas CS+ also support this core via custom configuration files and device description databases.
MB90F583BPF-GE1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- F²MC-16LX MB90580B
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- -
- Core Size:
- -
- Speed:
- -
- Connectivity:
- -
- Peripherals:
- -
- Number of I/O:
- -
- Program Memory Size:
- -
- Program Memory Type:
- -
- EEPROM Size:
- -
- RAM Size:
- -
- Voltage - Supply (Vcc/Vdd):
- -
- Data Converters:
- -
- Oscillator Type:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MB90F583BPF-GE1 FAQ
1.How can I place an order for MB90F583BPF-GE1 through Aetrix?
Please submit a Request for Quotation (RFQ) for MB90F583BPF-GE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MB90F583BPF-GE1 reliable?
The price and inventory of MB90F583BPF-GE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MB90F583BPF-GE1 is usually 5 days.
3.What payment methods are accepted for MB90F583BPF-GE1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MB90F583BPF-GE1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MB90F583BPF-GE1?
MB90F583BPF-GE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MB90F583BPF-GE1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MB90F583BPF-GE1?
For technical support, including MB90F583BPF-GE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MB90F583BPF-GE1 requirements.
6.How does Aetrix verify that MB90F583BPF-GE1 is sourced from the original manufacturer or authorized distributors?
All MB90F583BPF-GE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MB90F583BPF-GE1 meets industry standards.
7.What is the process for return or replacement of MB90F583BPF-GE1?
All MB90F583BPF-GE1 units undergo pre-shipment inspection (PSI). If there is an issue with MB90F583BPF-GE1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MB90F583BPF-GE1 part is unused and in its original packaging.
Return procedure for MB90F583BPF-GE1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MB90F583BPF-GE1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
