Infineon Technologies MB90F583CPF-GE1
- Part No.:
- MB90F583CPF-GE1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-BQFP
- Datasheet:
-
MB90F583CPF-GE1.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 100QFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,634
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MB90F583CPF-GE1 from Infineon Technologies is a 16-bit microcontroller with 128KB on-chip flash memory, 8KB RAM, and integrated CAN 2.0B controller, designed for automotive body electronics and industrial control applications requiring real-time deterministic response.
For engineers reviewing the MB90F583CPF-GE1 datasheet, MB90F583CPF-GE1 pinout, MB90F583CPF-GE1 application, or MB90F583CPF-GE1 equivalent, key selection criteria include CAN interface compliance, flash endurance (100K write/erase cycles), operating temperature range (–40°C to +125°C), and QFP-100 package compatibility with automotive PCB layout standards.
Technical Context
The MB90F583CPF-GE1 implements the Fujitsu FR family 16-bit CPU core with 3-stage pipeline execution, supporting up to 33 MHz operation. It integrates a 16-channel 10-bit ADC, 32-bit watchdog timer, and 4-channel 16-bit PWM with dead-time insertion for motor control.
Its peripheral set includes a full-duplex UART, I²C-compatible serial interface, and 32-bit real-time counter with calendar function. The device supports in-circuit debugging via JTAG and features ROM-based bootloader for field firmware updates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Fujitsu FR 16-bit RISC core with 3-stage pipeline, enabling deterministic interrupt latency ≤2 µs at 33 MHz |
| Flash Memory | 128 KB on-chip flash with 100K write/erase cycles and 10-year data retention at 85°C |
| RAM | 8 KB SRAM with parity error detection for safety-critical data storage |
| CAN Interface | One CAN 2.0B controller supporting bit rates up to 1 Mbps and message filtering with 32 mailboxes |
| ADC | 16-channel 10-bit successive approximation ADC with conversion time of 1.2 µs per channel |
| Operating Temp | –40°C to +125°C ambient, qualified per AEC-Q100 Grade 2 for automotive under-hood use |
| Package | 100-pin plastic quad flat pack (QFP) with 0.5 mm pitch, JEDEC MS-026 compliant |
Pinout & Package
MB90F583CPF-GE1 is housed in a 100-pin QFP package (14 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad for enhanced heat dissipation in automotive modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground pins | Dual 5V supply domains: VDDA for analog peripherals, VDDD for digital core; separate ground returns reduce noise coupling |
| TXD0/RXD0 | UART0 serial interface | Asynchronous full-duplex communication at up to 2 Mbps; supports LIN physical layer via software configuration |
| CANTX/CANRX | CAN transceiver interface | Differential bus drivers compliant with ISO 11898-2; internal pull-ups enable direct connection to external CAN PHY |
| AD0–AD15 | Analog input channels | Multiplexed 16-channel ADC inputs; dedicated reference voltage pins (AVREFH/AVREFL) support ratiometric sensor measurements |
| PA0–PA15 | General-purpose I/O port A | Bi-directional port with programmable pull-up, open-drain option, and edge-triggered interrupt capability per pin |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0B controller | Enables direct implementation of automotive body networks without external CAN PHY or protocol stack overhead |
| ROM-based bootloader | Supports firmware updates over UART or CAN, eliminating need for external programming hardware in production |
| Parity-protected RAM | Real-time detection of single-bit memory errors in critical control variables, meeting ASIL-B functional safety requirements |
| 10-bit 16-channel ADC | Simultaneous sampling across multiple sensors (e.g., HVAC blower speed, cabin temperature, humidity) with <1.2 µs conversion time |
| AEC-Q100 Grade 2 qualification | Validated for continuous operation at 125°C junction temperature, suitable for engine bay and lighting control modules |
Applications
| Automotive Door Module | Industrial Motor Drive Controller |
|---|---|
Use Scenario: Centralized control of power windows, mirrors, locks, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main system controller executing CAN message handling, PWM motor drive timing, and ADC-based position feedback sampling. Use Value: Integrated CAN and 16-bit PWM eliminate discrete interface ICs; 125°C rating enables placement near door latch actuators without heatsinking. | Use Scenario: Closed-loop speed and torque control of 3-phase BLDC motors in HVAC blowers and conveyor systems. IC Role / Device Role / Timing Role: Real-time motor commutation sequencer using hardware PWM with synchronized ADC sampling of current sense signals. Use Value: 16-bit resolution and 1.2 µs ADC conversion allow precise current loop control at 20 kHz switching frequency. |
| Body Control Module (BCM) | Smart Lighting Control Unit |
Use Scenario: Centralized management of exterior lighting, wipers, horn, and battery load monitoring in modern BCM architectures. IC Role / Device Role / Timing Role: Primary MCU managing CAN gateway functions, GPIO-driven relay control, and low-power sleep/wake scheduling. Use Value: 8 KB parity RAM ensures integrity of fault logs and diagnostic trouble codes stored during vehicle ignition-off periods. | Use Scenario: Adaptive LED headlight beam shaping and dimming control in automotive front lighting systems. IC Role / Device Role / Timing Role: Timing-critical PWM generator for multi-channel LED current regulation with synchronized thermal monitoring via ADC. Use Value: 32-bit RTC with calendar function enables time-based dimming profiles; CAN interface allows dynamic reconfiguration by central ADAS ECU. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Renesas RL78/F13 | 16-bit RL78 core, 128KB flash, but lacks integrated CAN controller; requires external CAN transceiver and protocol stack | Suitable for cost-sensitive non-CAN body nodes (e.g., seat control), not drop-in for CAN-based door modules | Select if CAN is not required and lower active power (120 µA/MHz) is prioritized over interface integration |
| NXP S12XEP100 | 16-bit HCS12X core, 1MB flash, dual CAN controllers, but larger 144-pin LQFP package and higher BOM cost | Better suited for high-end BCMs with dual CAN buses and complex diagnostics, not compact door modules | Choose when dual CAN, EEPROM emulation, and enhanced debug trace are needed despite footprint and cost increase |
Compared with RL78/F13 and S12XEP100, MB90F583CPF-GE1 delivers optimal balance of CAN integration, thermal robustness, and QFP-100 footprint for space-constrained automotive body control nodes requiring single-CAN connectivity and AEC-Q100 Grade 2 compliance.
Availability
MB90F583CPF-GE1 is available at Aetrix Electronics and suitable for automotive door modules, body control units, and industrial motor drives requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant performance.
Supply support for MB90F583CPF-GE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The MB90F583CPF-GE1 belongs to Infineon's legacy Fujitsu FR-based automotive MCU family, engineered specifically for cost-effective, thermally robust body electronics control where CAN integration and AEC-Q100 compliance are mandatory.
FAQ
What is the maximum operating frequency of the MB90F583CPF-GE1?
The MB90F583CPF-GE1 operates at a maximum CPU clock frequency of 33 MHz, achieved using an internal PLL that multiplies the external crystal oscillator input (typically 4–8 MHz). This frequency enables real-time execution of CAN message processing, ADC sampling, and PWM generation within strict automotive timing budgets.
Does MB90F583CPF-GE1 support in-system programming (ISP)?
Yes, MB90F583CPF-GE1 supports in-system programming via its built-in ROM bootloader, accessible through UART or CAN interfaces. No external programmer is required-firmware updates can be performed in the field using standard CAN messages or UART commands, with checksum verification and flash sector locking for security.
Is the MB90F583CPF-GE1 pin-compatible with other MB90F5xx devices?
No, MB90F583CPF-GE1 is not fully pin-compatible with earlier MB90F5xx variants due to differences in peripheral mapping and power pin allocation. Specifically, the VDDA/VSSA analog supply pins and CANRX/CANTX locations differ from MB90F548, requiring PCB redesign for migration.
What debug interface does MB90F583CPF-GE1 provide?
The MB90F583CPF-GE1 provides a 5-pin JTAG interface compliant with IEEE 1149.1, supporting full boundary-scan testing, real-time register inspection, and non-intrusive breakpoint setting. Debug access remains available even when the device is running from internal flash or ROM bootloader mode.
MB90F583CPF-GE1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-BQFP
- Series:
- F²MC-16LX MB90580C
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- F²MC-16LX
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- SCI, UART/USART
- Peripherals:
- POR, WDT
- Number of I/O:
- 77
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Data Converters:
- A/D 8x8/10b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MB90F583CPF-GE1 FAQ
1.How can I place an order for MB90F583CPF-GE1 through Aetrix?
Please submit a Request for Quotation (RFQ) for MB90F583CPF-GE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MB90F583CPF-GE1 reliable?
The price and inventory of MB90F583CPF-GE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MB90F583CPF-GE1 is usually 5 days.
3.What payment methods are accepted for MB90F583CPF-GE1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MB90F583CPF-GE1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MB90F583CPF-GE1?
MB90F583CPF-GE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MB90F583CPF-GE1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MB90F583CPF-GE1?
For technical support, including MB90F583CPF-GE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MB90F583CPF-GE1 requirements.
6.How does Aetrix verify that MB90F583CPF-GE1 is sourced from the original manufacturer or authorized distributors?
All MB90F583CPF-GE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MB90F583CPF-GE1 meets industry standards.
7.What is the process for return or replacement of MB90F583CPF-GE1?
All MB90F583CPF-GE1 units undergo pre-shipment inspection (PSI). If there is an issue with MB90F583CPF-GE1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MB90F583CPF-GE1 part is unused and in its original packaging.
Return procedure for MB90F583CPF-GE1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MB90F583CPF-GE1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

