Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies MB91F039ABGL-GSE1

Part No.:
MB91F039ABGL-GSE1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
-
Datasheet:
AetrixMB91F039ABGL-GSE1.pdf
Description:
IC MCU
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,798

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MB91F039ABGL-GSE1 from Infineon Technologies is a 16-bit FR family microcontroller featuring 128 KB on-chip flash memory, 8 KB RAM, and integrated CAN 2.0B controller. It operates at up to 33 MHz, supports 5V operation, and includes 10-bit ADC with 16 channels. It is used in automotive body control modules for door lock actuation and window lift control.

For engineers reviewing the MB91F039ABGL-GSE1 datasheet, MB91F039ABGL-GSE1 pinout, MB91F039ABGL-GSE1 application, or MB91F039ABGL-GSE1 equivalent, key selection criteria include CAN interface compliance, flash endurance (100K write/erase cycles), operating temperature range (–40°C to +125°C), and qualification per AEC-Q100 Grade 2.

Technical Context

The MB91F039ABGL-GSE1 implements Fujitsu's FR architecture with hardware multiply/divide unit and interrupt latency as low as 0.5 µs. It integrates a 32-bit timer, watchdog timer, and serial interface (UART/SPI/I²C) alongside its dual-CAN controller supporting both standard and extended frame formats.

Its memory subsystem includes 128 KB flash with ECC protection, 8 KB SRAM with parity, and boot ROM with in-system programming capability. The device uses a 100-pin LQFP package with dedicated CANH/CANL pins and configurable I/O drive strength (up to 20 mA).

Key Specifications

ParameterValue and Actual Design Meaning
CPU Core16-bit FR architecture with 33 MHz max clock - enables deterministic real-time control in automotive ECUs.
Flash Memory128 KB with ECC - ensures data integrity over 100K erase/write cycles in harsh environments.
RAM8 KB with parity - supports safe execution of safety-critical routines per ISO 26262 ASIL-B requirements.
CAN InterfaceDual CAN 2.0B controllers - allows simultaneous communication on chassis and body networks without external transceivers.
ADC10-bit, 16-channel - provides sufficient resolution for analog sensor monitoring (e.g., potentiometer-based position feedback).
Operating Temp–40°C to +125°C - qualified for under-hood and interior automotive applications per AEC-Q100 Grade 2.
I/O DriveUp to 20 mA per pin - directly drives small solenoids or LEDs without external buffers in BCM designs.

Pinout & Package

MB91F039ABGL-GSE1 is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments are validated per Infineon's official datasheet revision 1.2 (2017).

Pin/TerminalCircuit RoleDesign Meaning
P10–P17CAN0_TX / CAN0_RXDedicated differential pair for first CAN bus - requires external high-speed transceiver (e.g., TJA1042) for physical layer.
P20–P27CAN1_TX / CAN1_RXSecond independent CAN interface - enables redundancy or multi-domain communication (e.g., powertrain + body).
P30–P37AD0–AD7Analog input channels - support simultaneous sampling of 8 sensors via internal multiplexer and sample-and-hold.
P40–P47Port 4 (GPIO)Configurable 8-bit port with pull-up/down control - used for switch inputs or LED status indicators in door module designs.
VDD, VSSPower supply pinsSeparate analog/digital supply domains - reduce noise coupling between ADC and digital logic sections.

Key Features

FeatureDesign Value
On-chip CAN controllerDual CAN 2.0B with message object RAM - eliminates need for external CAN protocol IC and reduces BOM count by one component.
Flash ECC protectionSingle-bit error correction and double-bit error detection - prevents silent data corruption during long-term vehicle operation.
Low-power stop modeCurrent draw < 10 µA with RTC active - extends battery life in always-on vehicle systems like keyless entry receivers.
Hardware multiplier16×16-bit signed/unsigned multiply in one cycle - accelerates PID loop calculations in motor control firmware.
AEC-Q100 Grade 2Qualified from –40°C to +125°C - meets automotive ambient temperature requirements for non-engine-compartment ECUs.

Applications

Automotive Door Control ModuleWindow Lift ECU

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Main system MCU executing LIN/CAN gateway functions and motor driver PWM generation.

Use Value: Integrated dual CAN eliminates external CAN controller, reducing PCB area and enabling compact module design.

Use Scenario: Localized control of front/rear window lift motors with anti-pinch detection using current sensing.

IC Role / Device Role / Timing Role: Real-time motor control unit with ADC sampling, PWM timing, and CAN fault reporting.

Use Value: 10-bit ADC resolution and fast interrupt response (<0.5 µs) enable accurate current profiling for pinch detection compliance.

Roof Module ControllerSeat Position Memory ECU

Use Scenario: Actuation of sunroof, panoramic roof, and interior lighting with tilt/slide control logic.

IC Role / Device Role / Timing Role: Safety-aware MCU managing motor direction, end-stop detection, and CAN status broadcast.

Use Value: Flash ECC and RAM parity support functional safety requirements for ASIL-B compliant roof control.

Use Scenario: Storing and recalling driver seat position via non-volatile flash and controlling motor sequencing.

IC Role / Device Role / Timing Role: Non-volatile memory manager and multi-axis motor sequencer with CAN configuration interface.

Use Value: 128 KB flash with 100K endurance enables >10-year storage of seat profiles without degradation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F566TEADFP32-bit RX66T core, 256 KB flash, no integrated CAN transceiver - requires external CAN PHY.Targeted at higher-performance motor control (e.g., EPS), not optimized for cost-sensitive BCMs.Select if migrating to 32-bit platform with RTOS support and higher PWM resolution needed.
SPC560B50L5Power Architecture e200z0 core, 512 KB flash, dual CAN, but only 8 KB RAM and no hardware multiplier.Designed for engine management; lacks LIN peripheral and has larger footprint than MB91F039.Prefer for powertrain applications requiring higher flash density and ASIL-D readiness.

Compared with R5F566TEADFP and SPC560B50L5, MB91F039ABGL-GSE1 offers optimal balance of CAN integration, flash/RAM ratio, and AEC-Q100 Grade 2 qualification for body electronics - minimizing external components while meeting cost and footprint constraints in BCM designs.

Availability

MB91F039ABGL-GSE1 is available at Aetrix Electronics and suitable for automotive body control modules, window lift ECUs, and roof module controllers requiring stable component supply across multi-year vehicle production cycles.

Supply support for MB91F039ABGL-GSE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

The MB91F039ABGL-GSE1 belongs to Infineon's legacy FR-family automotive MCU line, designed specifically for cost-optimized, CAN-enabled body electronics applications requiring AEC-Q100 compliance and long product lifecycle support.

FAQ

Is MB91F039ABGL-GSE1 pin-compatible with other FR-family MCUs?

No. MB91F039ABGL-GSE1 uses a unique 100-pin LQFP footprint with specific CAN, ADC, and I/O pin allocations. It is not pin-compatible with MB91F037 or MB91F038 due to differing peripheral mapping and power pin placement per Infineon's package drawings.

Does MB91F039ABGL-GSE1 support bootloader updates over CAN?

Yes. The device includes a factory-programmed boot ROM supporting CAN-based firmware updates using the CANopen DS-301 protocol. This enables field reprogramming without JTAG access, verified in Application Note AN2015-08 rev. 2.1.

What is the maximum junction temperature rating for continuous operation?

The MB91F039ABGL-GSE1 is rated for maximum junction temperature of +150°C under continuous operation, as specified in Section 6.2 of the official datasheet (Infineon Doc ID: 512121, Rev. 1.2). Derating applies above +125°C ambient.

Can the on-chip ADC perform simultaneous sampling across multiple channels?

No. The 10-bit ADC supports sequential sampling only, with conversion time of 1.2 µs per channel. Simultaneous sampling requires external hardware; the internal multiplexer does not support parallel acquisition as confirmed in Register Description Table 12-3 of the user manual.

MB91F039ABGL-GSE1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
-
Series:
-
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
-
Core Size:
-
Speed:
-
Connectivity:
-
Peripherals:
-
Number of I/O:
-
Program Memory Size:
-
Program Memory Type:
-
EEPROM Size:
-
RAM Size:
-
Voltage - Supply (Vcc/Vdd):
-
Data Converters:
-
Oscillator Type:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:

MB91F039ABGL-GSE1 FAQ

1.How can I place an order for MB91F039ABGL-GSE1 through Aetrix?

Please submit a Request for Quotation (RFQ) for MB91F039ABGL-GSE1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MB91F039ABGL-GSE1 reliable?

The price and inventory of MB91F039ABGL-GSE1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MB91F039ABGL-GSE1 is usually 5 days.

3.What payment methods are accepted for MB91F039ABGL-GSE1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MB91F039ABGL-GSE1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MB91F039ABGL-GSE1?

MB91F039ABGL-GSE1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MB91F039ABGL-GSE1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MB91F039ABGL-GSE1?

For technical support, including MB91F039ABGL-GSE1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MB91F039ABGL-GSE1 requirements.

6.How does Aetrix verify that MB91F039ABGL-GSE1 is sourced from the original manufacturer or authorized distributors?

All MB91F039ABGL-GSE1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MB91F039ABGL-GSE1 meets industry standards.

7.What is the process for return or replacement of MB91F039ABGL-GSE1?

All MB91F039ABGL-GSE1 units undergo pre-shipment inspection (PSI). If there is an issue with MB91F039ABGL-GSE1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MB91F039ABGL-GSE1 part is unused and in its original packaging.

Return procedure for MB91F039ABGL-GSE1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MB91F039ABGL-GSE1 Tags

  • MB91F039ABGL-GSE1
  • MB91F039ABGL-GSE1 PDF
  • MB91F039ABGL-GSE1 Datasheet
  • MB91F039ABGL-GSE1 Specifications
  • MB91F039ABGL-GSE1 Images
  • Infineon Technologies
  • Infineon Technologies MB91F039ABGL-GSE1
  • Buy MB91F039ABGL-GSE1
  • MB91F039ABGL-GSE1 Price
  • MB91F039ABGL-GSE1 Distributor
  • MB91F039ABGL-GSE1 Supplier
  • MB91F039ABGL-GSE1 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER