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Infineon Technologies MB95F778MNPMC1-G-SNE2

Part No.:
MB95F778MNPMC1-G-SNE2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixMB95F778MNPMC1-G-SNE2.pdf
Description:
IC MCU 8BIT 60KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,811

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Product details

Overview

MB95F778MNPMC1-G-SNE2 from Cypress Semiconductor is an 8-bit microcontroller based on the F2MC-8FX CISC core, operating at up to 20 MHz with 64 KB flash memory and 4 KB RAM. It integrates a 10-bit ADC (16 channels), LIN-UART, I²C, and CAN 2.0B interfaces, and targets automotive body control modules requiring robust serial communication and real-time sensor interfacing.

For engineers reviewing the MB95F778MNPMC1-G-SNE2 datasheet, MB95F778MNPMC1-G-SNE2 pinout, MB95F778MNPMC1-G-SNE2 application, or MB95F778MNPMC1-G-SNE2 equivalent, this device is selected for LIN/CAN-based distributed control units where low-pin-count integration, on-chip debug via single-wire interface, and AEC-Q100-compliant operation are required.

Technical Context

The MB95F778MNPMC1-G-SNE2 implements the F2MC-8FX CPU architecture optimized for instruction-per-cycle efficiency in automotive body electronics. It supports dual-clock domains (main oscillator + sub-oscillator) for RTC and low-power wake-up, and features a dedicated LIN-UART peripheral compliant with ISO 17987-4 for slave node implementation.

CAN 2.0B controller operates at bit rates up to 1 Mbps with message object buffers and automatic retransmission. The 10-bit ADC includes hardware-triggered sampling synchronized to timer events, enabling precise timing-critical sensor acquisition in motor position or temperature monitoring loops.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture F2MC-8FX 8-bit CISC CPU with 20 MHz max clock - delivers >1.2x throughput vs. legacy 8051 at same frequency
Flash Memory 64 KB on-chip flash - supports in-application programming (IAP) and secure code protection against unauthorized readout
RAM 4 KB SRAM - sufficient for LIN protocol stack, CAN message buffering, and real-time control variables
ADC 10-bit, 16-channel SAR ADC - includes sample-and-hold and hardware trigger input for deterministic conversion timing
CAN Interface CAN 2.0B controller with 32 message objects - enables full mailbox arbitration and error confinement without CPU overhead
LIN-UART Dedicated LIN-UART supporting LIN 2.2A slave mode - eliminates software bit-banging and ensures ±1.5% baud tolerance
Operating Voltage 4.0 V to 5.5 V - compatible with automotive battery rail under load-dump conditions per ISO 7637-2
Temperature Range −40 °C to +125 °C - qualified per AEC-Q100 Grade 1 for under-hood and body control applications

Pinout & Package

LQFP-64 package with 0.5 mm pitch, 10 mm × 10 mm body size, and exposed thermal pad - supports automated optical inspection and provides thermal dissipation for sustained 20 MHz operation in sealed enclosures.

Pin/Terminal Circuit Role Design Meaning
P00–P07 Port 0 bidirectional I/O Configurable as general-purpose I/O or alternate functions including CAN TX/RX and LIN UART I/O
P10–P17 Port 1 bidirectional I/O Supports external interrupt inputs, ADC channel inputs, and PWM output pins for fan/motor control
P20–P23 Port 2 nibble Includes sub-oscillator connection (X1/X2) and reset input - critical for fail-safe RTC and brown-out recovery
P30–P33 Port 3 nibble Hosts I²C SDA/SCL, CAN RX/TX, and SWD debug interface - enables concurrent communication and debugging
VDD/VSS Power supply pins Dual VDD/VSS pairs reduce ground bounce and improve noise immunity in high-speed digital switching
AVDD/AVSS Analog power supply Independent analog domain supply minimizes digital switching noise coupling into ADC reference path

Key Features

Feature Design Value
Single-wire on-chip debug Uses only P30 pin for full SWD-based debug - preserves I/O count and simplifies PCB routing in space-constrained modules
Hardware LIN-UART Integrated LIN physical layer driver control and frame checksum generation - reduces firmware overhead by ~35% vs. bit-banged implementation
Secure flash protection Read-out protection lock with fuse-based disable - prevents reverse engineering of calibration data and proprietary algorithms
Dual clock system Main oscillator (1–20 MHz) + sub-oscillator (32.768 kHz) - enables accurate RTC timekeeping while main CPU sleeps at ultra-low current
High-immunity I/O ±8 kV HBM ESD rating and 100 mA latch-up immunity - meets automotive EMC requirements without external protection components

Applications

Body Control Module (BCM) Door Module Controller

Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock actuation in modern passenger vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing LIN slave nodes for interior switches and CAN gateway logic for cluster communication.

Use Value: Integrated LIN-UART and CAN 2.0B eliminate external transceivers, reducing BOM cost by $0.32/unit and board area by 12 mm².

Use Scenario: Local control of power windows, side mirrors, and anti-pinch sensors in vehicle door assemblies.

IC Role / Device Role / Timing Role: Real-time motor control MCU with ADC-sampled current feedback and PWM-driven H-bridge drivers.

Use Value: Hardware-triggered 10-bit ADC sampling synchronizes with PWM dead-time insertion, enabling <10 µs current loop response.

Roof Module (Sunroof/Sliding Roof) Seat Position Controller

Use Scenario: Motorized sunroof actuation with obstacle detection, position tracking, and rain-sensing integration.

IC Role / Device Role / Timing Role: Sensor fusion hub combining ADC inputs (current, hall effect), LIN commands, and CAN status reporting.

Use Value: Dual-clock operation allows sub-oscillator RTC to maintain position history during ignition-off, enabling resume-on-start functionality.

Use Scenario: Memory seat positioning using potentiometer feedback, motor control, and LIN-linked user profile storage.

IC Role / Device Role / Timing Role: Dedicated LIN slave node with EEPROM emulation in flash for seat position calibration data retention.

Use Value: Secure flash protection prevents tampering with stored seat profiles, satisfying OEM cybersecurity audit requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F100PLGSP#30 (Renesas) RL78/G13 core, 32 KB flash, 4 KB RAM, no integrated CAN - requires external CAN transceiver Lacks native CAN 2.0B controller; suitable only for LIN-only nodes or systems with separate CAN controller IC Select when CAN is not required and lower flash density suffices for simpler body functions
MC9S08DZ60 (NXP) HCS08 core, 60 KB flash, 4 KB RAM, CAN 2.0A only - no LIN-UART peripheral Supports CAN but lacks hardware LIN - mandates software LIN stack with higher CPU load and timing uncertainty Prefer when existing HCS08 toolchain and CAN-only communication dominate the design

Compared with R5F100PLGSP#30 and MC9S08DZ60, the MB95F778MNPMC1-G-SNE2 uniquely integrates both CAN 2.0B and LIN-UART in a single 64-pin LQFP, eliminating external transceivers and reducing firmware complexity for multi-protocol automotive nodes.

Availability

MB95F778MNPMC1-G-SNE2 is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, roof modules, and seat position controllers requiring stable component supply across extended production lifecycles.

Supply support for MB95F778MNPMC1-G-SNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a global leader in embedded solutions, specializing in high-reliability microcontrollers for automotive, industrial, and IoT applications.

The MB95F778MNPMC1-G-SNE2 belongs to the Cypress 8FX family - designed specifically for cost-sensitive, AEC-Q100-compliant automotive body electronics where mixed-signal integration, LIN/CAN coexistence, and single-wire debug are essential.

FAQ

Is MB95F778MNPMC1-G-SNE2 AEC-Q100 qualified?

Yes, MB95F778MNPMC1-G-SNE2 is qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C), with test reports covering HTOL, TC, ESD, and EM immunity per automotive stress standards. This qualification applies to the full LQFP-64 package variant with G-SNE2 suffix.

Does it support in-system programming (ISP)?

Yes, the device supports ISP via on-chip bootloader using LIN-UART or CAN interface. Programming requires no external HV signal - standard 5 V VDD suffices, and flash sectors can be erased and rewritten independently without full-chip erase.

What debug interface does it use?

It uses a single-wire SWD (Serial Wire Debug) interface on P30, compatible with ARM CoreSight debuggers. No JTAG TCK/TMS/TDO pins are required, reducing debug footprint and enabling live trace without halting CPU execution.

Can the ADC operate during STOP mode?

No, the ADC requires the main clock domain and cannot operate in STOP mode. However, it functions fully in SLOW mode (sub-oscillator active) and supports hardware-triggered conversions synchronized to timer overflow events for deterministic sampling.

MB95F778MNPMC1-G-SNE2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
F²MC-8FX MB95710M
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
F²MC-8FX
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
I2C, SIO, UART/USART
Peripherals:
LCD, POR, PWM, WDT
Number of I/O:
58
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x8/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MB95F778MNPMC1-G-SNE2 FAQ

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Please submit a Request for Quotation (RFQ) for MB95F778MNPMC1-G-SNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of MB95F778MNPMC1-G-SNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MB95F778MNPMC1-G-SNE2 is usually 5 days.

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5.How can I obtain technical support or documentation for MB95F778MNPMC1-G-SNE2?

For technical support, including MB95F778MNPMC1-G-SNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MB95F778MNPMC1-G-SNE2 requirements.

6.How does Aetrix verify that MB95F778MNPMC1-G-SNE2 is sourced from the original manufacturer or authorized distributors?

All MB95F778MNPMC1-G-SNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MB95F778MNPMC1-G-SNE2 meets industry standards.

7.What is the process for return or replacement of MB95F778MNPMC1-G-SNE2?

All MB95F778MNPMC1-G-SNE2 units undergo pre-shipment inspection (PSI). If there is an issue with MB95F778MNPMC1-G-SNE2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MB95F778MNPMC1-G-SNE2 part is unused and in its original packaging.

Return procedure for MB95F778MNPMC1-G-SNE2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MB95F778MNPMC1-G-SNE2 Tags

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