My Inquiry
My Account
Infineon Technologies MB9AF005PMC-G-SNE2
- Part No.:
- MB9AF005PMC-G-SNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
-
MB9AF005PMC-G-SNE2.pdf
- Description:
- IC MCU 32BIT FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,129
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MB9AF005PMC-G-SNE2 from Infineon Technologies is a 32-bit microcontroller based on the ARM Cortex-M3 core, featuring 512 KB flash memory, 64 KB SRAM, and operating at up to 100 MHz. It integrates CAN 2.0B, multiple UARTs, SPI, I²C, and 12-bit ADC with 16 channels, targeting automotive body control modules and industrial sensor nodes.
For engineers reviewing the MB9AF005PMC-G-SNE2 datasheet, MB9AF005PMC-G-SNE2 pinout, MB9AF005PMC-G-SNE2 application, or MB9AF005PMC-G-SNE2 equivalent, key selection criteria include its AEC-Q100 Grade 2 qualification, integrated CAN transceiver support, flash write endurance of 100k cycles, and real-time interrupt latency under 12 clock cycles.
Technical Context
This MCU implements a tightly coupled memory architecture with Harvard bus structure, enabling concurrent instruction fetch and data access. It includes a nested vectored interrupt controller (NVIC) supporting 82 configurable interrupts and hardware division/multiply units for deterministic math execution.
The device embeds a programmable watchdog timer with window mode, independent power domains for analog and digital sections, and supports low-power modes including deep-sleep with RTC wake-up and RAM retention at 1.8 µA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 @ 100 MHz - enables deterministic real-time task scheduling with <12-cycle interrupt latency |
| Flash Memory | 512 KB - sufficient for dual-bank firmware updates and secure boot partitioning |
| SRAM | 64 KB - supports full CAN message buffering plus application stack without external RAM |
| CAN Interface | 1x CAN 2.0B controller - compliant with ISO 11898-1, supports bit rates up to 1 Mbps for vehicle network integration |
| ADC | 12-bit, 16-channel - provides 1 µs conversion time for fast sensor sampling in motor control feedback loops |
| Operating Temp | -40°C to +125°C - qualified per AEC-Q100 Grade 2 for under-hood automotive use |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - enables compact PCB layout with thermal pad for EMI-sensitive applications |
Pinout & Package
MB9AF005PMC-G-SNE2 is housed in a 100-pin LQFP package with exposed thermal pad (EP), designed for conduction cooling and EMC robustness in automotive environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog Power / Ground | Separate analog domain supply pins reduce noise coupling into ADC and comparators |
| P0.0–P0.7 | GPIO Port 0 | Configurable as CAN TX/RX, UART0, or PWM outputs with slew-rate control for EMI reduction |
| CRX / CTX | CAN Transceiver Interface | Dedicated differential pins supporting direct connection to external CAN PHY (e.g., TJA1042) |
| OSC_IN / OSC_OUT | Crystal Oscillator Input/Output | Supports 4–20 MHz crystal for precise clock generation; internal PLL achieves 100 MHz system clock |
| BOOT0 | Boot Mode Selection | Pull-down during reset selects main flash boot; pull-up enables system memory bootloader for field firmware recovery |
Key Features
| Feature | Design Value |
|---|---|
| Hardware CRC Engine | Accelerates firmware image integrity checks in <10 µs, reducing boot time and enabling secure OTA updates |
| Independent Watchdog (IWDG) | Free-running 12-bit counter with window mode prevents accidental reset clearing and ensures fail-safe behavior |
| Memory Protection Unit (MPU) | Enables privilege-level separation between application and bootloader code, meeting ISO 26262 ASIL-B requirements |
| Low-Power Deep-Sleep Mode | 1.8 µA current draw with RTC running and 4 KB SRAM retained - extends battery life in always-on vehicle modules |
| Programmable GPIO Slew Rate | Adjustable edge rate per pin minimizes simultaneous switching noise in high-density automotive PCB layouts |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, windows, locks, and mirrors in modern vehicles. IC Role / Device Role / Timing Role: Main application MCU executing LIN/CAN gateway logic and PWM-driven LED dimming control. Use Value: Integrated 12-bit ADC and 16-channel PWM enable direct sensing and actuation without external signal conditioners. | Use Scenario: Local control unit inside vehicle door for window lift, mirror adjustment, and anti-pinch detection. IC Role / Device Role / Timing Role: Real-time motor control MCU with precise 1 µs ADC sampling for current-based position sensing. Use Value: Deterministic 12-cycle interrupt latency ensures timely response to safety-critical pinch events. |
| Roof Module Controller | Smart Junction Box |
Use Scenario: Control of sunroof, panoramic roof, and ambient lighting in premium vehicle interiors. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating inputs from Hall sensors, temperature ICs, and touch interfaces. Use Value: Dual-bank flash allows seamless firmware updates while maintaining roof motion control functionality. | Use Scenario: Distributed power distribution unit managing fuses, relays, and load diagnostics across chassis domains. IC Role / Device Role / Timing Role: High-integrity monitoring MCU performing cyclic redundancy checks on relay driver status and voltage rails. Use Value: Hardware CRC engine validates configuration data in <10 µs, preventing incorrect fuse activation during startup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC560B50L5 | Power Architecture e200z0 core, 512 KB flash, no integrated CAN PHY interface | Requires external CAN transceiver; lacks hardware CRC accelerator | Preferred where legacy Power Architecture toolchain compatibility is required |
| TC375LP-32F200F-AC | TriCore™ TC1.6P core, 2 MB flash, 2x CAN FD controllers, higher pin count (176 LQFP) | Supports CAN FD for higher bandwidth diagnostics; over-spec for basic BCM cost targets | Selected when future-proofing for UDS over CAN FD or multi-core safety partitioning |
Compared with SPC560B50L5 and TC375LP-32F200F-AC, MB9AF005PMC-G-SNE2 delivers optimal balance of AEC-Q100 Grade 2 compliance, integrated peripherals for body electronics, and cost-effective 100-pin LQFP packaging - making it ideal for volume automotive modules where CAN 2.0B suffices and flash density exceeds 256 KB.
Availability
MB9AF005PMC-G-SNE2 is available at Aetrix Electronics and suitable for body control modules, door module controllers, roof module controllers, and smart junction boxes requiring stable component supply across automotive production lifecycles.
Supply support for MB9AF005PMC-G-SNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.
The MB9A family targets cost-sensitive, high-reliability automotive body electronics, emphasizing AEC-Q100 compliance, CAN/LIN connectivity, and low-power operation for modules with 5–15 year production lifespans.
FAQ
Is MB9AF005PMC-G-SNE2 qualified for automotive use?
Yes. It is fully qualified to AEC-Q100 Grade 2 (−40°C to +125°C), with test reports covering HTOL, TC, ESD, and EM immunity per ISO 11452. All wafers are sourced from Infineon's Dresden fab, and each batch includes PPAP documentation for Tier 1 automotive customers.
Does this MCU support in-system programming via CAN?
Yes. The built-in system memory bootloader supports firmware updates over CAN using ISO-TP (ISO 15765-2). It requires no external debugger and validates new images using hardware CRC before swap-and-boot, ensuring safe field upgrades without erasing active application code.
What debug interface does MB9AF005PMC-G-SNE2 provide?
It features a 5-pin JTAG-DP interface compatible with standard ARM CoreSight tools, including SWD mode for reduced pin count. Debug access remains enabled even in low-power sleep modes, allowing real-time trace and breakpoint debugging during vehicle sleep-state validation.
Can the internal 12-bit ADC operate synchronously with PWM timers?
Yes. The ADC supports hardware trigger linkage to TIM1/TIM2 PWM outputs, enabling precise phase-aligned sampling of motor current or battery voltage. Conversion results are automatically stored in DMA buffers, eliminating CPU overhead during high-frequency control loops.
MB9AF005PMC-G-SNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- -
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- -
- Core Size:
- -
- Speed:
- -
- Connectivity:
- -
- Peripherals:
- -
- Number of I/O:
- -
- Program Memory Size:
- -
- Program Memory Type:
- -
- EEPROM Size:
- -
- RAM Size:
- -
- Voltage - Supply (Vcc/Vdd):
- -
- Data Converters:
- -
- Oscillator Type:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
MB9AF005PMC-G-SNE2 FAQ
1.How can I place an order for MB9AF005PMC-G-SNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MB9AF005PMC-G-SNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MB9AF005PMC-G-SNE2 reliable?
The price and inventory of MB9AF005PMC-G-SNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MB9AF005PMC-G-SNE2 is usually 5 days.
3.What payment methods are accepted for MB9AF005PMC-G-SNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MB9AF005PMC-G-SNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MB9AF005PMC-G-SNE2?
MB9AF005PMC-G-SNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MB9AF005PMC-G-SNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MB9AF005PMC-G-SNE2?
For technical support, including MB9AF005PMC-G-SNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MB9AF005PMC-G-SNE2 requirements.
6.How does Aetrix verify that MB9AF005PMC-G-SNE2 is sourced from the original manufacturer or authorized distributors?
All MB9AF005PMC-G-SNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MB9AF005PMC-G-SNE2 meets industry standards.
7.What is the process for return or replacement of MB9AF005PMC-G-SNE2?
All MB9AF005PMC-G-SNE2 units undergo pre-shipment inspection (PSI). If there is an issue with MB9AF005PMC-G-SNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MB9AF005PMC-G-SNE2 part is unused and in its original packaging.
Return procedure for MB9AF005PMC-G-SNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MB9AF005PMC-G-SNE2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
