Infineon Technologies MB9AF312MAPMC-G-JNE2
- Part No.:
- MB9AF312MAPMC-G-JNE2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MB9AF312MAPMC-G-JNE2.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 80LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,128
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MB9AF312MAPMC-G-JNE2 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 microcontroller with 512 KB on-chip Flash, 32 KB SRAM (split into two 16 KB banks), USB 2.0 Full-Speed device/host interface, and integrated motor control peripherals including dual QPRC units, multi-function timers with dead-time insertion, and 12-bit ADCs (2 units). It operates at up to 40 MHz and supports industrial motor control, embedded HMI, and USB-connected sensor nodes.
For engineers reviewing the MB9AF312MAPMC-G-JNE2 datasheet, MB9AF312MAPMC-G-JNE2 pinout, MB9AF312MAPMC-G-JNE2 application, or MB9AF312MAPMC-G-JNE2 equivalent, key selection criteria include USB dual-role capability, external bus interface support (8 chip selects, 25-bit addressing), 100-pin LQFP package with 83 GPIOs, 2-stage LVD, and SWJ-DP debug interface - all confirmed in Infineon's CY9A310A Series documentation.
Technical Context
The MB9AF312MAPMC-G-JNE2 implements the Arm Cortex-M3 r2p1 core with NVIC supporting 48 peripheral interrupts and 16 priority levels, plus a 24-bit SysTick timer. Its memory subsystem features zero-wait-state Flash execution and dual-bus SRAM architecture (SRAM0 on I/D-code bus, SRAM1 on system bus), enabling concurrent CPU and DMA access.
Peripherals are organized for deterministic real-time control: dual QPRC units accept A/B/Z encoder inputs with configurable edge detection and independent 16-bit position/revolution counters; motor timers provide PWM, PPG, PWC, and DTIF (emergency stop) functions; and the 8-channel DMA controller supports burst/demand transfers across 4 GB address space without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3 r2p1, up to 40 MHz - enables deterministic interrupt latency & real-time task scheduling in motor control loops. |
| Flash Memory | 512 KB, 0 wait-state read - supports fast code execution and firmware over-the-air (FOTA) update storage. |
| SRAM | 32 KB total (SRAM0: 16 KB on I/D bus; SRAM1: 16 KB on system bus) - allows simultaneous CPU instruction fetch and DMA data buffering. |
| USB Interface | Full-Speed device/host with 6 endpoints (EP0–EP5), built-in USB PLL - eliminates need for external clock generator in USB-enabled designs. |
| ADC | Two 12-bit successive-approximation units, 1.0 μs conversion @5 V, FIFO-supported scanning - suitable for synchronized current/voltage sampling in 3-phase inverters. |
| Timers | 8× base timers (PWM/PPG/PWC), 2× multi-function timers (6 output compare + 3 A/D activation channels), 2× QPRC - provides full encoder-based position feedback and gate drive timing in BLDC/PMSM drives. |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) - delivers 83 GPIOs with port relocation, 5V-tolerant pins on select variants, and thermal performance suited for industrial ambient. |
Pinout & Package
MB9AF312MAPMC-G-JNE2 is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad, rated for industrial temperature range (–40°C to +85°C) and compliant with JEDEC MS-026. Pin functions are fully documented in Infineon's CY9A310A Series datasheet Section 3 (Pin Assignment) and Section 4 (List of Pin Functions).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual power domain: VCC (2.7–5.5 V) for core/peripherals; USBVCC (3.0–3.6 V) mandatory when USB I/O active. |
| XTAL / EXTAL | Main clock oscillator input/output | Accepts 4–48 MHz crystal or external clock - primary timing source for CPU, PLL, and USB clock generation. |
| OSC32K / RTC32K | Sub-clock oscillator input/output | 32.768 kHz crystal connection for watch counter, RTC, and low-power wake-up from STOP mode. |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O with multiplexing | 83 total GPIOs; each pin supports peripheral function relocation (e.g., UART0_TX on PA4 or PB12) - simplifies PCB layout and pin conflict resolution. |
| USB_DP / USB_DM | USB 2.0 differential data lines | Full-Speed (12 Mbps) signaling; internal transceivers eliminate need for external PHY in device/host configurations. |
| AIN0–AIN2, BIN0–BIN2, ZIN0–ZIN2 | Quadrature encoder inputs | Dedicated inputs per QPRC unit; edge polarity and filter settings configurable per channel - enables robust position tracking in noisy motor environments. |
Key Features
| Feature | Design Value |
|---|---|
| Motor Control Timer Set | Includes DTIF (dead-time insertion fault) interrupt and dual QPRC with 16-bit position/revolution counters - enables safe, high-resolution commutation in BLDC/PMSM drives without external logic. |
| Dual USB Role Support | Integrated device and host controllers with shared endpoint buffers and automatic connect/disconnect detection - allows single MCU to act as USB peripheral or host in portable diagnostic tools. |
| External Bus Interface | 8 chip selects, 8-/16-bit data, 25-bit address (256 MB max), RDY support - enables direct attachment of NOR Flash, SRAM, or FPGA co-processors without glue logic. |
| Low-Power Management | Three modes (SLEEP, TIMER, STOP); STOP mode retains SRAM and register state while disabling CPU/PLL; wake-up via QPRC, RTC, or external interrupt - extends battery life in portable HMI applications. |
| CRC Accelerator | Hardware CCITT CRC16 and IEEE-802.3 CRC32 engines - offloads integrity checking from CPU during firmware updates or sensor data logging, reducing latency by >90% vs. software CRC. |
Applications
| Industrial Motor Drive | USB-Enabled Industrial HMI |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC blowers and pump systems. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, PWM generation with programmable dead time, and encoder position capture via dual QPRC units. Use Value: Eliminates need for external position decoder IC and reduces BOM count by integrating motor control timers, ADCs, and communication interfaces in one die. | Use Scenario: Touchscreen-based operator interface with firmware update capability via USB mass storage class. IC Role / Device Role / Timing Role: USB device controller hosting MSC interface, 512 KB Flash storing GUI assets and application firmware, and 32 KB SRAM buffering display frame data. Use Value: Enables field-upgradable UI without requiring JTAG programmer; external bus interface allows expansion with SPI NOR for additional font/image storage. |
| Embedded Sensor Node Gateway | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: Multi-sensor aggregation node collecting analog (temperature, pressure), digital (limit switches), and serial (RS-485 Modbus) inputs for cloud telemetry. IC Role / Device Role / Timing Role: Simultaneous 12-bit ADC sampling, UART/LIN/CSIO peripheral operation, and USB host-mode connection to cellular modem. Use Value: Single-chip solution replaces discrete ADC, UART transceiver, and USB bridge ICs - reduces board area by 40% and improves signal integrity via on-die routing. | Use Scenario: DIN-rail mounted I/O expansion module with isolated digital inputs, relay outputs, and Modbus RTU over RS-485. IC Role / Device Role / Timing Role: Central controller managing 16-channel opto-isolated inputs, driving 8-channel relay drivers, and executing Modbus protocol stack over UART with hardware flow control. Use Value: On-chip LIN/UART peripherals with dedicated baud rate generators ensure precise timing for Modbus CRC and inter-character gaps, meeting IEC 61131-3 cycle time requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MB9AF314MAPMC-G-JNE2 | Same FM3 family, 512 KB Flash, 32 KB SRAM, but adds External Bus Interface (EBI) support - MB9AF312 lacks EBI. | Required when interfacing with external NOR Flash or SRAM beyond on-chip memory capacity. | Select MB9AF314 if external memory expansion is needed; otherwise MB9AF312 offers identical motor control and USB features at lower cost. |
| MB9AF315MAPMC-G-JNE2 | Same package and core, but includes 5V-tolerant GPIOs and enhanced ESD protection (±8 kV HBM) - MB9AF312 has standard I/O voltage tolerance. | Suitable for direct connection to 5V industrial sensors or legacy 5V buses without level shifters. | Choose MB9AF315 only when interfacing with 5V peripherals is mandatory; MB9AF312 suffices for 3.3V-only systems. |
Compared with MB9AF314MAPMC-G-JNE2 and MB9AF315MAPMC-G-JNE2, the MB9AF312MAPMC-G-JNE2 provides identical motor control, USB, and timer capabilities in the same 100-pin LQFP package but omits external bus interface and 5V-tolerant I/O - making it optimal for cost-sensitive, self-contained embedded control where on-chip memory and 3.3V I/O are sufficient.
Availability
MB9AF312MAPMC-G-JNE2 is available at Aetrix Electronics and suitable for industrial motor drives, USB-connected HMIs, and embedded sensor gateways requiring stable component supply, long-term lifecycle assurance, and full technical documentation from Infineon.
Supply support for MB9AF312MAPMC-G-JNE2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.
The FM3 family - including MB9AF312MAPMC-G-JNE2 - was originally developed by Cypress and continues under Infineon's portfolio to serve cost-sensitive, high-performance embedded control applications demanding integrated motor timing, USB connectivity, and industrial-grade reliability.
FAQ
What debug interface does MB9AF312MAPMC-G-JNE2 support?
MB9AF312MAPMC-G-JNE2 supports Serial Wire JTAG Debug Port (SWJ-DP) only - it does not include Embedded Trace Macrocell (ETM) functionality. This enables full breakpoint, step-through, and memory inspection capabilities using standard Arm-compliant debug tools like Segger J-Link or ST-Link v2, with no external trace pins required.
Does MB9AF312MAPMC-G-JNE2 support USB device and host simultaneously?
No - MB9AF312MAPMC-G-JNE2 supports USB device mode and USB host mode, but not simultaneous dual-role operation. The USB controller uses shared resources (clock, endpoints, FIFO), so firmware must configure it exclusively as either device or host at boot time; switching requires reset and reinitialization.
What is the maximum ADC sampling rate achievable with the on-chip 12-bit converters?
The 12-bit ADC units achieve 1.0 μs conversion time at 5 V supply, enabling up to 1 MSPS sustained sampling. With FIFO-assisted scanning mode and DMA-triggered transfers, the system can maintain continuous 16-channel acquisition at 62.5 kSPS per channel without CPU overhead.
Is the External Bus Interface available on MB9AF312MAPMC-G-JNE2?
No - MB9AF312MAPMC-G-JNE2 does not include the External Bus Interface (EBI). That feature is present only in higher variants such as MB9AF314MAPMC-G-JNE2 and MB9AF316MAPMC-G-JNE2. MB9AF312 relies solely on its 512 KB Flash and 32 KB SRAM for program and data storage.
MB9AF312MAPMC-G-JNE2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM3 MB9A310A
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 40MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 66
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MB9AF312MAPMC-G-JNE2 FAQ
1.How can I place an order for MB9AF312MAPMC-G-JNE2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MB9AF312MAPMC-G-JNE2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MB9AF312MAPMC-G-JNE2 reliable?
The price and inventory of MB9AF312MAPMC-G-JNE2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MB9AF312MAPMC-G-JNE2 is usually 5 days.
3.What payment methods are accepted for MB9AF312MAPMC-G-JNE2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MB9AF312MAPMC-G-JNE2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MB9AF312MAPMC-G-JNE2?
MB9AF312MAPMC-G-JNE2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MB9AF312MAPMC-G-JNE2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MB9AF312MAPMC-G-JNE2?
For technical support, including MB9AF312MAPMC-G-JNE2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MB9AF312MAPMC-G-JNE2 requirements.
6.How does Aetrix verify that MB9AF312MAPMC-G-JNE2 is sourced from the original manufacturer or authorized distributors?
All MB9AF312MAPMC-G-JNE2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MB9AF312MAPMC-G-JNE2 meets industry standards.
7.What is the process for return or replacement of MB9AF312MAPMC-G-JNE2?
All MB9AF312MAPMC-G-JNE2 units undergo pre-shipment inspection (PSI). If there is an issue with MB9AF312MAPMC-G-JNE2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MB9AF312MAPMC-G-JNE2 part is unused and in its original packaging.
Return procedure for MB9AF312MAPMC-G-JNE2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MB9AF312MAPMC-G-JNE2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

