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Infineon Technologies PEF 21624 E V1.2-G
- Part No.:
- PEF 21624 E V1.2-G
- Manufacturer:
- Infineon Technologies
- Category:
- Telecom
- Package:
- 324-LBGA
- Datasheet:
-
PEF 21624 E V1.2-G.pdf
- Description:
- IC TELECOM INTERFACE LBGA-324
- Quantity:
- Payment:
- Shipping:
Inventory:3,854
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Product details
Overview
PEF 21624 E V1.2-G from Infineon Technologies is a single-channel symmetric DSL (SHDSL) front-end transceiver IC compliant with ITU-T G.991.2 and ETSI TS 101524 standards, integrating DSP, microcontroller, analog front end, line driver, hybrid, and 128-byte TX/RX FIFO per channel. It supports payload rates from 144 kbit/s to 6.392 Mbit/s in 8 kbit/s steps and operates at 3.3 V and 1.8 V supplies with ~500 mW power consumption.
For engineers reviewing the PEF 21624 E V1.2-G datasheet, PEF 21624 E V1.2-G pinout, PEF 21624 E V1.2-G application, or PEF 21624 E V1.2-G equivalent, key selection criteria include G.SHDSL.bis compliance, TDM clock support (1.544–16.384 MHz), M-pair functionality, tunable hybrid for loop adaptation, and LTU/NTU/COT mode flexibility in leased-line and DLC systems.
Technical Context
The PEF 21624 E V1.2-G implements a full SHDSL physical layer stack including TC-PAM line coding, programmable framer, and integrated HDLC controller for EOC handling. Its DSP-based architecture enables real-time line probing per ITU-T G.991.2 (2004) and dynamic PSD shaping for optimal reach on twisted-pair loops.
It operates in three configurable modes-Line Termination Unit (LTU), Network Termination Unit (NTU), and Regenerator (COT/RT)-and features a universal TDM interface with bit-serial host connectivity. The analog front end includes a tunable hybrid and line driver optimized for extended-range E1/T1 and fractional E1/T1 deployment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Standard Compliance | ITU-T G.991.2 (G.SHDSL.bis) and ETSI TS 101524 - ensures interoperability in carrier-grade SHDSL networks |
| Data Rate Range | 144 kbit/s to 6.392 Mbit/s in 8 kbit/s steps - supports full/fractional E1/T1 and TU-12 transport |
| TDM Clock Support | 1.544, 2.048, 2.312, 4.096, 8.192, 16.384 MHz - enables direct interface to PCM framers and SDH/SONET timing |
| Power Supply | 3.3 V and 1.8 V - dual-rail operation reduces noise coupling and simplifies board-level power design |
| Power Consumption | ~500 mW per channel - enables thermal-constrained remote repeater and wireless infrastructure deployments |
| Operating Temperature | −40°C to +85°C - qualified for outdoor cabinet and uncontrolled environment applications |
| FIFO Depth | 128 bytes TX/RX per channel - buffers bursty TDM traffic without external memory or flow control logic |
Pinout & Package
PEF 21624 E V1.2-G is housed in a P-LBGA-324 package (19 mm × 19 mm, 1.27 mm pitch), thermally enhanced for high-density SHDSL line card designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_3V3 / VDD_1V8 | Power supply inputs | Dual-rail supply pins requiring separate decoupling; 3.3 V powers I/O and analog sections, 1.8 V powers core logic |
| CLKIN | TDM reference clock input | Accepts 1.544–16.384 MHz clock for frame synchronization and data rate derivation |
| TDI / TDO / TMS / TCK | JTAG boundary-scan interface | Enables in-system programming, debug, and production test without dedicated ISP hardware |
| TXP/TXN, RXP/RXN | Differential line driver/receiver pair | Connects directly to transformer-coupled twisted-pair; supports up to 12 km reach with M-pair tuning |
| HYB_IN / HYB_OUT | Hybrid interface terminals | Allow external tunable hybrid configuration for loop impedance matching and echo cancellation optimization |
Key Features
| Feature | Design Value |
|---|---|
| Integrated HDLC controller | Handles EOC framing and protocol processing on-chip, eliminating need for external communication controller |
| M-pair functionality | Enables multi-pair bonding for higher aggregate bandwidth without external multiplexing logic |
| Programmable framer | Configurable to align with E1, T1, J1, or custom TDM structures - reduces FPGA or ASIC framing logic |
| Tunable hybrid interface | Supports adaptive loop compensation across varying cable gauges and lengths - improves reach by up to 30% vs fixed hybrids |
| Single-chip SHDSL PHY | Integrates DSP, AFE, LD, microcontroller, and memory - cuts BOM count by >40 components vs discrete solutions |
Applications
| ISDN Primary Rate Replacement | SHDSL Repeater/Regenerator |
|---|---|
Use Scenario: Migration of legacy ISDN PRI lines to packet-transparent SHDSL infrastructure in enterprise and central office environments. IC Role / Device Role / Timing Role: Acts as line termination unit (LTU) with full G.SHDSL.bis framing and TC-PAM modulation for 2.048 MHz E1 signal regeneration. Use Value: Maintains exact E1 timing integrity while enabling longer loop reach (up to 12 km) and reduced OPEX via remote management. | Use Scenario: Mid-span repeater in rural leased-line deployments where fiber is unavailable and copper loops exceed 6 km. IC Role / Device Role / Timing Role: Functions as regenerator unit (COT/RT) with line probing, adaptive PSD shaping, and hybrid tuning for variable loop conditions. Use Value: Extends usable loop length by 40–60% over legacy repeaters while consuming only ~500 mW per channel. |
| Digital Loop Carrier (DLC) Systems | Wireless Infrastructure Backhaul |
Use Scenario: Remote terminal node in DLC architectures connecting subscriber lines to digital switches over extended copper plant. IC Role / Device Role / Timing Role: Serves as network termination unit (NTU) with M-pair bonding support and 128-byte FIFO buffering for bursty voice/data aggregation. Use Value: Enables simultaneous transport of 30+ voice channels over single twisted pair with sub-50 µs jitter accumulation. | Use Scenario: Point-to-point backhaul between base station and BSC in microwave-alternative deployments using existing copper infrastructure. IC Role / Device Role / Timing Role: Operates as LTU with 16.384 MHz TDM clock support for seamless integration into SDH/SONET timing trees. Use Value: Delivers <100 ns phase error over temperature, meeting GR-1244-CORE jitter requirements for cellular backhaul. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SHDSL transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PEF 22624 E | 2-channel version in identical P-LBGA-324 package; shares same firmware and pinout | Targets dual-line repeater or dual-NTU DLC nodes; requires no PCB redesign when scaling from single to dual channel | Select for cost-sensitive multi-line deployments where channel density justifies shared thermal and layout overhead |
| PEF 24624 E | 4-channel version with identical feature set and software compatibility; same power per channel (~500 mW) | Suitable for high-port-density SHDSL line cards in central office or aggregation routers | Choose when system-level throughput exceeds 12 Mbit/s or when footprint efficiency per channel is critical |
Compared with PEF 22624 E and PEF 24624 E, the PEF 21624 E V1.2-G delivers lowest per-unit cost and minimal thermal footprint for single-line applications-ideal for space-constrained remote repeaters, PBX trunk interfaces, and low-volume DLC nodes where channel independence and firmware reuse matter most.
Availability
PEF 21624 E V1.2-G is available at Aetrix Electronics and suitable for SHDSL repeater/regenerator, ISDN PRI replacement, and Digital Loop Carrier (DLC) systems requiring stable component supply, long-lifecycle assurance, and industrial temperature operation.
Supply support for PEF 21624 E V1.2-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, industrial, and communications ICs, with global R&D and manufacturing infrastructure.
The SOCRATES® family-including the PEF 21624 E V1.2-G-is designed specifically for symmetric DSL physical layer implementation in carrier-class access networks, emphasizing low power, small footprint, and standards-compliant TDM interfacing.
FAQ
Does PEF 21624 E V1.2-G support G.SHDSL.bis Annex E (M-pair bonding)?
Yes, it fully integrates M-pair functionality per ITU-T G.991.2 Annex E, enabling two or more PEF 21624 E devices to be bonded under a single framer for aggregate data rates up to 12.784 Mbit/s. Configuration is handled via SPI register writes and requires no external logic.
What clock sources are required for TDM interface operation?
The device requires a single external TDM reference clock (1.544, 2.048, 2.312, 4.096, 8.192, or 16.384 MHz) applied to CLKIN. Internal PLLs derive all internal clocks; no additional crystal or oscillator is needed for basic operation.
Is the PEF 21624 E V1.2-G pin-compatible with earlier SOCRATES generations?
No-it belongs to Infineon's second-generation SOCRATES family and is not pin-compatible with first-gen parts like PEF 21620. However, it is pin- and software-compatible with PEF 22624 E and PEF 24624 E within the same generation.
Can the hybrid interface be used with discrete transformers?
Yes-the HYB_IN and HYB_OUT pins provide direct access to the hybrid circuitry, allowing use with standard 1:1 or 1:2.5 isolation transformers. External passive tuning components (capacitors/resistors) adjust common-mode rejection and impedance matching per loop characteristics.
PEF 21624 E V1.2-G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SOCRATES™
- Package/Case:
- 324-LBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Function:
- Symmetrical DSL Front End (SDFE)
- Interface:
- ISDN, SHDSL
- Number of Circuits:
- 1
- Voltage - Supply:
- -
- Current - Supply:
- -
- Power (Watts):
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- P-LBGA-324
PEF 21624 E V1.2-G FAQ
1.How can I place an order for PEF 21624 E V1.2-G through Aetrix?
Please submit a Request for Quotation (RFQ) for PEF 21624 E V1.2-G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PEF 21624 E V1.2-G reliable?
The price and inventory of PEF 21624 E V1.2-G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PEF 21624 E V1.2-G is usually 5 days.
3.What payment methods are accepted for PEF 21624 E V1.2-G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PEF 21624 E V1.2-G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PEF 21624 E V1.2-G?
PEF 21624 E V1.2-G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PEF 21624 E V1.2-G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PEF 21624 E V1.2-G?
For technical support, including PEF 21624 E V1.2-G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PEF 21624 E V1.2-G requirements.
6.How does Aetrix verify that PEF 21624 E V1.2-G is sourced from the original manufacturer or authorized distributors?
All PEF 21624 E V1.2-G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PEF 21624 E V1.2-G meets industry standards.
7.What is the process for return or replacement of PEF 21624 E V1.2-G?
All PEF 21624 E V1.2-G units undergo pre-shipment inspection (PSI). If there is an issue with PEF 21624 E V1.2-G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PEF 21624 E V1.2-G part is unused and in its original packaging.
Return procedure for PEF 21624 E V1.2-G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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