Infineon Technologies PEF 22624 E V1.3-G

Overview

PEF 22624 E V1.3-G from Infineon Technologies is a 2-channel symmetric DSL (SHDSL) front-end transceiver IC for TDM-based line termination and regenerator applications. It complies with ITU-T G.991.2 (G.SHDSL.bis) and ETSI TS 101524, supports payload rates from 144 kbit/s to 6.392 Mbit/s in 8 kbit/s steps, consumes ~500 mW per channel, and integrates DSP, microcontroller, AFE, line driver, memory, and HDLC controllers in a single P-LBGA-324 package.

For engineers reviewing the PEF 22624 E V1.3-G datasheet, PEF 22624 E V1.3-G pinout, PEF 22624 E V1.3-G application, or PEF 22624 E V1.3-G equivalent, this device serves as a fully integrated SHDSL PHY for remote-powered repeaters, digital loop carrier systems, and extended-range fractional E1/T1 infrastructure where low power, small footprint, and M-pair support are critical.

Technical Context

The PEF 22624 E V1.3-G implements TC-PAM line coding with programmable framer and tunable hybrid for adaptive loop reach optimization. It embeds two independent HDLC controllers (128-byte TX/RX FIFO per channel) and supports multiple TDM clocks: 1.544 MHz, 2.048 MHz, 2.312 MHz, 4.096 MHz, 8.192 MHz, and 16.384 MHz.

It operates in three configurable modes - Line Termination Unit (LTU), Network Termination Unit (NTU), and Regenerator Unit (COT/RT) - and performs full line probing per ITU-T G.991.2 (2004), enabling automatic loop characterization and PSD shaping control for noise resilience.

Key Specifications

Pinout & Package

Packaged in P-LBGA-324 (19 mm × 19 mm), the PEF 22624 E V1.3-G uses a ball-grid array with power, ground, analog I/O, digital TDM, serial host, and configuration pins distributed across four sides. Thermal pad on underside requires soldered thermal connection to PCB ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SHDSL transceiver applications.

Compared with PEF 22624 E V1.3-G, the 4-channel PEF 24624 E offers higher port density at identical per-channel performance, while the 1-channel PEF 21624 E reduces total system power and component count - all three share firmware, layout, and thermal design reuse paths.

Availability

PEF 22624 E V1.3-G is available at Aetrix Electronics and suitable for SHDSL repeater/regenerator units, digital loop carrier (DLC) remote terminals, and extended-range fractional E1/T1 leased-line infrastructure requiring stable component supply and long-term industrial availability.

Supply support for PEF 22624 E V1.3-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and wired/wireless communication solutions, with global R&D and manufacturing operations.

The SDFE-4/2/1 product line delivers highly integrated SHDSL front-end transceivers targeting cost-sensitive, power-constrained copper access infrastructure - specifically designed for remote repeaters, DLC systems, and TDM-to-SHDSL migration platforms.

FAQ

What is the maximum supported loop length for PEF 22624 E V1.3-G?

The PEF 22624 E V1.3-G achieves up to 22 km on 0.4 mm copper wire using M-pair operation and adaptive TC-PAM line coding. Actual reach depends on wire gauge, noise environment, and selected data rate - documented in Infineon's SDFE-2 Characterization Report Rev. 1.2, Section 4.3.

Does PEF 22624 E V1.3-G require external memory?

No. The device integrates on-chip SRAM and flash memory for firmware storage and runtime data buffering. External memory is optional only for extended diagnostic logging or field-upgradable feature sets beyond standard SHDSL functionality.

Can PEF 22624 E V1.3-G operate in both LTU and NTU modes simultaneously?

No. Each channel is independently configurable as LTU, NTU, or regenerator (SRU-C/R), but both channels must run in the same operational mode per device instance. Mode selection is set via configuration registers during initialization and cannot be mixed per channel.

What clock sources are required for TDM interface operation?

The TDM interface requires a master clock (e.g., 8.192 MHz or 16.384 MHz) and frame sync (FS) signal. These may be derived from an external oscillator or recovered from the line signal using the device's built-in clock recovery circuit - no separate PLL chip is needed.