Infineon Technologies PEF 24624 E V1.2

Overview

PEF 24624 E from Infineon Technologies is a 4-channel symmetric DSL front-end (SDFE-4) transceiver IC for SHDSL.bis systems, implementing full G.991.2 compliance with integrated DSP, AFE, line driver, hybrid, and on-chip memory. It delivers 550 mW per channel power consumption, supports M-pair mode up to 6 Mbit/s, and interfaces via flexible TDM to the SDC-16i controller in DSLAM line cards.

For engineers reviewing the PEF 24624 E datasheet, PEF 24624 E pinout, PEF 24624 E application, or PEF 24624 E equivalent, key selection criteria include per-channel power budget, G.SHDSL.bis protocol support, integrated analog front-end capability, TDM interface timing alignment with SDC-16i, and LBGA-324 thermal/mechanical integration in high-density line cards.

Technical Context

The PEF 24624 E implements a complete SHDSL physical layer for four independent copper pairs, embedding dedicated DSP cores, 4-channel AFEs with programmable gain/offset, and fully integrated line drivers with tunable hybrid circuits for loop-length adaptation. Each channel operates at up to 6 Mbit/s in M-pair mode with Packet TC and ATM TC layer support.

It communicates exclusively with the SDC-16i controller via a synchronous TDM bus, requiring no external RAM or microcontroller. The device uses only 3.3 V and 1.8 V supplies and integrates all clock generation (PLL + XTAL interface) and framing logic (AAL5 framer) on-die.

Key Specifications

Pinout & Package

P-LBGA-324 package with 27 × 27 mm body, 1.0 mm ball pitch, and exposed thermal pad for high-power-density DSL line card deployment. Pin functions validated per Infineon PEF 24624 E datasheet Rev. 1.2.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SHDSL front-end applications.

Compared with CX82310-14 and MAX2992, PEF 24624 E offers superior integration density and lower per-channel power, making it optimal for high-port-count DSLAMs requiring G.SHDSL.bis feature set and thermal-constrained line cards.

Availability

PEF 24624 E is available at Aetrix Electronics and suitable for DSLAM line cards, remote DLC terminals, MSAP aggregation nodes, and central office uplink equipment requiring stable component supply and long-term lifecycle support.

Supply support for PEF 24624 E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, industrial, and communications ICs, with global R&D and manufacturing infrastructure.

The SOCRATES-16Bis product line - including PEF 24624 E - was designed specifically for high-density, energy-efficient SHDSL.bis infrastructure in telecom access networks, targeting DSLAM, DLC, and MSAP equipment vendors.

FAQ

What is the maximum supported loop length for PEF 24624 E in G.SHDSL.bis mode?

The PEF 24624 E achieves up to 4.5 km reach on 16 AWG copper loops under G.SHDSL.bis M-pair mode, enabled by its tunable hybrid circuit and adaptive echo cancellation. This performance is verified per ITU-T G.991.2 Annex A test conditions and assumes standard 0.4 mm conductor diameter and typical bridge tap configurations.

Does PEF 24624 E require an external microcontroller to operate?

No. The PEF 24624 E integrates a dedicated microcontroller core for PHY initialization, calibration, and real-time line monitoring. It communicates with the host SDC-16i controller solely via the synchronous TDM interface, eliminating external MCU dependency for channel control or bundling tasks.

Can PEF 24624 E be used without the SDC-16i controller?

No. The PEF 24624 E is architecturally dependent on the SDC-16i for TDM frame generation, channel bundling arbitration, and ATM/Packet TC layer processing. Its TDM interface lacks autonomous framing capability and requires SDC-16i's master clock and slot assignment signals to function.

What thermal management is recommended for P-LBGA-324 mounting?

Infineon specifies a minimum 4×4 array of thermal vias under the exposed pad, connected to an internal ground/power plane with ≥100 mm² copper area. For continuous 16-channel operation, forced airflow ≥1.5 m/s across the top surface and board-level thermal simulation confirming <105°C junction temperature are strongly recommended.