Infineon Technologies PEF 24624 E V1.2-G

Overview

PEF 24624 E V1.2-G from Infineon Technologies is a 4-channel symmetric DSL front-end (SDFE-4) transceiver IC for SHDSL.bis systems, integrating DSP, AFE, line driver, hybrid, and memory per channel. It supports G.SHDSL/G.SHDSL.bis (ETSI TS 101524, ITU G.991.2), delivers 6 Mbit/s per channel, consumes 550 mW/channel, and interfaces via TDM to the SDC-16i controller in DSLAM line cards.

For engineers reviewing the PEF 24624 E V1.2-G datasheet, PEF 24624 E V1.2-G pinout, PEF 24624 E V1.2-G application, or PEF 24624 E V1.2-G equivalent, key selection criteria include per-channel power budget, integrated hybrid tunability, TDM interface timing alignment with SDC-16i, and support for M-pair mode and Packet TC layer bundling in high-density access systems.

Technical Context

The PEF 24624 E V1.2-G implements a fully self-contained SHDSL physical layer for four independent copper pairs, embedding dedicated DSP cores, 4-channel AFEs with programmable gain/offset, and integrated line drivers capable of ±12 V swing. Each channel includes on-die memory for firmware and line adaptation tables.

It operates with only 3.3 V and 1.8 V supplies, uses a tunable hybrid for loop-length-optimized echo cancellation, and connects to the SDC-16i controller via a synchronous TDM bus supporting 16-bit time slots at 125 MHz frame rate - enabling precise ATM/Packet/TDM payload mapping across bundled channels.

Key Specifications

Pinout & Package

PEF 24624 E V1.2-G is housed in a P-LBGA-324 package (27 mm × 27 mm, 1.0 mm pitch, 1.2 mm height) with exposed thermal pad. Pin functions are defined relative to its role as a slave PHY in the SOCRATES-16Bis chipset, synchronized to the SDC-16i master controller.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 4-channel SHDSL front-end applications.

Compared with CX82310-21 and VRX218, PEF 24624 E V1.2-G delivers higher integration, lower per-channel power, and carrier-grade G.SHDSL.bis compliance - making it uniquely suited for high-density, thermally constrained DSLAM/DLC linecards requiring guaranteed interoperability with SDC-16i-based control planes.

Availability

PEF 24624 E V1.2-G is available at Aetrix Electronics and suitable for DSLAM line cards, DLC remote terminals, MSAP aggregation nodes, and EFM equipment requiring stable component supply, long-lifecycle support, and carrier-certified SHDSL.bis performance.

Supply support for PEF 24624 E V1.2-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and communications ICs, with global R&D centers and ISO/TS 16949-certified wafer fabs.

PEF 24624 E V1.2-G belongs to the SOCRATES™ family of wireline communication ICs, engineered specifically for carrier-class symmetric DSL infrastructure - emphasizing ultra-low power per channel, high port density, and standards-compliant interoperability in DSLAM and DLC systems.

FAQ

What is the role of PEF 24624 E V1.2-G in the SOCRATES-16Bis chipset?

PEF 24624 E V1.2-G is the 4-channel SDFE-4 front-end device that handles analog signal processing, line driving, and DSP-based SHDSL.bis modulation/demodulation for four copper pairs. It operates as a slave PHY, receiving timing and control commands from the master SDC-16i controller via TDM interface, and requires no external memory or microcontroller.

Does PEF 24624 E V1.2-G support G.SHDSL.bis M-pair bonding?

Yes - PEF 24624 E V1.2-G natively supports M-pair mode per ITU-T G.991.2 Annex D. When coordinated by the SDC-16i controller, up to four PEF 24624 E devices can be bonded to form a single 24 Mbit/s logical connection across eight copper pairs, with automatic bit-loading and error correction across all channels.

What thermal management is required for PEF 24624 E V1.2-G in high-density linecards?

The P-LBGA-324 package features an exposed thermal pad requiring solder attachment to a minimum 4 cm² copper pour on the PCB's inner ground layer. With 2.2 W total dissipation (4 × 550 mW), thermal design must achieve ≤28 °C/W junction-to-ambient; forced air cooling is recommended above 32 devices per linecard to maintain <105°C junction temperature.

Can PEF 24624 E V1.2-G operate without the SDC-16i controller?

No - PEF 24624 E V1.2-G lacks standalone configuration capability. It relies entirely on the SDC-16i for initialization, firmware loading, TDM slot assignment, and channel bundling control. The device has no JTAG, SPI, or UART debug interface; all register access occurs through the synchronized TDM bus under SDC-16i arbitration.