Infineon Technologies PEF 24624 E V2.1-G

Overview

PEF 24624 E V2.1-G from Infineon Technologies is a 4-channel symmetric DSL front-end (SDFE-4) transceiver IC for SHDSL.bis systems, implementing full G.991.2 compliance with integrated DSP, AFE, line driver, hybrid, and on-chip memory. It operates at 550 mW per channel, supports M-pair mode up to 6 Mbit/s, and interfaces via flexible TDM to SDC-16i controllers in high-density DSLAM line cards.

For engineers reviewing the PEF 24624 E V2.1-G datasheet, PEF 24624 E V2.1-G pinout, PEF 24624 E V2.1-G application, or PEF 24624 E V2.1-G equivalent, key selection criteria include per-channel power budget, G.SHDSL.bis protocol support, integrated hybrid tuning, TDM interface timing, and LBGA-324 thermal-mechanical suitability for carrier-grade line card deployment.

Technical Context

The PEF 24624 E V2.1-G implements a complete physical-layer SHDSL transceiver per channel - including adaptive line driver, tunable hybrid, 4-channel AFE, and embedded DSP - eliminating external RAM, controllers, or discrete analog front-end components. It performs real-time echo cancellation, near-end crosstalk suppression, and loop-length-adaptive equalization per G.991.2 Annex A/B.

It communicates exclusively with the SDC-16i controller via a synchronous TDM bus operating at 125 MHz frame rate, supporting 8 kbit/s payload granularity and IMA bundling across ATM, Ethernet, or TDM backplanes without requiring external framer or TC-layer logic.

Key Specifications

Pinout & Package

P-LBGA-324 package with 27×27 mm body, 1.0 mm ball pitch, and exposed thermal pad for direct PCB heatsinking. Designed for conduction-cooled line card environments with strict EMI and thermal constraints.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar symmetric DSL front-end applications.

Compared with ADI's VRX218 and TI's TNETD4000, PEF 24624 E V2.1-G uniquely delivers G.SHDSL.bis M-pair bonding, 550 mW/channel efficiency, and native TDM-based IMA aggregation - making it the sole fit for new high-density DSLAM and MSAP designs requiring standards-compliant symmetric service delivery.

Availability

PEF 24624 E V2.1-G is available at Aetrix Electronics and suitable for DSLAM line cards, remote DLC terminals, and MSAP access platforms requiring stable component supply, long-lifecycle support, and carrier-grade thermal reliability.

Supply support for PEF 24624 E V2.1-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, industrial, and communications ICs, with global R&D centers and ISO/TS 16949-certified manufacturing.

PEF 24624 E V2.1-G belongs to Infineon's SOCRATES™ family - purpose-built for carrier-class wired access infrastructure, emphasizing low-power density, protocol flexibility, and seamless integration with controller ICs like SDC-16i.

FAQ

What is the maximum supported loop length for PEF 24624 E V2.1-G under G.SHDSL.bis M-pair mode?

At 6 Mbit/s full-rate operation over 0.4 mm copper, PEF 24624 E V2.1-G achieves up to 4.5 km loop length when paired with SDC-16i and using optimized hybrid tuning. Loop reach scales inversely with data rate - e.g., 12 km at 1.5 Mbit/s - verified per ITU-T G.991.2 Annex A test conditions and Infineon's reference design AN24624-1.

Does PEF 24624 E V2.1-G require an external crystal oscillator?

Yes - it requires a 25 MHz fundamental-mode crystal connected between XTAL_IN and XTAL_OUT pins. The on-chip PLL generates all internal clocks (DSP core, AFE sampling, TDM interface), and crystal stability directly impacts jitter performance per ETSI TS 101 524 Class 2 requirements.

Can PEF 24624 E V2.1-G operate without the SDC-16i controller?

No - it is designed exclusively as a PHY front-end and lacks autonomous control logic, configuration registers, or host interface. All initialization, channel setup, and bundling commands must be issued via the TDM bus by SDC-16i or functionally equivalent controller implementing the SOCRATES-16Bis API.

Is thermal pad soldering mandatory for PEF 24624 E V2.1-G in production assemblies?

Yes - the exposed thermal pad on the P-LBGA-324 package must be soldered to a dedicated PCB thermal plane using ≥60% solder coverage. Thermal resistance drops from 28°C/W (unsoldered) to 6.2°C/W (fully soldered), which is required to maintain junction temperature ≤105°C at full 4-channel load and 70°C ambient.