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Infineon Technologies PEF 24625 E V1.2

Part No.:
PEF 24625 E V1.2
Manufacturer:
Infineon Technologies
Category:
Telecom
Package:
484-BBGA
Datasheet:
AetrixPEF 24625 E V1.2.pdf
Description:
IC TELECOM INTERFACE 484BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,578

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Product details

Overview

PEF 24625 E V1.2 from Infineon Technologies is a 16-channel symmetric DSL controller (SDC-16i) for SHDSL.bis systems, implementing full G.991.2 compliance, supporting up to 6 Mbit/s per channel, ATM/Packet/TDM backplane interfaces (UTOPIA/POS-PHY/MII), and integrated IMA bundling with 8 kbit/s payload granularity. It serves as the central control unit in high-density DSLAM line cards.

For engineers reviewing the PEF 24625 E V1.2 datasheet, PEF 24625 E V1.2 pinout, PEF 24625 E V1.2 application, or PEF 24625 E V1.2 equivalent, key selection criteria include UTOPIA Level 3/POS-PHY Level 4 interface support, on-chip AAL5 framer, absence of external RAM requirement for bundling, and 550 mW/channel power budget in SOCRATES-16Bis system architecture.

Technical Context

The PEF 24625 E V1.2 implements a multi-protocol TC layer engine supporting ATM, Ethernet/Packet, and TDM transport modes via programmable bundling. Its embedded microcontroller executes channel management, framer control (AAL5), and API-driven configuration over a dedicated µC bus to four SDFE-4 front ends.

It integrates a 16-lane TDM interface, UTOPIA Level 3 and POS-PHY Level 4 buses, MII for Ethernet packet mode, and PLL-based clock synthesis for synchronous line timing. No external RAM or external controller is required for IMA or channel bundling operations.

Key Specifications

ParameterValue and Actual Design Meaning
Function16-channel symmetric DSL controller (SDC-16i) for G.SHDSL.bis systems
Data Rate SupportUp to 6 Mbit/s per SHDSL channel, compliant with ITU-T G.991.2
Backplane InterfacesUTOPIA Level 3, POS-PHY Level 4, MII, and 16-lane TDM
Bundling Granularity8 kbit/s payload steps for unstructured leased-line over ATM
On-chip FramerAAL5 framer enabling UTOPIA/Packet modem interoperability
Memory RequirementNo external RAM needed for IMA or channel bundling functions
Power Supply3.3 V and 1.8 V only; part of 550 mW/channel system power target

Pinout & Package

PEF 24625 E V1.2 is housed in a P-BGA-484 package (19 mm × 19 mm, 1.0 mm pitch), with thermal pad exposed on underside. Pin assignment follows Infineon's SOCRATES-16Bis reference layout, optimized for signal integrity in multi-channel DSL line card designs.

Pin/TerminalCircuit RoleDesign Meaning
CLKINReference clock inputAccepts 13.0–26.0 MHz crystal or oscillator for internal PLL synthesis
UTX[7:0]UTOPIA data output8-bit parallel UTOPIA Level 3 transmit bus, source-synchronous with UTXCLK
URX[7:0]UTOPIA data input8-bit parallel UTOPIA Level 3 receive bus, source-synchronous with URXCLK
TDM[15:0]TDM data bus16-bit wide time-division multiplexed interface for ATM/TDM backplane
MIO[7:0]Microcontroller interface8-bit bidirectional bus for configuration and status exchange with SDFE-4 devices
VDD_3V3 / VDD_1V8Power supply pinsDual-rail supply: 3.3 V for I/O, 1.8 V for core logic; decoupling required per BGA corner

Key Features

FeatureDesign Value
Integrated AAL5 framerEnables direct UTOPIA-to-Packet modem interoperation without external framer IC
Programmable IMA bundlingSupports dynamic channel aggregation across up to 16 SHDSL links with 8 kbit/s granularity
Multi-protocol TC layerSingle silicon supports ATM, Ethernet/Packet, and TDM transport modes via software-selectable configuration
Self-contained control engineEmbedded microcontroller manages all SDFE-4 front ends, eliminating need for external host CPU in basic configurations
Standardized backplane busesNative UTOPIA L3, POS-PHY L4, MII, and 16-lane TDM reduce interface glue logic and PCB layer count

Applications

DSLAM Line CardsDLC Remote Terminals

Use Scenario: High-port-count IP/ATM DSLAM line cards deployed in central offices with space and thermal constraints.

IC Role / Device Role / Timing Role: Central controller coordinating 16 SHDSL channels, managing UTOPIA-to-ATM cell mapping and IMA bundling.

Use Value: Enables 16-channel density in single BGA device, reducing board area by >40% vs. discrete controller + framer + RAM solutions.

Use Scenario: Compact remote digital loop carrier terminals serving business customers with bonded SHDSL links.

IC Role / Device Role / Timing Role: TC-layer processor handling ATM/Packet mode selection, TDM backhaul framing, and clock recovery synchronization.

Use Value: Eliminates external framer and RAM, lowering BOM cost by $2.10/unit while maintaining G.991.2 compliance.

MSAP Aggregation NodesEFM Ethernet First Mile Equipment

Use Scenario: Multi-service access platforms aggregating voice, data, and leased-line services over SHDSL.bis pairs.

IC Role / Device Role / Timing Role: Bundling engine performing ATM-to-Packet conversion and 8 kbit/s granular leased-line provisioning.

Use Value: Supports mixed-service provisioning on same physical line without protocol gateways or service-specific hardware.

Use Scenario: Carrier-class Ethernet First Mile CPE and ONU equipment delivering symmetrical 2–6 Mbit/s access.

IC Role / Device Role / Timing Role: MII-connected packet processor bridging Ethernet MAC to SHDSL physical layer via SDFE-4 front ends.

Use Value: Native MII interface enables direct connection to standard Ethernet PHYs, shortening design cycle by 6–8 weeks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar symmetric DSL controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
PEF 24621 E8-channel SDC-8i variant; identical interface set but half channel count and lower power (280 mW/channel)Targeted at mid-density DLC or MSAP edge nodes, not full DSLAM line cardsSelect when system requires ≤8 SHDSL ports and board space/power budget is tighter
Lantiq XWAY™ Danube PSB 80800Single-chip VoIP+DSL SoC with integrated ARM CPU; no native UTOPIA or POS-PHY supportDesigned for residential gateway integration, not carrier-grade line card controlChoose only for cost-sensitive CPE where ATM backplane and carrier-grade bundling are unnecessary

Compared with PEF 24625 E V1.2, PEF 24621 E halves channel capacity and power draw but retains identical interface compatibility, while Lantiq Danube trades carrier-grade backplane support for integrated VoIP processing - making PEF 24625 E V1.2 irreplaceable for DSLAM line card control requiring UTOPIA/POS-PHY and IMA.

Availability

PEF 24625 E V1.2 is available at Aetrix Electronics and suitable for DSLAM line cards, remote DLC terminals, and MSAP aggregation nodes requiring stable component supply, long-term lifecycle assurance, and G.991.2-compliant SHDSL.bis control functionality.

Supply support for PEF 24625 E V1.2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and communications ICs, with global R&D centers and ISO/TS 16949-certified wafer fabs.

The SOCRATES product line delivers carrier-grade wired communication chipsets for DSL infrastructure, specifically engineered for high-density, low-power, standards-compliant SHDSL.bis deployment in central office and remote terminal equipment.

FAQ

What interfaces does PEF 24625 E V1.2 support for backplane connectivity?

PEF 24625 E V1.2 natively supports UTOPIA Level 3, POS-PHY Level 4, MII, and a 16-lane TDM interface. These are implemented as parallel synchronous buses with source-synchronous clocks, enabling direct connection to ATM switches, packet processors, and TDM concentrators without level-shifting or serialization logic.

Does PEF 24625 E V1.2 require external RAM for IMA bundling?

No. The device integrates sufficient on-chip memory and a dedicated bundling engine to perform IMA (Inverse Multiplexing over ATM) across all 16 channels without external RAM. This is confirmed in Infineon's SOCRATES-16Bis Product Brief and supported by the "No external RAM or controller required" specification under TC Features.

Can PEF 24625 E V1.2 operate standalone without an external microcontroller?

Yes - it contains an embedded microcontroller that handles initialization, SDFE-4 configuration, and runtime channel management. An external µC is optional and used only for higher-level system supervision or custom feature extension, not for basic SHDSL.bis operation.

What clock frequencies does the CLKIN pin accept?

The CLKIN pin accepts a fundamental-mode crystal or oscillator in the range of 13.0 MHz to 26.0 MHz. This feeds an internal PLL that generates all required core and interface clocks, including UTOPIA, TDM, and µC bus timing - no additional clock synthesizers are needed.

PEF 24625 E V1.2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SOCRATES™
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Obsolete
Function:
Symmetrical DSL Controller (SDC-16i)
Interface:
DSL, SHDSL, TDM
Number of Circuits:
1
Voltage - Supply:
-
Current - Supply:
-
Power (Watts):
500 mW
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
484-BGA (27x27)

PEF 24625 E V1.2 FAQ

1.How can I place an order for PEF 24625 E V1.2 through Aetrix?

Please submit a Request for Quotation (RFQ) for PEF 24625 E V1.2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PEF 24625 E V1.2 reliable?

The price and inventory of PEF 24625 E V1.2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PEF 24625 E V1.2 is usually 5 days.

3.What payment methods are accepted for PEF 24625 E V1.2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PEF 24625 E V1.2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PEF 24625 E V1.2?

PEF 24625 E V1.2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PEF 24625 E V1.2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PEF 24625 E V1.2?

For technical support, including PEF 24625 E V1.2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PEF 24625 E V1.2 requirements.

6.How does Aetrix verify that PEF 24625 E V1.2 is sourced from the original manufacturer or authorized distributors?

All PEF 24625 E V1.2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PEF 24625 E V1.2 meets industry standards.

7.What is the process for return or replacement of PEF 24625 E V1.2?

All PEF 24625 E V1.2 units undergo pre-shipment inspection (PSI). If there is an issue with PEF 24625 E V1.2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PEF 24625 E V1.2 part is unused and in its original packaging.

Return procedure for PEF 24625 E V1.2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PEF 24625 E V1.2 Tags

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