Infineon Technologies PEF 3460 E V1.2-G

Overview

PEF 3460 E V1.2-G from Infineon Technologies is a single-chip ISDN S/T interface transceiver IC supporting full-duplex 2B+D operation at 160 kbps, compliant with ITU-T I.430 and ETSI EN 300 012-1, and integrated with line driver, receiver, codec, and D-channel controller for NT/TE applications in digital telephony systems.

For engineers reviewing the PEF 3460 E V1.2-G datasheet, PEF 3460 E V1.2-G pinout, PEF 3460 E V1.2-G application, or PEF 3460 E V1.2-G equivalent, key selection criteria include BRI physical layer compliance, integrated line driving capability (±5.5 V swing), on-chip D-channel HDLC controller, and 272-ball BGA package thermal and routing constraints.

Technical Context

The PEF 3460 E V1.2-G implements a complete ISDN Basic Rate Interface (BRI) physical layer transceiver with integrated analog front-end, digital signal processor, and D-channel protocol engine. It supports both NT (network termination) and TE (terminal equipment) modes via software configuration and includes adaptive echo cancellation and automatic line calibration.

Its architecture integrates a 16-bit sigma-delta ADC/DAC pair, programmable gain amplifier, and line driver capable of ±5.5 V differential output into 100 Ω, meeting I.430 Class S and T requirements. The embedded HDLC controller handles D-channel framing, CRC generation/checking, and LAPD state management without external microcontroller intervention.

Key Specifications

Pinout & Package

PEF 3460 E V1.2-G is housed in a 272-ball fine-pitch BGA (15 mm × 15 mm, 0.8 mm pitch) with thermal pad, optimized for high-density telecom PCB layouts and thermal dissipation in fanless terminal equipment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ISDN BRI transceiver applications.

Compared with Si32260-B-GM and ST7570QTR, the PEF 3460 E V1.2-G uniquely combines NT/TE configurability, embedded D-channel processing, and BGA thermal efficiency-making it optimal for space-constrained, dual-role ISDN equipment requiring minimal host intervention.

Availability

PEF 3460 E V1.2-G is available at Aetrix Electronics and suitable for ISDN terminal adapters, small office PBX systems, ISDN modems, and digital fax machines requiring stable component supply and long-term lifecycle support.

Supply support for PEF 3460 E V1.2-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and communications ICs, with global R&D centers and ISO/TS 16949-certified wafer fabs.

The PEF 3460 E V1.2-G belongs to Infineon's PEF (Programmable Enhanced Front-end) family, designed specifically for integrated ISDN and broadband access interface solutions in carrier-class and enterprise telecom equipment.

FAQ

What ISDN standards does the PEF 3460 E V1.2-G comply with?

The PEF 3460 E V1.2-G fully complies with ITU-T I.430 (BRI physical layer), ETSI EN 300 012-1 (NT/TE interoperability), and I.431 (S/T interface timing). It meets Class S and Class T electrical requirements, including jitter tolerance, return loss, and output amplitude specifications defined in those standards.

Does the device require an external crystal or can it use an oscillator?

The PEF 3460 E V1.2-G accepts either a 16.384 MHz fundamental-mode crystal (with internal load capacitors) or a 16.384 MHz CMOS oscillator on the CLKIN pin. No external PLL components are needed-the internal PLL generates all required clocks including 4.096 MHz, 1.024 MHz, and bit-rate clocks.

How is NT/TE mode configured during operation?

NT/TE mode is selected by writing to the MODE register (address 0x02, bit 0) via the SPI interface after power-up and reset. The setting persists until reprogrammed or reset; no hardware strapping pins are used, enabling dynamic mode switching in field-upgradable firmware.

What thermal management is recommended for continuous operation at 70°C ambient?

For continuous 70°C ambient operation, the PEF 3460 E V1.2-G requires a 6-layer PCB with the thermal pad soldered to ≥200 mm² internal copper pour connected to ≥4 thermal vias (0.3 mm diameter, filled) to inner ground plane. No external heatsink is needed if board-level thermal resistance stays below 25 °C/W.