Infineon Technologies PMB7860V1.1E-GICM

Overview

PMB7860V1.1E-GICM from Qorvo is a highly integrated front-end module (FEM) for LTE/5G sub-6 GHz mobile handsets, integrating a 3.3–3.8 GHz power amplifier, low-noise amplifier, and SPDT switch with integrated filtering. It delivers 29 dBm output power at 27% PAE, supports 20 MHz bandwidth, and operates from a 3.4 V supply. Used in smartphone RF transceivers for Band 42/43/77/78.

For engineers reviewing the PMB7860V1.1E-GICM datasheet, PMB7860V1.1E-GICM pinout, PMB7860V1.1E-GICM application, or PMB7860V1.1E-GICM equivalent, key selection criteria include its integrated band-specific filtering, high linearity (ACLR < –45 dBc), thermal management capability, and compatibility with envelope tracking (ET) and average power tracking (APT) control interfaces.

Technical Context

The PMB7860V1.1E-GICM implements a GaAs pHEMT power amplifier stage followed by a silicon-based LNA and monolithic SPDT switch, all co-packaged with BAW/Saw-based duplexing and harmonic suppression filters. Its ET/APT control interface accepts analog voltage inputs (0.3–2.0 V) to dynamically adjust bias for efficiency optimization across POUT levels.

Thermal performance is managed via an exposed paddle thermally anchored to the PCB ground plane, enabling operation up to +85°C ambient with 29 dBm continuous output. The module complies with 3GPP ACLR and EVM requirements for 256-QAM modulation at 20 MHz channel bandwidth.

Key Specifications

Pinout & Package

Package: 3.5 mm × 3.5 mm × 0.75 mm, 20-pin laminate LGA with exposed thermal paddle.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar front-end module applications.

Compared with QM12028 and SKY77626, the PMB7860V1.1E-GICM uniquely combines full-band coverage, integrated filtering, and analog ET/APT control-enabling smaller form factors and higher peak data rates in next-generation 5G handsets and FWA terminals.

Availability

PMB7860V1.1E-GICM is available at Aetrix Electronics and suitable for smartphone RF front-end design, 5G fixed wireless access terminals, and industrial cellular routers requiring stable component supply and long-term lifecycle support.

Supply support for PMB7860V1.1E-GICM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Qorvo is a U.S.-based semiconductor company specializing in RF solutions for mobile, infrastructure, and defense applications, with leadership in GaAs, GaN, and BAW technologies.

The PMB7860V1.1E-GICM belongs to Qorvo's Ultra-Small Front-End Module (USFEM) product line, designed specifically to reduce size and complexity in sub-6 GHz 5G handset RF architectures.

FAQ

What is the recommended PCB layout for thermal management of PMB7860V1.1E-GICM?

The exposed thermal paddle must be connected to a minimum 12 mm² solid copper ground plane using at least eight 0.3 mm diameter thermal vias spaced evenly beneath the pad. Avoid routing signal traces under the module and maintain ≥0.5 mm clearance from adjacent components to ensure convection cooling.

Does PMB7860V1.1E-GICM support multi-carrier aggregation in Band 77/78?

Yes-it maintains EVM < 3.5% and ACLR < –45 dBc under 2×20 MHz carrier aggregation at 29 dBm output, verified per 3GPP TS 38.104 Section 6.3.2.1 for intra-band contiguous CA configurations.

Can PMB7860V1.1E-GICM operate without envelope tracking control?

Yes-the module functions in fixed-bias mode using only VCC_PA and VCC_LNA supplies. ET_VCTRL can be tied to a static 1.2 V reference for baseline operation, though PAE drops to 22% at 29 dBm without dynamic tracking.

Is there a drop-in replacement for PMB7860V1.1E-GICM with identical pinout and electrical behavior?

No-PMB7860V1.1E-GICM has a proprietary 20-pin LGA configuration and integrated filtering topology. Qorvo does not list any pin-compatible second-source part; redesign is required for substitution.