Cypress Semiconductor Corp S25FL127SABBHIT03
- Part No.:
- S25FL127SABBHIT03
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL127SABBHIT03.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL127SABBHIT03 from Infineon is a 128 Mb (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, and 64 KB uniform sector erase capability. It supports Quad Read at up to 54 MBps, features internal hardware ECC for single-bit error correction, and includes 1024-byte OTP array for secure configuration storage. Used in industrial embedded boot code storage requiring AEC-Q100 Grade 2 qualification.
For engineers reviewing the S25FL127SABBHIT03 datasheet, S25FL127SABBHIT03 pinout, S25FL127SABBHIT03 application, or S25FL127SABBHIT03 equivalent, this page provides verified package mapping (8-lead SOIC), confirmed SPI-MIO timing modes (0 and 3), hybrid/uniform erase options, AutoBoot functionality, and real-world endurance (100,000 P/E cycles) and retention (20 years) specs.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-plane read capability and configurable addressing (24-/32-bit). Its SPI-MIO interface supports simultaneous dual/quad I/O data transfers using IO0–IO3 pins under clock polarity/phase modes 0 and 3, enabling high-throughput boot code fetch.
The integrated CFI and SFDP (JESD216B) tables provide standardized configuration discovery, while hardware reset (RESET#) and hold (HOLD#) signals enable deterministic power-up sequencing and suspend/resume during active transfers - critical for automotive ECU firmware integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB) - sufficient for full UEFI firmware + secure bootloader + parameter storage in Tier-1 automotive ECUs |
| Read Speed | Quad Read at 108 MHz = 54 MBps - enables sub-100 ms boot time for 8 MB image |
| Erase Granularity | Uniform 256 KB sectors - ensures software compatibility across FL-S family densities and simplifies OTA update partitioning |
| Endurance | 100,000 program-erase cycles per sector - supports frequent firmware updates in telematics gateways |
| Data Retention | 20 years minimum at +85°C - meets automotive long-life reliability requirements without refresh |
| Voltage Range | 2.7 V to 3.6 V - compatible with standard 3.3 V industrial and automotive power rails |
| Temperature Grade | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood and ADAS domain controller use |
Pinout & Package
Package: 8-lead SOIC (208 mil), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command/address/data transfer; must be asserted before SCK edge |
| SCK | Serial Clock | Master-generated clock; supports modes 0 and 3; max 108 MHz for Quad Read |
| IO0 (SI) | Serial Input / Data I/O 0 | Input for commands/addresses in single I/O mode; bidirectional in multi-I/O mode |
| IO1 (SO) | Serial Output / Data I/O 1 | Output for read data in single I/O; bidirectional in Dual/Quad mode |
| IO2 (WP#) | Write Protect / Data I/O 2 | Hardware write protection when low; also serves as quad I/O line during Quad Read/Program |
| IO3 (HOLD#) | Hold / Data I/O 3 | Suspends ongoing transfer when low; doubles as fourth I/O line in Quad mode |
| VCC | Supply Voltage | 2.7–3.6 V core and I/O supply; decoupling required within 10 mm of pin |
| VSS | Ground | Signal reference for all I/O and core logic; separate analog/digital ground not required |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates external boot controller in cost-sensitive ECUs |
| Internal Hardware ECC | Single-bit error correction with no software overhead - maintains data integrity without CPU intervention during read |
| Hybrid vs Uniform Sector Erase | Selectable via configuration register - allows legacy 4 KB sector compatibility or future-proof 256 KB block erase for OTA efficiency |
| OTP Array (1024 B) | One-time programmable space for keys, calibration data, or unique identifiers - immune to field reprogramming |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector lock - prevents unauthorized firmware modification in secured boot chains |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores calibrated engine maps, diagnostic routines, and bootloader in under-hood ECU with thermal cycling. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AEC-Q100 Grade 2 qualification and AutoBoot execution at power-on. Use Value: 20-year data retention at +105°C ensures firmware persistence over vehicle lifetime without refresh. | Use Scenario: Holds firmware, configuration tables, and HMI assets in modular PLCs deployed in factory automation. IC Role / Device Role / Timing Role: SPI-connected NOR flash providing deterministic boot latency and field-upgradable code storage. Use Value: Uniform 256 KB erase blocks simplify OTA update scheduling and reduce downtime during firmware patching. |
| ADAS Domain Controller | Medical Imaging System Boot Memory |
Use Scenario: Stores sensor fusion algorithms and safety-critical boot images in radar/vision processing units. IC Role / Device Role / Timing Role: High-reliability flash with hardware ECC and ASP for ASIL-B compliant boot path. Use Value: Internal single-bit ECC eliminates need for external error-checking logic, reducing BOM count and board area. | Use Scenario: Retains FDA-certified boot loader and DICOM stack initialization code in portable ultrasound devices. IC Role / Device Role / Timing Role: Secure, long-retention memory with OTP for cryptographic keys and device-specific calibration constants. Use Value: 1024-byte OTP array enables immutable key binding to hardware, satisfying medical device traceability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGBHIZ00 | Same die, identical pinout and command set; differs only in temperature grade (Industrial –40°C to +85°C) | Lacks AEC-Q100 qualification; unsuitable for automotive under-hood placement | Select when operating ambient stays ≤+85°C and automotive qualification is not required |
| Winbond W25Q128JVSIM | 128 Mb SPI NOR, but uses different architecture (no AutoBoot, no ASP, no hybrid erase option) | Requires external boot controller logic; lacks OTP and advanced protection features | Choose for cost-sensitive industrial designs where security and boot autonomy are secondary |
Compared with S25FL127SABBHIT03, the Cypress alternative matches functionally but omits automotive qualification, while the Winbond part sacrifices AutoBoot, ASP, and OTP - making the Infineon device uniquely suited for safety-critical, self-booting systems requiring long-term firmware integrity.
Availability
S25FL127SABBHIT03 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, ADAS domain controllers, and medical imaging system boot memory requiring stable component supply and AEC-Q100 compliance.
Supply support for S25FL127SABBHIT03 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions.
The FL-S family targets high-reliability embedded systems needing fast, secure, and long-life serial NOR flash - especially automotive, industrial, and medical applications demanding AEC-Q100 qualification and hardware-based data protection.
FAQ
What is the maximum clock frequency supported for Quad Read operations?
The S25FL127SABBHIT03 supports Quad Read at up to 108 MHz, delivering 54 MBps throughput. This is validated across the full industrial temperature range (–40°C to +105°C) and requires proper PCB layout with matched trace lengths and controlled impedance (50 Ω ±10%) for all four I/O lines.
Does this device require external hardware ECC circuitry?
No. The device integrates hardware-based ECC that automatically detects and corrects single-bit errors during read operations. No external logic or software intervention is needed - correction occurs transparently within the flash controller, preserving system-level timing predictability.
Can the AutoBoot address be changed after initial programming?
Yes. The AutoBoot start address is stored in a dedicated configuration register (CR3[7:0]) and can be modified via standard Write Enable + Write Status Register commands. Changes persist across power cycles and do not require OTP programming - enabling flexible field updates to boot location.
Is the 8-lead SOIC package RoHS-compliant and lead-free?
Yes. The S25FL127SABBHIT03 in 8-lead SOIC (208 mil) is fully RoHS-compliant and Pb-free, meeting JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) and qualifying for standard reflow profiles including peak temperatures up to 260°C.
S25FL127SABBHIT03 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL127SABBHIT03 FAQ
1.How can I place an order for S25FL127SABBHIT03 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL127SABBHIT03 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL127SABBHIT03 reliable?
The price and inventory of S25FL127SABBHIT03 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL127SABBHIT03 is usually 5 days.
3.What payment methods are accepted for S25FL127SABBHIT03?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL127SABBHIT03 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL127SABBHIT03?
S25FL127SABBHIT03 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL127SABBHIT03 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL127SABBHIT03?
For technical support, including S25FL127SABBHIT03 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL127SABBHIT03 requirements.
6.How does Aetrix verify that S25FL127SABBHIT03 is sourced from the original manufacturer or authorized distributors?
All S25FL127SABBHIT03 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL127SABBHIT03 meets industry standards.
7.What is the process for return or replacement of S25FL127SABBHIT03?
All S25FL127SABBHIT03 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL127SABBHIT03, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL127SABBHIT03 part is unused and in its original packaging.
Return procedure for S25FL127SABBHIT03:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL127SABBHIT03 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

