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Cypress Semiconductor Corp S25FL256LAGBHV030

Part No.:
S25FL256LAGBHV030
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL256LAGBHV030.pdf
Description:
SERIAL FLASH, 256MB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:340

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Product details

Overview

S25FL256LAGBHV030 from Infineon is a 256-Mbit serial NOR flash memory with Quad SPI interface, 3.0 V supply voltage, and 100 MHz clock frequency, supporting XIP (execute-in-place) operation in automotive applications requiring AEC-Q100 Grade 2 qualification.

For engineers reviewing the S25FL256LAGBHV030 datasheet, S25FL256LAGBHV030 pinout, S25FL256LAGBHV030 application, or S25FL256LAGBHV030 equivalent, key selection criteria include automotive temperature range (-40°C to +105°C), dual/quad I/O mode support, sector-erase capability, and hardware reset protection for safety-critical boot code storage.

Technical Context

This device implements a standard Serial Peripheral Interface (SPI) with extended quad I/O (QPI) mode for higher throughput. It uses a 64-Mbyte address space organized into 512 uniform 64-Kbyte sectors and supports both 4-Kbyte subsector and full-chip erase commands.

The memory includes a 256-byte page programming buffer, configurable write protection via status register bits and hardware WP# pin, and built-in ECC for single-bit error correction during read operations - all compliant with AEC-Q100 Grade 2 reliability requirements.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 Mbit (32 Mbyte), sufficient for storing full MCU boot firmware and configuration data in automotive ECUs.
InterfaceQuad SPI (QPI) and standard SPI, enabling up to 400 MB/s effective throughput in QPI mode.
Supply Voltage2.7 V to 3.6 V, compatible with 3.3 V automotive power rails and tolerant of transient dips.
Operating Temperature-40°C to +105°C, qualified per AEC-Q100 Grade 2 for under-hood and body control modules.
Erase Granularity64-Kbyte sectors and 4-Kbyte subsectors, allowing fine-grained firmware updates without full chip erase.
Write ProtectionHardware WP# pin + software status register lock, preventing accidental overwrites during power transitions.

Pinout & Package

Package: 8-pin SOIC (208 mil) with standard pinout for serial NOR flash devices.

Pin/TerminalCircuit RoleDesign Meaning
SO/IO1Serial Output / Quad I/O 1Output data line in standard SPI; bidirectional I/O in QPI mode for data lane 1.
SI/IO0Serial Input / Quad I/O 0Input data line in standard SPI; bidirectional I/O in QPI mode for data lane 0.
WP#/IO2Write Protect / Quad I/O 2Active-low hardware write protection; bidirectional I/O in QPI mode for data lane 2.
HOLD#/IO3Hold / Quad I/O 3Pauses ongoing serial transfer; bidirectional I/O in QPI mode for data lane 3.
CLKClock InputSynchronizes all serial transfers; supports up to 100 MHz for high-speed read/write.
CS#Chip SelectActive-low enable signal; initiates command sequence on rising edge of CS# after clock stabilization.
VCCPower Supply3.3 V nominal supply; decoupling required within 10 mm of pin for noise immunity.
GNDGroundReference return path for all I/O and core logic; must be connected to low-impedance system ground plane.

Key Features

FeatureDesign Value
XIP (Execute-in-Place)Enables direct code execution from flash without loading into RAM, reducing boot latency and SRAM footprint in microcontrollers.
Dual/Quad I/O ModeConfigurable interface scaling: dual I/O doubles, quad I/O quadruples throughput vs standard SPI, optimizing bandwidth-constrained designs.
Built-in ECCSingle-bit error correction on read operations ensures data integrity for safety-critical boot images without external logic.
AEC-Q100 Grade 2Qualified for automotive use at -40°C to +105°C ambient, including HTOL, ESD, and thermal cycling stress testing.
Hardware Reset ProtectionInternal power-on reset circuit prevents spurious writes during power ramp-up, critical for reliable boot code retention.

Applications

Automotive Instrument ClusterADAS Camera Module

Use Scenario: Storing calibrated display firmware and real-time graphics assets for digital instrument panels.

IC Role / Device Role / Timing Role: Non-volatile boot and runtime code storage with deterministic read latency for GUI rendering pipelines.

Use Value: XIP capability eliminates RAM copy overhead, while AEC-Q100 Grade 2 ensures operation across vehicle cabin temperature extremes.

Use Scenario: Holding image sensor calibration data and firmware for front-facing collision avoidance cameras.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for safety-critical vision processing binaries and lookup tables.

Use Value: Hardware write protection and ECC prevent corruption of calibration parameters during ECU power cycling or EMI events.

Engine Control Unit (ECU)Body Control Module (BCM)

Use Scenario: Hosting engine management firmware, fault logs, and adaptive learning maps in gasoline/diesel powertrain systems.

IC Role / Device Role / Timing Role: Primary boot memory with fast random access for real-time control loop initialization and parameter loading.

Use Value: 64-Kbyte sector erase enables incremental firmware updates without disrupting engine runtime diagnostics or calibration history.

Use Scenario: Storing lighting control logic, door module configurations, and user preference profiles in centralized body electronics.

IC Role / Device Role / Timing Role: Persistent configuration storage with robust write endurance for frequent parameter changes during vehicle personalization.

Use Value: Subsector erase (4-Kbyte) allows selective update of individual lighting zones or window control settings without full memory reprogramming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY15B104QN-PSOC4-Mbit FRAM with unlimited write endurance and no erase cycles; 3.3 V, -40°C to +85°C industrial grade.Lacks AEC-Q100 qualification and XIP support; suited for frequent data logging, not boot code.Select only when write-cycle count dominates reliability concerns and automotive qualification is not required.
MX25L25645GZC-10G256-Mbit SPI NOR flash, 3.3 V, 100 MHz, but AEC-Q100 Grade 3 (-40°C to +85°C), no built-in ECC.Lower temperature rating and no on-die ECC limits use to non-safety-critical infotainment subsystems.Acceptable for cost-sensitive cabin modules where full Grade 2 compliance is not mandated.

Compared with CY15B104QN-PSOC and MX25L25645GZC-10G, the S25FL256LAGBHV030 uniquely combines AEC-Q100 Grade 2 qualification, on-die ECC, and XIP support - making it the only option among the three qualified for ASIL-B–related boot memory in powertrain and ADAS domains.

Availability

S25FL256LAGBHV030 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS camera modules, and engine control units requiring stable component supply across long production lifecycles.

Supply support for S25FL256LAGBHV030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

This device belongs to the S25FL family of automotive-qualified serial NOR flash memories, designed specifically for reliable, high-integrity code and data storage in safety-critical vehicle subsystems.

FAQ

Is S25FL256LAGBHV030 pin-compatible with earlier S25FLxxx generations?

Yes - it maintains identical 8-pin SOIC (208 mil) mechanical footprint and SPI/QPI pin mapping with S25FL128S and S25FL064L, enabling drop-in replacement in existing layouts where density and temperature grade upgrades are needed.

Does this part support octal DDR interface?

No - the S25FL256LAGBHV030 supports only standard SPI, dual I/O, and quad I/O modes. Octal DDR is not implemented; maximum interface speed is 100 MHz in QPI mode with four data lines.

What is the typical endurance and data retention specification?

It guarantees 100,000 program/erase cycles per sector and 20-year data retention at 85°C, validated per JEDEC JESD22-A117 and AEC-Q100 stress test requirements for automotive flash memory.

Can hardware reset protection be disabled?

No - the internal power-on reset circuit is fixed and non-configurable. It automatically asserts reset during VCC ramp-up and release upon stabilization, ensuring consistent initialization behavior without software or external components.

S25FL256LAGBHV030 Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
FL-L
Package/Case:
24-TBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (6x8)

S25FL256LAGBHV030 FAQ

1.How can I place an order for S25FL256LAGBHV030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL256LAGBHV030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL256LAGBHV030 reliable?

The price and inventory of S25FL256LAGBHV030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256LAGBHV030 is usually 5 days.

3.What payment methods are accepted for S25FL256LAGBHV030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256LAGBHV030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL256LAGBHV030?

S25FL256LAGBHV030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL256LAGBHV030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL256LAGBHV030?

For technical support, including S25FL256LAGBHV030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256LAGBHV030 requirements.

6.How does Aetrix verify that S25FL256LAGBHV030 is sourced from the original manufacturer or authorized distributors?

All S25FL256LAGBHV030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256LAGBHV030 meets industry standards.

7.What is the process for return or replacement of S25FL256LAGBHV030?

All S25FL256LAGBHV030 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256LAGBHV030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL256LAGBHV030 part is unused and in its original packaging.

Return procedure for S25FL256LAGBHV030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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