Infineon Technologies S25FL512SAGBHMA10
- Part No.:
- S25FL512SAGBHMA10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHMA10.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,924
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL512SAGBHMA10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sector erase architecture, Quad-Input Page Programming, and integrated hardware ECC. It supports Fast/Quad/DDR read modes up to 80 MHz clock rate (80 MBps Quad DDR), operates across –40°C to +105°C (Industrial Plus), and is used in boot code storage for ARM Cortex-A/RISC-V-based edge gateways.
For engineers reviewing the S25FL512SAGBHMA10 datasheet, S25FL512SAGBHMA10 pinout, S25FL512SAGBHMA10 application, or S25FL512SAGBHMA10 equivalent, key selection criteria include Quad DDR read throughput, 100,000 program-erase cycles, OTP security array size, AEC-Q100 Grade 2 qualification, and SO16 vs. FBGA package compatibility with existing PCB layouts.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true single-bit ECC correction per 512-byte page without software overhead. Its command set is backward-compatible with S25FL-A/K/P families and supports extended 32-bit addressing for >16 MB memory maps.
The dual-voltage I/O interface (VIO = 1.65–3.6 V, VCC = 2.7–3.6 V) allows interoperability with 1.8 V and 3.3 V host controllers, while AutoBoot functionality executes preconfigured Normal or Quad Read at power-up or reset-critical for deterministic boot timing in industrial PLCs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - supports full Linux kernel + rootfs + firmware image in single device |
| Read Throughput | 80 MBps (Quad DDR @ 80 MHz) - enables sub-100 ms boot time for 8 MB images |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and avoids fragmentation in OTA update partitions |
| Endurance | 100,000 program-erase cycles - meets 10-year field life with daily firmware updates |
| Data Retention | 20 years minimum - ensures long-term reliability in unpowered storage applications |
| Security | 1024-byte OTP array + ASP - supports secure boot key storage and password-protected sector locking |
| Temperature Range | –40°C to +105°C (Industrial Plus) - qualified for fanless edge compute enclosures |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, 1.27 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command latching; must be deasserted between commands to avoid bus contention |
| SCK | Serial Clock Input | Drives all timing for SDR/DDR modes; supports up to 133 MHz SDR or 80 MHz DDR clock rates |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; becomes bidirectional I/O0 in Dual/Quad mode |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; becomes bidirectional I/O1 in Dual/Quad mode |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; functions as I/O2 in Quad mode |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing read/write without deselecting chip; serves as I/O3 in Quad mode |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling required within 10 mm of pin |
| VIO | I/O Supply | 1.65–3.6 V independent rail for interface voltage translation; enables mixed-voltage system integration |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically initiates Normal or Quad Read from user-defined address at power-up/reset-eliminates external boot controller dependency |
| Hardware ECC | On-the-fly single-bit error correction per 512-byte page with no CPU overhead or latency penalty |
| Quad-Input Page Programming | Enables reliable programming under low-clock-rate conditions (e.g., 10 MHz SCK), reducing EMI in noise-sensitive environments |
| Advanced Sector Protection (ASP) | Per-sector lock via boot code or 128-bit password-prevents unauthorized firmware modification in field-deployed devices |
| CFI & SFDP Support | Standardized configuration discovery (JEDEC JESD216) enables automatic driver initialization without hard-coded parameters |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Stores boot loader, FPGA configuration bitstream, and real-time OS kernel in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with deterministic AutoBoot execution and 256-KB sector granularity for safe firmware rollback. Use Value: Eliminates external boot ROM and reduces BOM count; 100K-cycle endurance supports over-the-air updates every 48 hours for 10+ years. | Use Scenario: Holds safety-critical boot code and sensor calibration data in front-camera modules compliant with ISO 26262 ASIL-B. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified SPI flash providing verified boot path with OTP-secured cryptographic keys. Use Value: Meets automotive thermal and reliability requirements; ASP prevents runtime tampering during vehicle operation. |
| Edge AI Gateway Code Storage | Medical Imaging Device Configuration |
Use Scenario: Hosts inference engine binaries, model weights, and secure boot manifest in fanless edge gateways deployed in factory automation. IC Role / Device Role / Timing Role: High-throughput Quad DDR interface delivers >60 MBps sustained read for rapid model loading during cold start. Use Value: Reduces boot latency by 40% vs. legacy SPI flash; 20-year data retention ensures integrity across equipment lifecycle. | Use Scenario: Stores DICOM configuration profiles, calibration tables, and regulatory compliance logs in portable ultrasound systems. IC Role / Device Role / Timing Role: Secure, temperature-stable memory with 1024-byte OTP for HIPAA-compliant audit trail storage. Use Value: Enables FDA-required traceability without external secure element; SO16 package fits tight board space constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGNFI10 | Same die, identical electrical specs, but in 24-ball FAB024 BGA (6 × 8 mm) package | Requires PCB redesign for BGA layout; better thermal dissipation in high-power edge compute | Select when board space is constrained and thermal management prioritized over hand-solderability |
| Winbond W25Q512JWIM (512 Mb, 1.8 V I/O) | 1.8 V only I/O (VIO), no 3.3 V support; lacks AutoBoot and ASP features; lower endurance (50K cycles) | Not suitable for Industrial Plus temp range or secure boot applications requiring OTP/ASP | Consider only for cost-sensitive, non-safety-critical consumer designs with 1.8 V host interface |
Compared with S25FL512SAGBHMA10, the FAB024 variant offers identical functionality in compact BGA form, while the Winbond part trades security, endurance, and voltage flexibility for lower unit cost-making it unsuitable for industrial or automotive use cases demanding guaranteed reliability and secure boot.
Availability
S25FL512SAGBHMA10 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, edge AI gateways, and medical imaging devices requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S25FL512SAGBHMA10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT applications.
The S25FL-S family targets high-reliability embedded systems needing fast, secure, and thermally robust serial NOR flash-designed specifically for deterministic boot, firmware update resilience, and functional safety compliance.
FAQ
What is the maximum clock frequency supported in Quad DDR mode?
The S25FL512SAGBHMA10 supports up to 80 MHz clock frequency in Quad DDR mode, delivering 80 MBps effective read throughput. This is validated under VIO = VCC = 3.0–3.6 V conditions and requires strict PCB layout adherence to DDR timing margins per Infineon's layout guidelines in section 6.1 of the datasheet.
Does this part support hardware write protection independent of software commands?
Yes-WP# pin provides hardware-level write protection for status register bits and sector protection registers. When WP# is held low, all program and erase commands targeting protected sectors are blocked regardless of software state, meeting IEC 62443-3-3 requirements for secure firmware update paths.
Is the 1024-byte OTP array one-time programmable only, or can it be erased?
The 1024-byte OTP array is strictly one-time programmable: bits can be changed from '1' to '0' only, with no provision for erasure or reprogramming. Once written, contents remain immutable-even after power cycling-ensuring cryptographic key persistence and tamper-evident configuration storage.
How does AutoBoot behavior interact with the status register's QUAD bit setting?
AutoBoot uses the QUAD bit value stored in the status register at power-up to determine whether to execute Normal or Quad Read. If QUAD=1, AutoBoot performs Quad Read from the configured address; if QUAD=0, it defaults to Normal Read-enabling flexible boot mode selection without external configuration pins.
S25FL512SAGBHMA10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 750µs
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHMA10 FAQ
1.How can I place an order for S25FL512SAGBHMA10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHMA10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHMA10 reliable?
The price and inventory of S25FL512SAGBHMA10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHMA10 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHMA10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHMA10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHMA10?
S25FL512SAGBHMA10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHMA10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHMA10?
For technical support, including S25FL512SAGBHMA10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHMA10 requirements.
6.How does Aetrix verify that S25FL512SAGBHMA10 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHMA10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHMA10 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHMA10?
All S25FL512SAGBHMA10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHMA10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHMA10 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHMA10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL512SAGBHMA10 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

