Cypress Semiconductor Corp S25FL512SDPBHI210
- Part No.:
- S25FL512SDPBHI210
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SDPBHI210.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:5,650
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL512SDPBHI210 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 qualification (–40°C to +105°C), used for firmware storage in automotive ADAS control units.
For engineers reviewing the S25FL512SDPBHI210 datasheet, S25FL512SDPBHI210 pinout, S25FL512SDPBHI210 application, or S25FL512SDPBHI210 equivalent, key selection factors include Quad/DDR read support up to 80 MHz, internal ECC, OTP security, and SOIC-16 package compatibility with legacy S25FL-P designs.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, supporting SPI clock modes 0 and 3, extended 32-bit addressing, and CFI/SFDP parameter discovery. It integrates hardware ECC for single-bit correction and AutoBoot functionality for automatic firmware fetch at power-up.
The flash supports simultaneous dual-plane operations via Multi-I/O command set, enabling concurrent read/program/erase across independent sectors. Its versatile I/O voltage range (1.65 V to 3.6 V) allows interoperability with 1.8 V and 3.3 V host controllers without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full MCU boot image + OTA update partition in automotive ECUs |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables sub-100 ms firmware load time for real-time boot |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and avoids fragmentation in field-upgradeable systems |
| Endurance | 100,000 program-erase cycles - meets automotive requirement for 15+ years of over-the-air update cycles |
| Data Retention | 20 years minimum at +85°C - ensures firmware integrity over full vehicle lifecycle without refresh |
| Security | 1024-byte OTP + ASP - supports secure boot key storage and password-protected sector lockdown |
| Supply Range | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - enables direct interfacing with both 1.8 V SoCs and 3.3 V microcontrollers |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, industrial-plus temperature grade (–40°C to +105°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge for valid transaction |
| SCK | Serial Clock Input | Drives all timing for command, address, and data transfer; supports up to 133 MHz SDR or 80 MHz DDR |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode |
| HOLD# / IO3 | Hold Input / I/O3 | Suspends ongoing read without deselecting chip; doubles as I/O3 in Quad mode |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling required per datasheet layout guidelines |
| VIO | I/O Supply | 1.65–3.6 V supply for interface pins; independent of VCC to support mixed-voltage systems |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance PCB return path |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates host-side boot initialization code |
| Internal ECC | Hardware-generated single-bit error correction - prevents silent data corruption without CPU overhead |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enables secure firmware partitioning |
| Quad-Input Page Programming (QPP) | 4-line write interface for 512-byte pages - reduces programming time by 4× vs. standard SPI in slow-clock hosts |
| CFI & SFDP Support | Standardized configuration discovery via JEDEC JESD216 - enables plug-and-play driver integration in Linux/Bare Metal |
Applications
| Automotive ADAS ECU | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader, safety-critical application code, and calibration data in lane-keeping assist modules. IC Role / Device Role / Timing Role: Primary nonvolatile firmware repository with AEC-Q100 Grade 2 qualification and 20-year retention. Use Value: Enables deterministic <100 ms cold boot via AutoBoot and Quad Read, meeting ISO 26262 ASIL-B timing constraints. | Use Scenario: Holds firmware images and configuration tables for programmable logic controllers operating in factory automation environments. IC Role / Device Role / Timing Role: Field-upgradable code storage with uniform 256-KB erase blocks and 100K-cycle endurance. Use Value: Supports zero-downtime firmware updates via background erase and dual-bank emulation using sector protection. |
| Medical Imaging System Boot | Avionics Display Controller |
Use Scenario: Stores FPGA bitstream and embedded OS kernel for MRI subsystem controllers requiring high reliability. IC Role / Device Role / Timing Role: Secure boot memory with 1024-byte OTP for cryptographic keys and ASP for tamper-resistant partitioning. Use Value: Meets IEC 62304 Class C software requirements through hardware-enforced write protection and ECC. | Use Scenario: Provides certified firmware storage for cockpit display units subject to DO-160 environmental stress and DO-254 hardware assurance. IC Role / Device Role / Timing Role: High-integrity flash with –40°C to +105°C operation and 20-year data retention under thermal cycling. Use Value: Eliminates need for external ECC logic or refresh circuitry, reducing BOM count and certification effort. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFI200 | Same die, identical pinout and command set, but SOIC-16 with industrial temp (–40°C to +85°C) only | Lacks AEC-Q100 qualification and +105°C rating | Select when automotive qualification is not required and cost optimization is prioritized |
| Winbond W25Q512JWIM > 210 | 512 Mb, 1.8 V / 3.3 V dual-supply, QPI/DTR support, but no AutoBoot or ASP | No hardware-based secure boot or password-locked sector protection | Select when higher clock rates (200 MHz DTR) are needed and security features are handled externally |
Compared with S25FL512SDPBHI210, the Cypress alternative trades automotive qualification for lower cost, while the Winbond part offers faster interface speeds but requires external security implementation - making Infineon's device optimal for safety-critical, temperature-extended, and secure-boot applications.
Availability
S25FL512SDPBHI210 is available at Aetrix Electronics and suitable for automotive ADAS systems, industrial PLCs, medical imaging controllers, and avionics displays requiring stable component supply across extended temperature and long-life programs.
Supply support for S25FL512SDPBHI210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with leadership in automotive-grade memory and sensor solutions.
The FL-S family targets high-reliability embedded systems requiring AEC-Q100 qualification, extended temperature operation, and integrated security - designed specifically for automotive, industrial, and medical firmware storage where data integrity and longevity are critical.
FAQ
What is the maximum clock frequency supported for Quad DDR reads?
The S25FL512SDPBHI210 supports Quad DDR read commands at up to 80 MHz, delivering 80 MBps throughput when VIO = VCC = 3.0–3.6 V. This is validated per datasheet AC specification section 5.5 and requires proper impedance-controlled PCB routing and termination matching.
Does this part support hardware reset via the RESET# pin?
Yes, the RESET# pin provides asynchronous hardware reset that clears internal state, aborts ongoing operations, and returns the device to standby mode. After deassertion, the device enters ready state within 30 µs and accepts new commands without requiring SPI initialization sequence.
How is the 1024-byte OTP array accessed and protected?
The OTP array is accessed via dedicated One-Time-Program commands (0x4B/0x42) and locked permanently after first write. Protection is enforced by status register bit SRP0 and hardware WP# assertion; once programmed, OTP contents cannot be erased or rewritten, ensuring immutable key storage.
Can the device operate with VIO = 1.8 V while VCC = 3.3 V?
Yes, the device supports independent VIO (1.65–3.6 V) and VCC (2.7–3.6 V) supplies. At VIO = 1.8 V and VCC = 3.3 V, Quad Read operates at 66 MHz (33 MBps), enabling interoperability with 1.8 V FPGAs or application processors without level shifters.
S25FL512SDPBHI210 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 66 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SDPBHI210 FAQ
1.How can I place an order for S25FL512SDPBHI210 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDPBHI210 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDPBHI210 reliable?
The price and inventory of S25FL512SDPBHI210 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDPBHI210 is usually 5 days.
3.What payment methods are accepted for S25FL512SDPBHI210?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDPBHI210 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDPBHI210?
S25FL512SDPBHI210 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDPBHI210 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDPBHI210?
For technical support, including S25FL512SDPBHI210 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDPBHI210 requirements.
6.How does Aetrix verify that S25FL512SDPBHI210 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDPBHI210 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDPBHI210 meets industry standards.
7.What is the process for return or replacement of S25FL512SDPBHI210?
All S25FL512SDPBHI210 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDPBHI210, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDPBHI210 part is unused and in its original packaging.
Return procedure for S25FL512SDPBHI210:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL512SDPBHI210 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

