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Cypress Semiconductor Corp S25FS128SAGBHM200

Part No.:
S25FS128SAGBHM200
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FS128SAGBHM200.pdf
Description:
IC FLASH 128MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:360

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Product details

Overview

S25FS128SAGBHM200 from Infineon is a 128 Mb (16 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply, supporting Quad I/O and DDR Quad I/O read modes up to 80 MBps, featuring 65-nm MIRRORBIT™ Eclipse architecture, hybrid/ uniform sector erase options, and integrated hardware ECC for single-bit error correction. It targets boot code storage in industrial microcontroller systems requiring fast XIP-capable nonvolatile memory.

For engineers reviewing the S25FS128SAGBHM200 datasheet, S25FS128SAGBHM200 pinout, S25FS128SAGBHM200 application, or S25FS128SAGBHM200 equivalent, key selection criteria include 1.8 V operation, AEC-Q100 Grade 2 qualification (–40°C to +105°C), WSON 6 × 8 mm package, SFDP/CFI support, and OTP array for secure configuration storage.

Technical Context

This device implements a SPI-MIO interface compliant with JEDEC JESD216 SFDP v1.6 and Common Flash Interface (CFI), enabling automatic configuration discovery and flexible command mapping. It supports both standard SPI clock modes (0 and 3) and DDR mode with programmable latency and wrap burst addressing.

The internal architecture includes dual-bank erase capability, program/erase suspend-resume functionality, and hardware-managed ECC across all read operations. Sector protection is implemented via status register bits, hardware WP#, and Advanced Sector Protection (ASP) with password-controlled access to individual sectors.

Key Specifications

Parameter Value and Actual Design Meaning
Density 128 Mbit (16 MB) - sufficient for full MCU boot image + firmware partitioning in resource-constrained embedded systems
Supply Voltage 1.7 V to 2.0 V - enables direct integration with 1.8 V I/O domains without level shifting
Max Read Speed 80 MBps (DDR Quad I/O @ 80 MHz) - supports high-speed execute-in-place (XIP) execution for real-time applications
Erase Endurance 100,000 cycles minimum - validated for frequent firmware update scenarios in field-deployed equipment
Data Retention 20 years minimum at +85°C - ensures long-term reliability in industrial control and automotive ECUs
Temperature Grade AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive applications and extended-temperature industrial gateways
Package WSON 6 × 8 mm (WNH008), 8-pin - compact footprint with thermal pad for improved power dissipation in dense PCB layouts

Pinout & Package

Package: WSON 6 × 8 mm (WNH008), 8-lead, Pb-free, with exposed thermal pad (pin 8 = VSS, thermally connected).

Pin/Terminal Circuit Role Design Meaning
1 (CS#) Chip Select Active-low enable for SPI command latching; must be held low during entire transaction including address/data phases
2 (SO / IO1) Serial Output / I/O1 Primary data output in standard SPI; bidirectional in Dual/Quad I/O modes for read/write data multiplexing
3 (WP# / IO2) Write Protect / I/O2 Hardware sector lock when asserted low; functions as second I/O line in multi-I/O commands
4 (VSS) Ground Signal and power return path; connects to thermal pad for thermal management
5 (VCC) Power Supply 1.8 V core and I/O supply; requires local 1 µF ceramic decoupling adjacent to pin
6 (SI / IO0) Serial Input / I/O0 Command/address input in standard SPI; bidirectional in multi-I/O modes for command and data transfer
7 (SCK) Serial Clock Edge-triggered clock input; supports up to 133 MHz SDR or 80 MHz DDR for timing-critical boot sequences
8 (IO3 / RESET#) I/O3 / Reset Third/fourth I/O line in Quad mode; active-low hardware reset that clears internal state and aborts ongoing operations

Key Features

Feature Design Value
Hardware ECC Single-bit error correction with no software overhead - maintains data integrity without CPU intervention during reads
Program/Erase Suspend Allows background read access during long erase operations - essential for real-time systems requiring concurrent memory access
OTP Array 1024-byte one-time programmable region - stores immutable keys, calibration data, or device-specific identifiers
Advanced Sector Protection (ASP) Password-protected per-sector locking - enables fine-grained firmware partitioning with secure boot and OTA update isolation
SFDP v1.6 Support Self-describing parameter table accessible via standard SPI - eliminates hard-coded timing/config values in bootloader firmware

Applications

Industrial PLC Firmware Storage Automotive ADAS Boot Memory

Use Scenario: Storing boot loader, real-time OS kernel, and safety-critical firmware in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with XIP-capable Quad I/O interface and AEC-Q100 Grade 2 qualification.

Use Value: 80 MBps DDR Quad read speed reduces boot time by >40% vs. legacy SPI flash; 20-year retention ensures lifetime firmware integrity without refresh.

Use Scenario: Holding boot code and sensor fusion firmware for camera-based driver assistance modules operating under hood temperature extremes.

IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with OTP for cryptographic keys and ASP for isolated OTA update partitions.

Use Value: Hardware ECC and 100K erase cycles support frequent over-the-air updates while maintaining ASIL-B compliance requirements.

Medical Imaging System Configuration Smart Grid Communication Module

Use Scenario: Storing calibrated imaging parameters, DICOM metadata templates, and regulatory-compliant firmware in portable ultrasound devices.

IC Role / Device Role / Timing Role: Trusted configuration store with write-protection via WP# and status register, plus SFDP-driven initialization.

Use Value: Hybrid sector architecture allows independent erasure of calibration data (4-KB sectors) without disturbing main firmware (64-KB blocks).

Use Scenario: Hosting protocol stack firmware and encryption keys for IEEE 1901.2 PLC modems used in utility smart metering infrastructure.

IC Role / Device Role / Timing Role: Secure, long-life flash with OTP for root-of-trust keys and ASP for segmented firmware update zones.

Use Value: 1.8 V operation minimizes power conversion complexity; deep power-down current (6 µA) extends battery life in backup-powered modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress S25FL128SAGMFI000 Same die, legacy Cypress branding; identical electrical specs, timing, and pinout; lacks updated SFDP v1.6 tables No functional difference in boot or firmware storage use; may require firmware revision for SFDP-dependent initialization Select when legacy design reuse is prioritized and SFDP v1.6 features are unused
Winbond W25Q128JVSIM 3.3 V only; no DDR mode; 40 MBps max Quad read; no hardware ECC; 64-KB uniform sectors only Not suitable for 1.8 V systems or safety-critical applications requiring ECC; limited for high-speed XIP Consider only for cost-sensitive, non-automotive designs with existing 3.3 V infrastructure and no ECC requirement

Compared with S25FL128SAGMFI000, this part adds SFDP v1.6 compliance for future-proof bootloader flexibility; versus W25Q128JVSIM, it delivers 100% higher read bandwidth, ECC assurance, and 1.8 V compatibility-critical for next-gen low-power automotive and industrial platforms.

Availability

S25FS128SAGBHM200 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging systems, and smart grid communication devices requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification.

Supply support for S25FS128SAGBHM200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure memory solutions, with global R&D and manufacturing infrastructure.

This device belongs to Infineon's FS-S family of high-performance SPI NOR flash, designed specifically for automotive and industrial applications demanding robustness, security, and high-speed XIP capability in 1.8 V systems.

FAQ

Does S25FS128SAGBHM200 support Quad Enable (QE) bit configuration via Status Register?

Yes, the QE bit (SR[1]) is programmable via Write Status Register command and must be set to enable Quad I/O mode. The device defaults to standard SPI mode on power-up; QE must be explicitly enabled before issuing Quad Read or Quad Program commands. This configuration persists across power cycles unless cleared by Write Status Register with QE=0.

What is the function of the IO3/RESET# pin during normal operation?

During normal operation, IO3 serves as the fourth I/O line in Quad I/O mode for data transfer. When asserted low, it performs hardware reset: terminating all ongoing operations, clearing internal state machines, and returning the device to standby mode. It does not affect contents of memory or registers but resets command sequencing logic.

How is the 1024-byte OTP array accessed and protected?

The OTP array resides at address 0x00000000–0x000003FF and is accessed using dedicated One-Time Program Array commands (0x4B, 0x42). Once programmed, bits cannot be reset. Protection is enforced by Status Register lock bits (SRP0/SRP1); setting SRP1 permanently locks the entire OTP region against further writes after initial programming.

Can S25FS128SAGBHM200 operate in continuous read (XIP) mode with wrap burst addressing?

Yes, it supports Continuous Read mode with wrap burst addressing (0x0B command), allowing seamless sequential access across page boundaries without reissuing addresses. This mode is optimized for XIP execution, with automatic address increment and wrap behavior defined by burst length (1–256 bytes), reducing CPU overhead during instruction fetch.

S25FS128SAGBHM200 Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
FS-S
Package/Case:
24-TBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FS128SAGBHM200 FAQ

1.How can I place an order for S25FS128SAGBHM200 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS128SAGBHM200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS128SAGBHM200 reliable?

The price and inventory of S25FS128SAGBHM200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS128SAGBHM200 is usually 5 days.

3.What payment methods are accepted for S25FS128SAGBHM200?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS128SAGBHM200 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS128SAGBHM200?

S25FS128SAGBHM200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS128SAGBHM200 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS128SAGBHM200?

For technical support, including S25FS128SAGBHM200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS128SAGBHM200 requirements.

6.How does Aetrix verify that S25FS128SAGBHM200 is sourced from the original manufacturer or authorized distributors?

All S25FS128SAGBHM200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS128SAGBHM200 meets industry standards.

7.What is the process for return or replacement of S25FS128SAGBHM200?

All S25FS128SAGBHM200 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS128SAGBHM200, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS128SAGBHM200 part is unused and in its original packaging.

Return procedure for S25FS128SAGBHM200:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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