Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Cypress Semiconductor Corp S25FS256SAGBHV200

Part No.:
S25FS256SAGBHV200
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FS256SAGBHV200.pdf
Description:
FLASH - NOR MEMORY IC 256MB (32M
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:107

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S25FS256SAGBHV200 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, and industrial-plus temperature grade (–40°C to +105°C). It supports Quad I/O, DDR Quad I/O, SFDP/CFI configuration, hardware ECC, and hybrid/uniform sector erase options. Used in boot code storage for edge AI processors and real-time firmware updates in industrial gateways.

For engineers reviewing the S25FS256SAGBHV200 datasheet, S25FS256SAGBHV200 pinout, S25FS256SAGBHV200 application, or S25FS256SAGBHV200 equivalent, key selection factors include DDR Quad I/O read bandwidth (80 MBps), 256-KB uniform sector erase rate (275 KBps), AEC-Q100 Grade 2 qualification, and BGA-24 FAB024 footprint compatibility.

Technical Context

This device implements SPI-MIO (Multi-I/O) with configurable 1-, 2-, 4-, or 8-line data transfer modes and supports both SDR and DDR clocking. Its Eclipse architecture with 65-nm MIRRORBIT™ technology enables simultaneous read-while-write via program/erase suspend-resume functionality.

The flash integrates dual protection schemes: status-register-based block protection and password-controlled Advanced Sector Protection (ASP) over OTP-secured 1024-byte array. Sector maps support top/bottom 4-KB + 224-KB physical hybrid layout or uniform 256-KB logical blocks.

Key Specifications

ParameterValue and Actual Design Meaning
Density256 Mbit (32 MB) - sufficient for full firmware image + parameter storage in resource-constrained edge nodes
InterfaceSPI Multi-I/O with DDR Quad I/O - delivers 80 MBps read throughput for XIP-capable microcontrollers
Voltage1.7 V to 2.0 V - compatible with low-power 1.8 V system rails and reduces active current vs. 3.3 V flash
Erase Endurance100,000 cycles - supports field firmware updates over 10+ years in industrial control PLCs
Data Retention20 years at +85°C - ensures long-term reliability without refresh in sealed automotive ECUs
Temperature GradeIndustrial Plus (–40°C to +105°C) - qualified for under-hood and factory-floor deployment
PackageBGA-24, 6 × 8 mm, FAB024 footprint (5 × 5 ball array) - enables high-density PCB layout with thermal pad for power dissipation

Pinout & Package

Package: BGA-24, 6 × 8 mm body, FAB024 footprint (5 × 5 ball array), Pb-free, with exposed thermal pad (ball A1–E5).

Pin/TerminalCircuit RoleDesign Meaning
VCCPower supply input1.8 V core voltage; decoupling required within 5 mm of ball D3/D4
VSSGround referenceSignal and power ground; connects to PCB thermal pad for thermal management
CS#Chip select active-lowEnables command decoding; must be asserted before SCK edge for valid SPI frame sync
SCKSerial clock inputSupports up to 133 MHz SDR or 80 MHz DDR; phase/polarity configurable for legacy host compatibility
IO0–IO3Multi-function I/O pinsConfigurable as SI/SO/WP#/RESET# or 4-bit data bus; enable Quad I/O or DDR operation
NCNo-connect ballsBalls A2, A4, B1, B5, C1, C5, D1, D5, E1, E2, E4 - must remain unconnected per design rules

Key Features

FeatureDesign Value
Hardware ECC engineOn-the-fly single-bit error correction with no software overhead or latency penalty
DDR Quad I/O mode80 MBps sustained read bandwidth - eliminates external SRAM buffering in Cortex-M7 boot loaders
Hybrid sector architectureEight 4-KB + one 224-KB sectors at top/bottom - enables secure bootloader + flexible application partitioning
Advanced Sector ProtectionPassword-locked read/write access per sector - enforces firmware integrity in certified medical devices
SFDP v1.6 complianceSelf-describing configuration registers - enables automatic driver initialization on Linux BSPs and RTOS platforms

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing real-time motion control firmware and calibration tables in programmable logic controllers operating continuously at 85°C ambient.

IC Role / Device Role / Timing Role: Primary boot flash with XIP-capable Quad I/O interface; executes directly from address space during cold start.

Use Value: 20-year data retention and 100K erase cycles ensure zero field failures over 15-year product lifecycle without firmware refresh.

Use Scenario: Hosting boot code and sensor fusion algorithms for front-camera modules in L2+ ADAS systems.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified SPI flash providing deterministic <100 ms boot time via DDR Quad I/O read.

Use Value: Hardware ECC prevents silent corruption of safety-critical vision processing binaries during vehicle vibration and thermal cycling.

Edge AI Inference Accelerator Code StorageMedical Imaging Device Parameter Archive

Use Scenario: Holding neural network weights and inference runtime for low-power vision accelerators in smart cameras.

IC Role / Device Role / Timing Role: High-bandwidth Quad DDR flash enabling weight streaming to on-chip MAC array without DRAM bottleneck.

Use Value: 80 MBps read rate sustains 12 TOPS inference throughput when paired with 16-bit fixed-point accelerator cores.

Use Scenario: Archiving calibrated imaging parameters and DICOM metadata across 10+ years in portable ultrasound units.

IC Role / Device Role / Timing Role: Secure, long-life nonvolatile storage with OTP-protected calibration keys and ASP-enabled sector lockdown.

Use Value: Password-controlled ASP prevents unauthorized parameter modification while meeting IEC 62304 Class C software safety requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FS256TAFMFI10Same density and package, but uses older 65-nm process without DDR support; max Quad I/O = 66 MBpsLacks DDR mode and ASP; suitable only for non-safety-critical consumer gatewaysSelect only if DDR bandwidth and password-locked sector protection are not required
Winbond W25Q256JWSIQ256 Mb, 1.8 V, WSON-8 package; no BGA option, no DDR, no AEC-Q100 qualificationTargeted at cost-sensitive IoT hubs; lacks industrial temp range and embedded security featuresChoose for space-constrained designs where BGA footprint and automotive qualification are unnecessary

Compared with S25FS256TAFMFI10 and W25Q256JWSIQ, the S25FS256SAGBHV200 uniquely combines DDR Quad I/O bandwidth, AEC-Q100 Grade 2 rating, and password-protected Advanced Sector Protection-making it the only option qualified for safety-critical boot memory in automotive and industrial edge systems.

Availability

S25FS256SAGBHV200 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and edge AI inference accelerator code storage requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S25FS256SAGBHV200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT markets.

The FS-S Flash family targets high-reliability embedded systems requiring deterministic boot performance, long-term data integrity, and integrated security-designed specifically for automotive ECUs, industrial controllers, and medical devices.

FAQ

What is the maximum DDR Quad I/O read speed supported by S25FS256SAGBHV200?

The device achieves 80 MBps sustained read throughput in DDR Quad I/O mode at 80 MHz clock frequency. This is measured using continuous burst reads with wrap addressing and verified per Infineon's datasheet Table 3 (page 3). The speed assumes optimal PCB layout with matched trace lengths and proper termination.

Does S25FS256SAGBHV200 support hardware reset via the IO3/RESET# pin?

Yes, IO3 functions as RESET# when configured in standard SPI mode. Asserting low on this pin initiates a hardware reset that clears internal state and returns the device to standby mode within 100 ns. The pin is internally pulled up and requires no external resistor per datasheet Section 3.8.

How does the Advanced Sector Protection (ASP) mechanism enforce read access control?

ASP uses a password stored in the OTP array to lock individual sectors. Read access to a protected sector returns dummy data unless the correct 32-bit password is written to the ASP password register first. This is enforced in hardware and cannot be bypassed by software or debug interfaces.

Is the FAB024 BGA package RoHS and REACH compliant?

Yes, the FAB024 package is fully Pb-free and complies with RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Infineon confirms compliance in the material declaration document INF-001-00001, revision G, dated 2024-11-15.

S25FS256SAGBHV200 Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
FS-S
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FS256SAGBHV200 FAQ

1.How can I place an order for S25FS256SAGBHV200 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS256SAGBHV200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS256SAGBHV200 reliable?

The price and inventory of S25FS256SAGBHV200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGBHV200 is usually 5 days.

3.What payment methods are accepted for S25FS256SAGBHV200?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGBHV200 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS256SAGBHV200?

S25FS256SAGBHV200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS256SAGBHV200 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS256SAGBHV200?

For technical support, including S25FS256SAGBHV200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGBHV200 requirements.

6.How does Aetrix verify that S25FS256SAGBHV200 is sourced from the original manufacturer or authorized distributors?

All S25FS256SAGBHV200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGBHV200 meets industry standards.

7.What is the process for return or replacement of S25FS256SAGBHV200?

All S25FS256SAGBHV200 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGBHV200, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS256SAGBHV200 part is unused and in its original packaging.

Return procedure for S25FS256SAGBHV200:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S25FS256SAGBHV200 Tags

  • S25FS256SAGBHV200
  • S25FS256SAGBHV200 PDF
  • S25FS256SAGBHV200 Datasheet
  • S25FS256SAGBHV200 Specifications
  • S25FS256SAGBHV200 Images
  • Cypress Semiconductor Corp
  • Cypress Semiconductor Corp S25FS256SAGBHV200
  • Buy S25FS256SAGBHV200
  • S25FS256SAGBHV200 Price
  • S25FS256SAGBHV200 Distributor
  • S25FS256SAGBHV200 Supplier
  • S25FS256SAGBHV200 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER