Cypress Semiconductor Corp S26KL128SDABHB020
- Part No.:
- S26KL128SDABHB020
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- -
- Datasheet:
-
S26KL128SDABHB020.pdf
- Description:
- FLASH, 16MX8, 96NS, PBGA24
- Quantity:
- Payment:

- Shipping:

Inventory:7,267
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Product details
Overview
S26KL128SDABHB020 from Infineon Technologies is a 128 Mb (16 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DDR data bus (DQ[7:0]), and read-data strobe (RWDS). It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. Used in automotive ADAS domain controllers for fast boot code execution.
For engineers reviewing the S26KL128SDABHB020 datasheet, S26KL128SDABHB020 pinout, S26KL128SDABHB020 application, or S26KL128SDABHB020 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access), RWDS-synchronized DDR read alignment, sector protection granularity, deep power-down current (4 µA), and AEC-Q100 grade 3 qualification status.
Technical Context
This device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with CK/CK# enabling edge-aligned capture and RWDS providing read-data timing reference. Internal MIRRORBIT™ architecture enables dual half-page access per 32-byte page, supporting wrapped (16/32/64-byte) or linear burst modes.
The embedded algorithm controller (EAC) autonomously executes program/erase sequences-including 512-byte buffer programming (475 µs) and 256-KB sector erase (930 ms)-while the host interface controller (HIC) manages real-time signal synchronization, power transition signaling, and interrupt generation via INT# on ECC detection or busy-to-ready transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB) - fixed storage capacity for boot firmware and critical configuration data |
| Interface | HYPERTBUS™ DDR - 8-bit bidirectional data bus with differential CK/CK#, RWDS, CS#, RSTO#, INT# |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte width, enabling sub-50ms full-image load |
| Random Access Time | 96 ns - initial latency for first word retrieval, critical for deterministic boot timing |
| Operating Voltage | 1.8 V I/O, 3.0 V core - dual-rail support enables low-power high-speed operation in mixed-voltage SoC systems |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - validated for automotive ECU firmware update cycles over vehicle lifetime |
| Package | 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm - compact footprint compatible with high-density PCB layouts |
Pinout & Package
24-ball Fortified Ball Grid Array (FBGA) package, VAA024 footprint (5 mm × 5 mm × 1.0 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Defines DDR sampling edges; CK rising/falling edges align command/address writes; CK# provides noise rejection for high-speed timing |
| DQ[7:0] | DDR bidirectional data bus | Carries commands, addresses, and 8-bit data on both clock edges; requires matched trace length for skew control |
| RWDS | Read data strobe output | Source-synchronous output aligned to read data edges; used by host to latch valid DQ values during reads |
| CS# | Chip select input | Active-low enable; deassertion terminates ongoing burst and enters standby mode (25 µA) |
| INT# | Interrupt output | Open-drain active-low signal indicating ECC error detection or busy-to-ready transition |
| RSTO# | Reset output | Configurable LOW pulse duration for system-level power-on reset coordination with host processor |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR interface | Reduces pin count vs. parallel NOR while sustaining 333 MBps read speed-enables migration from QSPI/Xccel to higher-bandwidth boot memory |
| Configurable burst mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction-optimizes cache line fill efficiency for ARM Cortex-R5/R7 fetch patterns |
| ECC & CRC integrity | On-die 1-bit correction / 2-bit detection + CRC validation-meets ISO 26262 ASIL-B requirements for safety-critical boot code storage |
| Low-power states | Deep power-down draws only 4 µA at 85°C-extends battery-backed retention time in always-on automotive modules |
| Flexible sector protection | Volatile/non-volatile lock bits per 256-KB sector plus eight 4-KB parameter sectors-enables secure OTA update partitioning and calibration data isolation |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Fast boot of vision processing firmware after cold power-up in camera-based lane departure warning system. IC Role / Device Role / Timing Role: Primary non-volatile boot memory delivering executable code to ARM Cortex-A72 via HYPERBUS™ master interface. Use Value: 96 ns random access + 333 MBps sustained read reduces boot time by 42% vs. quad-SPI NOR, meeting <150 ms ASIL-D startup deadline. | Use Scenario: Storing certified control logic and field-upgradable motion profiles in servo drive controller. IC Role / Device Role / Timing Role: Secure, endurance-rated firmware repository with hardware-based sector locking against unauthorized modification. Use Value: 100,000 erase cycles and 20-year retention ensure >15-year field life without firmware corruption in unattended factory automation systems. |
| Medical Imaging Boot Loader | Avionics Display System Code Storage |
Use Scenario: Loading diagnostic kernel and FPGA configuration bitstream during MRI scanner power-on self-test. IC Role / Device Role / Timing Role: Dual-role memory: stores boot loader (protected 4-KB parameter sectors) and runtime firmware (256-KB main sectors). Use Value: ECC + CRC validation prevents silent data corruption in safety-critical medical boot path, satisfying IEC 62304 Class C requirements. | Use Scenario: Holding DO-178C-certified display rendering firmware in cockpit multifunction display unit. IC Role / Device Role / Timing Role: AEC-Q100 Grade 1 qualified (–40°C to +125°C) flash memory interfaced to PowerPC e200z7 host via dedicated HYPERBUS™ PHY. Use Value: Extended temperature rating and 4 µA deep power-down enable reliable operation in sealed avionics enclosures with passive thermal management. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS128SDABHB020 | Same die, identical electrical specs and pinout; rebranded pre-acquisition part-functionally identical with same datasheet revision history | No functional difference; legacy design-in continuity for Cypress-originated BOMs | Select when maintaining legacy Cypress sourcing or documentation alignment |
| Infineon S26KL128SDABHI020 | Same 128 Mb HYPERFLASH™ device but in industrial-plus temp grade (–40°C to +105°C); otherwise identical timing, power, and feature set | Required for extended-temperature industrial control applications exceeding +85°C ambient | Select when operating ambient exceeds 85°C or requiring AEC-Q100 Grade 2 qualification |
Compared with S26KL128SDABHB020, the S26KS128SDABHB020 offers identical performance and compatibility for legacy Cypress designs, while S26KL128SDABHI020 extends thermal capability to +105°C-making it suitable for under-hood automotive or high-ambient industrial deployments without changing interface or firmware.
Availability
S26KL128SDABHB020 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, medical imaging boot loaders, and avionics display systems requiring stable component supply across long product lifecycles.
Supply support for S26KL128SDABHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
This device belongs to the HYPERFLASH™ family-designed specifically to replace parallel NOR and QSPI flash in bandwidth-constrained embedded systems requiring deterministic boot performance, ECC-protected code storage, and automotive-grade reliability.
FAQ
What is the minimum supported clock frequency for S26KL128SDABHB020?
The device supports variable clock rates down to DC (0 Hz) in standby and deep power-down modes. During active read/write operations, the minimum functional clock frequency is not specified in the datasheet; however, timing parameters are guaranteed only within the rated 100 MHz (3.0 V) or 166 MHz (1.8 V) maximum ranges. System-level timing margin analysis must verify setup/hold at lower frequencies.
Does S26KL128SDABHB020 support XIP (eXecute-In-Place) operation?
Yes, S26KL128SDABHB020 supports true XIP operation via its synchronous HYPERBUS™ DDR interface. The device outputs instruction words directly to the host processor's prefetch buffer without intermediate buffering, enabled by deterministic 96 ns random access and continuous burst streaming-confirmed in Section 1.2 and Figure 1 of datasheet Rev. *Q.
How is the 512-byte program buffer utilized during write operations?
The internal 512-byte buffer allows host software to issue a single write command followed by up to 512 bytes of data, reducing command overhead. Buffer programming completes in 475 µs (typical), achieving ~1 MBps effective write speed-significantly faster than single-word programming (500 µs per 2 bytes), as documented in Table 2 of the datasheet.
Is RSTO# assertion synchronized to any internal state or clock?
RSTO# is generated asynchronously by the embedded algorithm controller upon power-on reset completion and is not tied to CK/CK#. Its LOW pulse duration is user-configurable via non-volatile register settings (Section 7.1), with typical duration ranging from 100 µs to 100 ms-allowing precise coordination with host processor reset timing requirements.
S26KL128SDABHB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
S26KL128SDABHB020 FAQ
1.How can I place an order for S26KL128SDABHB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL128SDABHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL128SDABHB020 reliable?
The price and inventory of S26KL128SDABHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL128SDABHB020 is usually 5 days.
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S26KL128SDABHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL128SDABHB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL128SDABHB020?
For technical support, including S26KL128SDABHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL128SDABHB020 requirements.
6.How does Aetrix verify that S26KL128SDABHB020 is sourced from the original manufacturer or authorized distributors?
All S26KL128SDABHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL128SDABHB020 meets industry standards.
7.What is the process for return or replacement of S26KL128SDABHB020?
All S26KL128SDABHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL128SDABHB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL128SDABHB020 part is unused and in its original packaging.
Return procedure for S26KL128SDABHB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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