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Cypress Semiconductor Corp S26KL256SDABHA020
- Part No.:
- S26KL256SDABHA020
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- -
- Datasheet:
-
S26KL256SDABHA020.pdf
- Description:
- FLASH, 32MX8, 96NS, PBGA24
- Quantity:
- Payment:
- Shipping:
Inventory:648
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Product details
Overview
S26KL256SDABHA020 from Infineon Technologies is a 256 Mb (32 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit DQ bus, and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, 1-bit ECC correction/2-bit detection, and operates from –40°C to +105°C (Industrial Plus grade). Used in high-performance boot code storage for automotive ADAS domain controllers.
For engineers reviewing the S26KL256SDABHA020 datasheet, S26KL256SDABHA020 pinout, S26KL256SDABHA020 application, or S26KL256SDABHA020 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns tACC), RWDS-synchronized DDR read alignment, 512-byte write buffer efficiency, sector protection granularity, and AEC-Q100 Grade 2 qualification for automotive powertrain firmware storage.
Technical Context
The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes internal program/erase sequences without host intervention. It uses MIRRORBIT™ floating-gate technology for 100,000 program/erase cycles and 20-year data retention.
HYPERBUS™ protocol enables command/address/data multiplexing over the same 8-bit DQ bus using DDR edge-aligned transfers. Read operations support configurable wrapped (16/32/64-byte) or linear bursts, with initial latency of 5–16 clock cycles and automatic page prefetch during linear burst to sustain 333 MBps throughput.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - fixed capacity for boot image and firmware partitioning in safety-critical ECUs. |
| Interface Standard | HYPERTBUS™ DDR - 8-bit bidirectional DQ bus with CK/CK# differential clock and RWDS read strobe for precise timing alignment. |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte, enabling sub-100 ms boot time for 16 MB images. |
| Initial Access Latency | 96 ns tACC - defines minimum time from CS# assertion to first valid data, critical for deterministic boot sequencing. |
| ECC Capability | 1-bit correction / 2-bit detection - hardware-implemented on every read, required for ISO 26262 ASIL-B compliance. |
| Operating Temperature | –40°C to +105°C (Industrial Plus) - qualified per AEC-Q100 Grade 2, suitable for under-hood ECU deployment. |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - validated for infotainment OS update logging and calibration storage. |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Reference for all DDR timing; CK rising/falling edges sample DQ and RWDS; enables jitter-immune synchronization. |
| CS# | Chip select (active low) | Enables device communication; HIGH places device in standby (25 µA); controls access window for burst transactions. |
| RWDS | Read data strobe output | Source-synchronous output aligned to read data edges; used by host to latch DQ[7:0] during read bursts. |
| DQ[7:0] | Bidirectional DDR data bus | Carries command, address, and 8-bit data on both clock edges; requires matched trace length for signal integrity. |
| INT# | Interrupt output | Asserts on ECC error detection or busy-to-ready transition; enables asynchronous host notification without polling. |
| RSTO# | Reset output | Configurable LOW pulse duration for system-level power-on reset; driven after VCC stabilization and internal initialization. |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Reduces pin count vs. parallel NOR: only 12 signals (vs. ≥30) enable 333 MBps read speed with deterministic timing. |
| 512-byte Write Buffer | Improves programming efficiency: 475 µs buffer write time (~1 MBps) vs. 500 µs single-word write (~4 KBps). |
| Configurable Burst Mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction-enables optimal cache-line alignment for ARM Cortex-R5 boot ROM fetch. |
| Hardware ECC Engine | On-the-fly 1-bit correction/2-bit detection per 512-byte sector; eliminates need for software ECC overhead in safety-critical boot path. |
| Volatile/Non-volatile Sector Protection | Per-sector lock bits prevent accidental erase/write; non-volatile setting survives power loss-critical for bootloader integrity. |
Applications
| Automotive ADAS Domain Controller | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing boot code and sensor fusion firmware for radar/vision processing units requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Primary boot memory mapped to ARM Cortex-R5 core; provides deterministic <96 ns access for secure boot ROM execution. Use Value: AEC-Q100 Grade 2 rating and hardware ECC ensure functional safety compliance without external error-handling logic. |
Use Scenario: Holding field-upgradable control logic and configuration data in modular PLC backplanes operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile firmware repository accessed via XMC interface; supports hot-swappable module reprogramming. Use Value: 256-KB uniform sectors and 4-KB parameter sectors allow atomic firmware updates without disrupting runtime I/O scanning. |
| 5G Baseband Radio Unit | Medical Imaging System Boot Memory |
|
Use Scenario: Hosting FPGA bitstreams and DSP firmware in O-RAN compliant radio units requiring rapid cold-start recovery. IC Role / Device Role / Timing Role: High-speed boot source for Xilinx Zynq UltraScale+ MPSoC; leverages 333 MBps read to load 8 MB bitstream in <25 ms. Use Value: Deep power-down mode (4 µA) enables zero-power retention during cell site sleep cycles without data loss. |
Use Scenario: Storing certified DICOM stack boot images and calibration tables in FDA-cleared MRI/PET systems with strict uptime requirements. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware vault; RSTO# synchronizes system reset with memory initialization sequence. Use Value: 20-year data retention and 100K endurance guarantee long-term reliability across multi-decade medical device lifecycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS256SDABHA020 | Same die, identical pinout and timing; rebranded part pre-Infineon acquisition; identical HYPERBUS™ implementation. | No functional difference; legacy ordering channel only; same AEC-Q100 Grade 2 qualification. | Select when sourcing from legacy Cypress-distributed inventory; no design change required. |
| Winbond W25Q256JWSIQ | Quad SPI interface (4-wire), 133 MHz max clock, 40 MBps read; no DDR, no RWDS, no differential clock. | Lacks HYPERBUS™ timing determinism and ECC engine; requires host-side error handling and longer boot times. | Only for cost-sensitive non-automotive designs where 333 MBps throughput and ASIL-B compliance are not required. |
Compared with S26KL256SDABHA020, the Cypress alternative offers identical functionality and drop-in compatibility, while the Winbond part trades speed, ECC, and automotive qualification for lower cost and simpler interface-making it unsuitable for safety-critical or high-throughput boot applications.
Availability
S26KL256SDABHA020 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, 5G radio unit boot loading, and medical imaging system boot memory requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S26KL256SDABHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.
This device belongs to the HYPERFLASH™ family, designed specifically for high-speed, low-pin-count boot memory in automotive and industrial systems demanding deterministic timing, ECC, and AEC-Q100 qualification.
FAQ
Is S26KL256SDABHA020 pin-compatible with earlier S26KL256S variants?
Yes, it uses the same 24-ball FBGA (VAA024) package and identical pin assignments including CK/CK#, RWDS, and RSTO#. The 'A020' suffix denotes the Industrial Plus temperature grade (–40°C to +105°C) and updated mask set, but electrical and mechanical compatibility is maintained per Infineon's migration notice 001-99198 Rev. *Q.
What is the role of RWDS in HYPERBUS™ read operations?
RWDS is a source-synchronous output strobe generated by the device during read bursts. Its transitions align with valid DQ[7:0] data edges, allowing the host to accurately latch data without relying on fixed clock-to-data skew margins. RWDS is not used during write operations and is inactive in standby or deep power-down modes.
Does this device support execute-in-place (XIP) operation?
Yes, S26KL256SDABHA020 supports XIP via its synchronous HYPERBUS™ interface. The host processor can directly fetch instructions from memory-mapped addresses without copying to RAM, enabled by deterministic 96 ns access time and DDR burst streaming-commonly used in ARM Cortex-R5/R7 boot ROM implementations.
How is hardware ECC implemented and verified?
ECC is applied per 512-byte sector using a dedicated on-die Hamming code engine. During read, syndrome calculation occurs in parallel with data output; 1-bit errors are corrected transparently, and 2-bit errors trigger INT# assertion. ECC status is reported via status register bits SR[1:0], and correction is confirmed by comparing post-correction CRC against stored checksum.
S26KL256SDABHA020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
S26KL256SDABHA020 FAQ
1.How can I place an order for S26KL256SDABHA020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL256SDABHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL256SDABHA020 reliable?
The price and inventory of S26KL256SDABHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL256SDABHA020 is usually 5 days.
3.What payment methods are accepted for S26KL256SDABHA020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL256SDABHA020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S26KL256SDABHA020?
S26KL256SDABHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL256SDABHA020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL256SDABHA020?
For technical support, including S26KL256SDABHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL256SDABHA020 requirements.
6.How does Aetrix verify that S26KL256SDABHA020 is sourced from the original manufacturer or authorized distributors?
All S26KL256SDABHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL256SDABHA020 meets industry standards.
7.What is the process for return or replacement of S26KL256SDABHA020?
All S26KL256SDABHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL256SDABHA020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL256SDABHA020 part is unused and in its original packaging.
Return procedure for S26KL256SDABHA020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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