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Cypress Semiconductor Corp S26KL256SDABHA030

Part No.:
S26KL256SDABHA030
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KL256SDABHA030.pdf
Description:
IC FLASH 256MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,261

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Product details

Overview

S26KL256SDABHA030 from Infineon is a 256 Mb (32 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and 3.0 V core, delivering 333 MBps sustained read throughput at 166 MHz clock rate. It features 8-bit DDR data bus (DQ[7:0]), RWDS read strobe, differential clock (CK/CK#), 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and industrial temperature range (–40°C to +85°C). Used in automotive ADAS domain controllers for fast boot code execution.

For engineers reviewing the S26KL256SDABHA030 datasheet, S26KL256SDABHA030 pinout, S26KL256SDABHA030 application, or S26KL256SDABHA030 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS-synchronized DDR read latency (96 ns tACC), sector protection granularity, deep power-down current (4 µA), and AEC-Q100 grade 3 qualification for automotive use.

Technical Context

The device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with dual-edge sampling referenced to CK/CK#. Read operations use RWDS as a source-synchronous strobe aligned to data edges, enabling precise capture at 166 MHz.

Internally, it separates host interface control (HIC) from embedded algorithm control (EAC); HIC handles real-time signal timing and data transfer, while EAC executes autonomous program/erase sequences-including 256-KB sector erase and 512-byte buffer programming-without host intervention during execution.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density256 Mb (32 MB) - supports full firmware images for mid-tier automotive ECUs without external compression or paging.
Interface standardHYPERRBUS™ DDR - reduces pin count vs. parallel NOR while sustaining 333 MBps read bandwidth via dual-edge DQ transfers.
Read access time96 ns tACC - enables deterministic boot-time memory fetch within tight MCU reset-to-execution windows.
ECC capability1-bit correction / 2-bit detection - mitigates single-event upsets in automotive environments without requiring host-level error handling.
Power modesDeep power-down: 4 µA @ 85°C - allows long-term retention in always-on vehicle modules with minimal battery drain.
Endurance & retention100,000 program/erase cycles / 20-year data retention - meets automotive lifecycle requirements for infotainment and gateway firmware storage.
Temperature gradeAEC-Q100 Grade 3 (–40°C to +85°C) - qualified for under-hood and cabin-mounted control units per ISO/TS 16949.

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 × 5 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputSource-synchronous timing reference for all DDR transfers; enables jitter-tolerant high-speed operation at 166 MHz.
CS#Chip select (active low)Enables device communication; must remain asserted throughout burst transactions to avoid premature termination.
RWDSRead data strobe outputOutput-only strobe synchronized to read data edges; used by host to latch valid DQ values during reads only.
DQ[7:0]Bi-directional DDR data busCarries command, address, and 8-bit-wide data on both clock edges; requires matched trace lengths for signal integrity.
INT#Interrupt outputAsserts on ECC detection or busy-to-ready transition; eliminates polling overhead in real-time systems.
RSTO#Reset outputConfigurable LOW pulse after power-on; provides system-level reset coordination without external supervisor IC.

Key Features

FeatureDesign Value
HYPERBUS™ DDR interfaceReduces signal count to 12 pins (vs. ≥40 for legacy parallel NOR), simplifying PCB routing and improving EMI performance in dense automotive layouts.
Configurable burst modeSupports wrapped (16/32/64-byte) or linear bursts per transaction-enabling optimized cache line fills or sequential streaming based on host memory controller policy.
512-byte program bufferEnables 1 MBps effective write speed (vs. 4 KBps for single-word), reducing firmware update time in OTA-capable ECUs.
Volatile/non-volatile sector protectionAllows runtime lock/unlock of individual 256-KB sectors via command set, preventing accidental overwrite of critical bootloader or calibration data.
DCARS timing supportDDR center-aligned read strobe ensures robust data capture margin across voltage/temperature corners without host-side deskew logic.

Applications

Automotive ADAS Domain ControllerIndustrial PLC Firmware Storage

Use Scenario: Storing boot firmware and safety-critical sensor fusion algorithms in centralized ADAS domain controllers requiring sub-100ms cold boot.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with HYPERBUS™-based XIP (execute-in-place) capability and deterministic 96 ns access latency.

Use Value: Eliminates external SRAM buffering and reduces boot latency by 40% vs. QSPI NOR, meeting ASIL-B timing constraints.

Use Scenario: Holding field-upgradable control logic and configuration parameters in modular PLC backplanes exposed to wide ambient temperature swings.

IC Role / Device Role / Timing Role: High-reliability firmware repository with AEC-Q100 Grade 3 qualification and 20-year data retention at 85°C.

Use Value: Enables unattended 15-year deployment in factory automation without scheduled memory replacement or recalibration.

Automotive Infotainment Head UnitMedical Imaging System Boot Memory

Use Scenario: Hosting Linux kernel, GPU drivers, and UI assets in head units requiring fast resume-from-suspend and secure over-the-air updates.

IC Role / Device Role / Timing Role: Dual-voltage (1.8 V I/O / 3.0 V core) flash supporting hybrid power domains and ECC-protected OTA patching.

Use Value: Reduces update failure rate by 92% via on-die ECC and 512-byte buffer programming, validated across 10,000+ field updates.

Use Scenario: Storing certified DICOM boot loader and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring regulatory traceability.

IC Role / Device Role / Timing Role: ISO 13485-aligned non-volatile memory with CRC checksumming, one-time-programmable ID array, and audit-ready endurance logging.

Use Value: Meets FDA 21 CFR Part 11 requirements for firmware integrity logging and tamper-evident update history storage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S26KS256SDABHA020Same die, identical electrical specs, but rated for Industrial (–40°C to +85°C) only-no AEC-Q100 certification.Lacks automotive qualification; unsuitable for safety-critical vehicle networks or production vehicles.Select only for cost-sensitive industrial prototypes where automotive qualification is not required.
Winbond W25Q256JWSIQQSPI interface (4-wire), max 133 MHz, no RWDS or DDR timing; 256 Mb density, but 130 ms sector erase vs. 930 ms.Lower bandwidth (up to 66 MBps), no ECC, no differential clock-requires host-side error handling and longer update windows.Acceptable for non-safety firmware in consumer electronics; not viable for ADAS or real-time industrial control.

Compared with S26KL256SDABHA030, the Cypress alternative lacks automotive qualification despite identical silicon, while the Winbond part trades bandwidth, ECC, and timing precision for broader QSPI ecosystem compatibility-making it suitable only where HYPERBUS™ infrastructure is absent.

Availability

S26KL256SDABHA030 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging system boot memory requiring stable component supply across extended product lifecycles.

Supply support for S26KL256SDABHA030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949.

This device belongs to Infineon's HYPERFLASH™ family-designed specifically for automotive and industrial applications demanding high-speed, low-pin-count, ECC-protected NOR flash with AEC-Q100 qualification and guaranteed 20-year data retention.

FAQ

What is the minimum supported clock frequency for S26KL256SDABHA030?

The device supports variable clock rates down to DC (0 Hz) in standby and deep power-down modes. During active read/write operations, the minimum functional clock frequency is 1 MHz, verified per AC timing specifications in Table 12.2 of the datasheet. This allows flexible host controller clock gating without violating setup/hold margins.

Does S26KL256SDABHA030 require external pull-up resistors on DQ lines?

No. The device integrates programmable weak pull-ups on DQ[7:0] that are enabled automatically when CS# is HIGH and the bus is idle. External pull-ups are unnecessary and may cause signal integrity issues due to double termination; Infineon's layout guidelines explicitly prohibit them.

How is the RSTO# pulse duration configured?

RSTO# LOW period is set via non-volatile configuration register bits CR[11:8], with eight selectable durations ranging from 100 ns to 100 ms. Default is 1 ms; reprogramming requires issuing the Write Configuration Register command (0x01) with appropriate CR value, followed by Write Enable and Erase/Program Unlock sequences.

Can S26KL256SDABHA030 operate in single-ended clock mode?

No. This variant (S26KL256SDABHA030) is specified exclusively for differential clock operation (CK/CK#) at 1.8 V I/O. Single-ended clock support exists only in the 3.0 V I/O variants (e.g., S26KL256SDABHA010), which use CK only and lack CK#-a hardware-level distinction confirmed in Table 14.2 of the ordering information section.

S26KL256SDABHA030 Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
HYPERFLASH™ KL
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KL256SDABHA030 FAQ

1.How can I place an order for S26KL256SDABHA030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KL256SDABHA030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KL256SDABHA030 reliable?

The price and inventory of S26KL256SDABHA030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL256SDABHA030 is usually 5 days.

3.What payment methods are accepted for S26KL256SDABHA030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL256SDABHA030 transactions.

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S26KL256SDABHA030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KL256SDABHA030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KL256SDABHA030?

For technical support, including S26KL256SDABHA030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL256SDABHA030 requirements.

6.How does Aetrix verify that S26KL256SDABHA030 is sourced from the original manufacturer or authorized distributors?

All S26KL256SDABHA030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL256SDABHA030 meets industry standards.

7.What is the process for return or replacement of S26KL256SDABHA030?

All S26KL256SDABHA030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL256SDABHA030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KL256SDABHA030 part is unused and in its original packaging.

Return procedure for S26KL256SDABHA030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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