Cypress Semiconductor Corp S26KL256SDABHB030
- Part No.:
- S26KL256SDABHB030
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KL256SDABHB030.pdf
- Description:
- IC FLASH 256MBIT PAR 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:676
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Product details
Overview
S26KL256SDABHB030 from Infineon is a 256 Mb (32 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and operates across –40°C to +105°C (Industrial Plus grade) in automotive and industrial embedded boot storage applications.
For engineers reviewing the S26KL256SDABHB030 datasheet, S26KL256SDABHB030 pinout, S26KL256SDABHB030 application, or S26KL256SDABHB030 equivalent, key selection criteria include HYPERBUS™ timing compliance (96 ns random access), ECC 1-bit correction/2-bit detection, deep power-down current (4 µA), RSTO# programmable reset pulse, and FBGA-24 package compatibility with high-density MCU boot interfaces.
Technical Context
The device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with RWDS edge-aligned to CK/CK# transitions during reads. Its dual-controller architecture separates host interface control (HIC) for signal timing and data transfer from embedded algorithm control (EAC) managing program/erase sequences.
It supports configurable burst modes-wrapped (16/32/64 bytes) or linear-with automatic page prefetch enabling sustained 333 MBps throughput. DCARS (DDR Center-Aligned Read Strobe) ensures precise data capture timing, while INT# signals ECC errors or busy-to-ready transitions without wake-up latency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - sufficient for full MCU firmware image + parameter storage in automotive ADAS ECUs |
| Interface Protocol | HYPERRBUS™ DDR - reduces pin count vs parallel NOR while maintaining high-speed burst reads |
| Max Read Throughput | 333 MBps - achieved via 166 MHz differential clock and dual-edge 8-bit data transfers |
| Random Access Time | 96 ns - enables fast interrupt vector fetch and real-time code execution from flash |
| ECC Capability | 1-bit correction / 2-bit detection - protects against single-event upsets in safety-critical systems |
| Power Modes | Deep Power-Down: 4 µA (typical) - extends battery life in always-on vehicle modules |
| Endurance & Retention | 100,000 cycles / 20 years - meets AEC-Q100 Grade 2 requirements for automotive lifetime reliability |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 × 5 mm, 0.8 mm pitch, RoHS-compliant, suitable for automated SMT assembly in space-constrained automotive modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Provides precise timing reference for DDR data capture; eliminates single-ended clock skew limitations |
| CS# | Chip select (active low) | Enables device communication; must be asserted before command/address setup on DQ bus |
| RWDS | Read data strobe output | Indicates valid read data windows; edge-aligned to CK/CK# transitions for reliable sampling |
| DQ[7:0] | Bi-directional DDR data bus | Carries commands, addresses, and 16-bit data in both directions using double-data-rate signaling |
| INT# | Interrupt output | Asserts on ECC error detection or busy-to-ready transition; requires no external pull-up |
| RSTO# | Reset output | Generates system-level power-on reset pulse; LOW duration user-configurable via internal register |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Reduces signal count to 12 pins (vs ≥40 for legacy parallel NOR), simplifying PCB routing and EMI management |
| Configurable Burst Mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction, optimizing cache line alignment for ARM Cortex-M7/A7 cores |
| Program Buffer | 512-byte write buffer enables ~1 MBps programming speed, reducing firmware update time by >90% vs single-word writes |
| Advanced Sector Protection | Volatile and non-volatile lock bits per 256-KB sector prevent accidental overwrite of bootloader or calibration data |
| Automotive Qualification | AEC-Q100 Grade 2 (–40°C to +105°C) and ISO/TS 16949 certified for use in engine control, infotainment, and ADAS systems |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot code, real-time control algorithms, and calibration tables for gasoline/diesel engine management systems. IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced directly to MCU's HYPERBUS™ controller for zero-wait-state execution. Use Value: 96 ns random access and 333 MBps burst read enable deterministic startup and fast ISR response within <100 µs. | Use Scenario: Holds firmware images and configuration data for modular programmable logic controllers in factory automation. IC Role / Device Role / Timing Role: High-reliability code storage with ECC and sector protection, accessed over industrial-grade HYPERBUS™ link. Use Value: 100,000 program/erase cycles and 20-year retention ensure field-upgradeable operation over 15+ year product lifecycle. |
| ADAS Camera Module Boot Memory | Medical Imaging System Code Storage |
Use Scenario: Stores boot firmware and image processing kernels for automotive surround-view camera systems operating at –40°C to +105°C. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified HYPERFLASH™ memory providing secure, fast boot under thermal stress. Use Value: Deep power-down (4 µA) and RSTO# reset coordination reduce standby power in always-on vision sensors. | Use Scenario: Hosts diagnostic firmware and safety-critical boot loader in FDA-cleared portable ultrasound devices. IC Role / Device Role / Timing Role: Safety-assured code storage with 1-bit ECC correction and non-volatile sector locking for regulatory compliance. Use Value: 256-KB uniform sectors allow isolated firmware partitioning; CRC and ECC meet IEC 62304 Class C software requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S26KL256SDABHI030 | Same density and interface, but rated for Industrial (–40°C to +85°C) instead of Industrial Plus (–40°C to +105°C) | Lacks extended temperature support required for under-hood automotive deployment | Select when operating ambient stays below +85°C and cost optimization is prioritized |
| S26KS256SDABHB030 | Identical package and timing, but uses 3.0 V I/O (not 1.8 V) and single-ended clock (CK only) | Requires different host PHY design; incompatible with 1.8 V differential-clock HYPERBUS™ controllers | Choose only if existing board uses 3.0 V signaling and lacks CK# routing capability |
Compared with S26KL256SDABHI030 and S26KS256SDABHB030, the S26KL256SDABHB030 uniquely combines 1.8 V differential-clock operation, +105°C rating, and identical FBGA-24 footprint-enabling drop-in replacement in thermally demanding automotive designs without PHY redesign or derating.
Availability
S26KL256SDABHB030 is available at Aetrix Electronics and suitable for automotive ECU boot storage, industrial PLC firmware updates, and ADAS camera module deployment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S26KL256SDABHB030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for industrial and automotive markets.
This part belongs to the HYPERFLASH™ family-designed specifically to replace parallel NOR flash in high-performance embedded systems requiring fast, low-pin-count, DDR-capable non-volatile memory with automotive-grade robustness.
FAQ
What is the minimum supported clock frequency for S26KL256SDABHB030?
The device supports variable clock rates down to DC for command execution, but functional read/write operations require a minimum clock frequency of 1 MHz to maintain timing margin for internal state machines and embedded algorithm sequencing. Lower frequencies may cause timeout errors during sector erase or buffer programming.
Does S26KL256SDABHB030 support octal SPI or QSPI interfaces?
No. S26KL256SDABHB030 exclusively implements the HYPERBUS™ DDR interface with CK/CK#, CS#, RWDS, and DQ[7:0]. It does not support SPI, QSPI, or any serial peripheral interface; host systems must integrate a HYPERBUS™-compliant memory controller.
How is the RSTO# pulse width configured?
RSTO# LOW duration is set via the Configuration Register (CR) bit [RSTO_DUR], with options of 1 ms, 10 ms, or 100 ms. The setting persists after power cycle and is programmed using the Write Configuration Register command (0x01) followed by Write Enable (0x06) and Write Register (0x71) sequences.
Can S26KL256SDABHB030 be used in linear burst mode without pre-fetching?
Yes. Linear burst mode operates without mandatory pre-fetching-the device outputs sequential data from the starting address until CS# deassertion. However, automatic next-page pre-fetch is enabled by default to sustain 333 MBps throughput; it can be disabled via Configuration Register bit [PF_EN] if deterministic latency is required over peak bandwidth.
S26KL256SDABHB030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- HYPERFLASH™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KL256SDABHB030 FAQ
1.How can I place an order for S26KL256SDABHB030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL256SDABHB030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL256SDABHB030 reliable?
The price and inventory of S26KL256SDABHB030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL256SDABHB030 is usually 5 days.
3.What payment methods are accepted for S26KL256SDABHB030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL256SDABHB030 transactions.
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4.How is shipping managed for S26KL256SDABHB030?
S26KL256SDABHB030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL256SDABHB030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL256SDABHB030?
For technical support, including S26KL256SDABHB030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL256SDABHB030 requirements.
6.How does Aetrix verify that S26KL256SDABHB030 is sourced from the original manufacturer or authorized distributors?
All S26KL256SDABHB030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL256SDABHB030 meets industry standards.
7.What is the process for return or replacement of S26KL256SDABHB030?
All S26KL256SDABHB030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL256SDABHB030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL256SDABHB030 part is unused and in its original packaging.
Return procedure for S26KL256SDABHB030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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