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Cypress Semiconductor Corp S26KL256SDABHM030

Part No.:
S26KL256SDABHM030
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KL256SDABHM030.pdf
Description:
IC FLASH 256MBIT PAR 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:608

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Product details

Overview

S26KL256SDABHM030 from Infineon is a 256 Mb (32 MB) HYPERFLASH™ synchronous NOR flash memory with HYPERBUS™ DDR interface, 1.8 V I/O, differential clock (CK/CK#), 8-bit data bus (DQ[7:0]), and RWDS read strobe. It delivers 333 MBps sustained read throughput at 166 MHz, supports 256-KB uniform sector erase, and operates across –40°C to +105°C (Industrial Plus grade) in automotive and industrial embedded boot storage applications.

For engineers reviewing the S26KL256SDABHM030 datasheet, S26KL256SDABHM030 pinout, S26KL256SDABHM030 application, or S26KL256SDABHM030 equivalent, key selection criteria include HYPERBUS™ timing compliance, ECC 1-bit correction/2-bit detection capability, RWDS-synchronized DDR read alignment, and AEC-Q100 Grade 2 qualification for automotive powertrain and ADAS firmware storage.

Technical Context

The device implements a dual-controller architecture: Host Interface Controller (HIC) manages real-time DDR signal capture and RWDS-aligned data transfer, while Embedded Algorithm Controller (EAC) executes non-volatile program/erase operations autonomously. All command/address/data traffic occurs over the same 8-bit DQ bus using DDR edge-aligned transfers.

It uses MIRRORBIT™ floating-gate technology with page-based access (32-byte pages, 16-byte half-pages), requiring 5–16 clock cycles initial latency for random reads. Burst modes-wrapped (16/32/64 bytes) or linear-are configurable per transaction, enabling optimized sequential code fetch for microcontroller boot execution.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 Mb (32 MB) - sufficient for full MCU boot image + firmware partitioning in automotive ECUs
Interface StandardHYPERTBUS™ DDR - 11-signal low-pin-count interface with CK/CK# differential clock and RWDS strobe
Max Read Throughput333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 8-bit bus, enabling sub-100 ms boot time
Initial Random Access Latency96 ns tACC - translates to 5–16 clock cycles at 166 MHz, critical for first-instruction fetch timing
ECC Capability1-bit correction / 2-bit detection - hardware-accelerated error handling without CPU intervention
Endurance & Retention100,000 program/erase cycles / 20-year data retention - validated for lifetime operation in unattended systems
Operating Temperature–40°C to +105°C (Industrial Plus) - qualified per AEC-Q100 Grade 2 for under-hood automotive use

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputReference for all DDR command/address/data sampling; enables precise timing margin control
CS#Chip select (active-low)Enables device communication; HIGH places device in standby (25 µA typical)
RWDSRead data strobe outputEdge-aligned output indicating valid DQ data during read bursts; used for receiver capture timing
DQ[7:0]Bi-directional DDR data busCarries commands, addresses, and 16-bit data on both clock edges; no separate address bus required
INT#Interrupt outputAsserts on ECC error detection or busy-to-ready transition, enabling host exception handling
RSTO#Reset outputUser-configurable active-low reset pulse for system power-on initialization coordination

Key Features

FeatureDesign Value
HYPERBUS™ DDR interfaceReduces signal count to 11 pins vs. legacy parallel NOR, simplifying PCB routing and lowering EMI
Configurable burst modeSupports wrapped (16/32/64-byte) or linear bursts per transaction, optimizing cache line fill for ARM Cortex-A/R cores
Hardware ECC enginePerforms real-time 1-bit correction/2-bit detection on read data without software overhead or latency penalty
Low-power deep power-down4 µA typical current draw with 300 µs wake-up - suitable for always-on telematics modules
Uniform 256-KB sectorsEnables deterministic firmware update partitioning and atomic sector-level rollback in safety-critical systems

Applications

Automotive Powertrain ECUIndustrial PLC Firmware Storage

Use Scenario: Storing boot loader and real-time control firmware in diesel engine control units operating at 105°C ambient.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced directly to ARM Cortex-R5F via HYPERBUS™ master controller.

Use Value: 333 MBps read throughput ensures <100 ms cold-boot time; AEC-Q100 Grade 2 qualification guarantees reliability over 15-year vehicle lifecycle.

Use Scenario: Holding firmware and configuration data for modular programmable logic controllers deployed in factory automation cabinets.

IC Role / Device Role / Timing Role: Standalone NOR flash providing XIP-capable code storage with deterministic 96 ns random access for interrupt service routine loading.

Use Value: Uniform 256-KB sector erase enables safe field updates without disrupting runtime logic execution; 20-year data retention eliminates scheduled media replacement.

ADAS Camera ModuleMedical Imaging System Boot Memory

Use Scenario: Storing calibration data, sensor fusion algorithms, and boot firmware in front-facing ADAS cameras exposed to thermal cycling.

IC Role / Device Role / Timing Role: High-reliability firmware storage with ECC-enabled read path to prevent corrupted algorithm execution during vision processing.

Use Value: Hardware ECC corrects single-bit errors induced by cosmic radiation; Industrial Plus temperature range ensures stable operation during rapid thermal transients.

Use Scenario: Hosting boot firmware and safety-critical diagnostic routines in FDA-cleared medical imaging devices requiring long-term data integrity.

IC Role / Device Role / Timing Role: Certified non-volatile memory supporting IEC 62304 Class C software requirements with traceable 20-year retention.

Use Value: ISO/TS16949 and AEC-Q100 certification provides audit-ready quality evidence; 100,000-cycle endurance supports frequent firmware validation updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY15B104QN-PSOC4 Mb density, FRAM-based, 10⁶ write cycles, no erase latency, but lacks HYPERBUS™ DDR interface and ECCBest for ultra-low-latency logging; unsuitable for boot code storage due to density and interface mismatchSelect only when byte-level write endurance and zero-erase latency outweigh throughput and code-storage requirements
S26KL512SDABHM020512 Mb density, identical package/interface/timing, same AEC-Q100 Grade 2 rating, higher capacityDirect upgrade path for designs needing >32 MB firmware space; shares identical timing and driver compatibilityChoose when future firmware growth or dual-application partitioning requires additional memory headroom

Compared with CY15B104QN-PSOC and S26KL512SDABHM020, S26KL256SDABHM030 uniquely balances 256 Mb capacity, HYPERBUS™-optimized 333 MBps throughput, and automotive-grade ECC protection - making it optimal for cost-sensitive, thermally demanding boot memory implementations where density and interface fidelity are tightly constrained.

Availability

S26KL256SDABHM030 is available at Aetrix Electronics and suitable for automotive powertrain ECUs, industrial PLCs, ADAS camera modules, and medical imaging system boot storage requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S26KL256SDABHM030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

This device belongs to the HYPERFLASH™ family - designed specifically for high-throughput, low-pin-count boot memory in automotive and industrial systems requiring deterministic timing, ECC protection, and AEC-Q100 compliance.

FAQ

What is the minimum wake-up time from Deep Power-Down mode?

The S26KL256SDABHM030 requires 300 µs to exit Deep Power-Down mode and become ready for read access. This fixed wake-up latency is independent of temperature or voltage within specified operating ranges and is guaranteed by internal oscillator stabilization and array precharge timing.

Does this device support linear burst reads across page boundaries?

Yes - in linear burst mode, the device automatically prefetches the next sequential 32-byte page while outputting the current page, enabling continuous 333 MBps throughput without host intervention or gap penalties between pages.

How is ECC handled during read operations?

ECC is applied transparently during every read: the device calculates syndrome bits on-the-fly, corrects single-bit errors in hardware, flags uncorrectable 2-bit errors via INT#, and outputs corrected data on DQ without CPU involvement or timing penalty.

Is RWDS used during write operations?

No - RWDS is read-only and functions solely as a read data strobe. During write operations, the host drives DQ[7:0] synchronously to CK/CK#, and the device uses internal timing to latch command, address, and data without requiring RWDS feedback.

S26KL256SDABHM030 Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
HYPERFLASH™ KL
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KL256SDABHM030 FAQ

1.How can I place an order for S26KL256SDABHM030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KL256SDABHM030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KL256SDABHM030 reliable?

The price and inventory of S26KL256SDABHM030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL256SDABHM030 is usually 5 days.

3.What payment methods are accepted for S26KL256SDABHM030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KL256SDABHM030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KL256SDABHM030?

S26KL256SDABHM030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KL256SDABHM030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KL256SDABHM030?

For technical support, including S26KL256SDABHM030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL256SDABHM030 requirements.

6.How does Aetrix verify that S26KL256SDABHM030 is sourced from the original manufacturer or authorized distributors?

All S26KL256SDABHM030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL256SDABHM030 meets industry standards.

7.What is the process for return or replacement of S26KL256SDABHM030?

All S26KL256SDABHM030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL256SDABHM030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KL256SDABHM030 part is unused and in its original packaging.

Return procedure for S26KL256SDABHM030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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