Cypress Semiconductor Corp S26KL512SDABHI030
- Part No.:
- S26KL512SDABHI030
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S26KL512SDABHI030.pdf
- Description:
- FLASH - NOR MEMORY IC 512MB (64M
- Quantity:
- Payment:

- Shipping:

Inventory:2,004
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Product details
Overview
S26KL512SDABHI030 from Infineon is a 512 Mb (64 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DDR data bus (DQ[7:0]), and read-data strobe (RWDS). It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors with optional 4-KB parameter sectors, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. Used in automotive infotainment boot memory and real-time OS storage where high-speed sequential reads and ECC-protected reliability are required.
For engineers reviewing the S26KL512SDABHI030 datasheet, S26KL512SDABHI030 pinout, S26KL512SDABHI030 application, or S26KL512SDABHI030 equivalent, key selection criteria include DDR HYPERBUS™ timing compliance (96 ns random access, 118 ns CS# to first word), RWDS-synchronized read alignment, configurable burst length (16/32/64 bytes), ECC 1-bit correction/2-bit detection, and deep power-down current (8 µA typical).
Technical Context
The device implements a synchronous DDR interface with center-aligned command/address and edge-aligned read data referenced to RWDS transitions. Its internal MIRRORBIT™ architecture enables dual-plane page access, with each 32-byte page composed of two 16-byte half-pages aligned on 16-byte boundaries.
Control logic splits into Host Interface Controller (HIC) for signal monitoring and data transfer coordination, and Embedded Algorithm Controller (EAC) for autonomous execution of program/erase sequences. All non-volatile writes require EAC-managed embedded algorithms - no direct array programming is permitted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full firmware images for automotive ECUs and industrial HMI systems |
| Interface Protocol | HYPERRBUS™ DDR - 8-bit bidirectional data bus with differential clock (CK/CK#) and RWDS strobe for precise read capture |
| Max Read Throughput | 333 MBps - achieved via 166 MHz clock × 2 transfers/cycle × 1 byte per transfer, enabling sub-200 ms boot time for 64 MB images |
| Random Access Time | 96 ns - initial latency for first word retrieval, critical for interrupt response and code fetch predictability |
| ECC Capability | 1-bit correction / 2-bit detection - hardware-implemented per 512-byte sector, eliminating need for software ECC overhead |
| Power Modes | Deep Power-Down: 8 µA typical - maintains state without wake-up delay; Active Clock Stop: 12 mA during read - no wake-up required |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention - validated for automotive AEC-Q100 Grade 3 operation |
Pinout & Package
Package: 24-ball FBGA (VAA024), 5 mm × 5 mm × 1.0 mm, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK / CK# | Differential clock input | Reference for DDR command/address capture; CK rising/falling edges sample DQ; CK# provides noise immunity |
| CS# | Chip select (active low) | Enables device communication; HIGH places device in standby or deep power-down depending on mode |
| RWDS | Read data strobe output | Indicates valid read data on DQ; transitions aligned to data edges - not used during write operations |
| DQ[7:0] | DDR bidirectional data bus | Transfers 16-bit words across two clock edges per cycle; carries commands, addresses, and data in time-multiplexed fashion |
| INT# | Interrupt output | Asserts on Busy→Ready transition or ECC error detection - enables host polling elimination |
| RSTO# | Reset output | Configurable LOW pulse duration for system-level power-on reset synchronization |
| PSC / PSC# | Power supply control pair | Monitors VCC/VCCQ stability; triggers hardware protection during brown-out conditions |
Key Features
| Feature | Design Value |
|---|---|
| HYPERBUS™ DDR Interface | Reduces pin count vs. parallel NOR while sustaining >300 MBps read - ideal for space-constrained automotive PCBs |
| Configurable Burst Mode | Supports wrapped (16/32/64-byte) or linear bursts per transaction - optimizes cache line fill and DMA efficiency |
| Hardware ECC Engine | Performs real-time 1-bit correction/2-bit detection without CPU intervention - meets ASIL-B functional safety requirements |
| Program Buffer | 512-byte write buffer enables ~1 MBps effective programming rate - reduces host wait states during firmware updates |
| Advanced Sector Protection | Volatile and non-volatile lock bits per 256-KB sector - prevents accidental overwrite of bootloader or calibration data |
Applications
| Automotive Infotainment Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and OS kernel for head-unit MCU requiring fast, deterministic startup under -40°C to +85°C. IC Role / Device Role / Timing Role: Primary non-volatile code storage with HYPERBUS™ DDR interface providing 333 MBps read bandwidth and 96 ns random access. Use Value: Enables sub-200 ms cold-boot time and eliminates external SRAM caching due to sustained linear burst performance. | Use Scenario: Holding field-upgradable firmware and configuration data in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: High-reliability NOR flash with ECC and 100K-cycle endurance, interfaced via microcontroller's HYPERBUS™ master peripheral. Use Value: Guarantees 20-year data retention and prevents corruption during brown-out events using hardware PSC monitoring and deep power-down mode. |
| Medical Imaging System Code Storage | Avionics Display Processor Memory |
Use Scenario: Hosting diagnostic firmware and image processing algorithms in portable ultrasound devices requiring AEC-Q100-compliant components. IC Role / Device Role / Timing Role: ISO/TS16949-certified HYPERFLASH™ device operating in Industrial Plus (–40°C to +105°C) grade with RSTO#-synchronized reset signaling. Use Value: Meets IEC 62304 Class C software safety requirements via hardware ECC and sector-lock protection of critical boot partitions. | Use Scenario: Providing certified boot memory for DO-254-compliant display processors in commercial aircraft cockpit displays. IC Role / Device Role / Timing Role: AEC-Q100 Grade 1 (–40°C to +125°C) variant used as read-only executable memory with RWDS-aligned timing for deterministic instruction fetch. Use Value: Achieves <100 ns read latency consistency across temperature extremes, satisfying ARINC 653 partition timing budgets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-SXIT | 4 Mb Quad SPI FRAM; 133 MHz max interface speed; no erase/write latency; unlimited endurance | Targeted at frequent small-write logging; lacks HYPERBUS™ DDR bandwidth and 64 MB density | Select when write-cycle count dominates over read bandwidth; not suitable for boot code storage |
| S26KS512SDABHI020 | Same family, 512 Mb, but 3.0 V I/O (not 1.8 V); 100 MHz max clock; 200 MBps read; 24-ball FBGA same footprint | Compatible pinout and command set; lower speed and higher voltage margin - suited for legacy 3.3 V designs | Drop-in replacement if system uses 3.0 V I/O rails and tolerates 40% lower read throughput |
Compared with CY15B104QN-SXIT, S26KL512SDABHI030 delivers 16× higher density and 1.6× peak read bandwidth but requires erase cycles and has finite endurance; versus S26KS512SDABHI020, it enables 66% higher throughput and lower active power at 1.8 V, making it optimal for thermally constrained, high-performance automotive platforms.
Availability
S26KL512SDABHI030 is available at Aetrix Electronics and suitable for automotive infotainment boot memory, industrial PLC firmware storage, and medical imaging system code storage requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S26KL512SDABHI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification including ISO/TS16949 and AEC-Q100.
This device belongs to the HYPERFLASH™ family - designed specifically for high-bandwidth, low-pin-count boot and code storage in automotive, industrial, and aerospace systems demanding deterministic timing, ECC protection, and extended temperature operation.
FAQ
What is the function of the RWDS signal in S26KL512SDABHI030?
RWDS (Read Data Strobe) is an output signal synchronized to read data edges on DQ[7:0]. It indicates when valid read data is present and is used by the host to latch data correctly. RWDS transitions align with data edges-not clock edges-and are only active during read operations. It is not used for write operations or command transmission.
Does S26KL512SDABHI030 support both 1.8 V and 3.0 V I/O operation?
No. S26KL512SDABHI030 is a 1.8 V I/O variant with differential clock (CK/CK#) and supports up to 166 MHz operation. The 3.0 V I/O version is a separate part number (e.g., S26KS512SDABHI020) with single-ended clock and 100 MHz maximum clock rate. Mixing voltage domains may damage the device.
How does the 512-byte program buffer improve write performance?
The 512-byte buffer allows the host to issue one command and stream up to 512 bytes of data before triggering internal programming. This reduces command overhead and enables ~1 MBps effective write speed-over 2000× faster than single-word programming (4 KBps). Buffer programming is mandatory for efficient firmware updates.
Is RSTO# output configurable, and what is its purpose?
Yes. RSTO# is a user-configurable open-drain output that asserts a LOW pulse during power-on reset. Its duration is programmable via internal registers and used to synchronize system-level reset sequencing. It replaces external RC-based reset generators, improving timing accuracy and reducing BOM count in automotive and avionics designs.
S26KL512SDABHI030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- HYPERFLASH™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 96 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S26KL512SDABHI030 FAQ
1.How can I place an order for S26KL512SDABHI030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S26KL512SDABHI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S26KL512SDABHI030 reliable?
The price and inventory of S26KL512SDABHI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KL512SDABHI030 is usually 5 days.
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S26KL512SDABHI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S26KL512SDABHI030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S26KL512SDABHI030?
For technical support, including S26KL512SDABHI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KL512SDABHI030 requirements.
6.How does Aetrix verify that S26KL512SDABHI030 is sourced from the original manufacturer or authorized distributors?
All S26KL512SDABHI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KL512SDABHI030 meets industry standards.
7.What is the process for return or replacement of S26KL512SDABHI030?
All S26KL512SDABHI030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KL512SDABHI030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S26KL512SDABHI030 part is unused and in its original packaging.
Return procedure for S26KL512SDABHI030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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