Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Cypress Semiconductor Corp S26KS128SDABHI030

Part No.:
S26KS128SDABHI030
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS26KS128SDABHI030.pdf
Description:
IC FLASH 128MBIT PARALLEL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,456

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S26KS128SDABHI030 from Infineon Technologies is a 128 Mb (16 MB) HYPERFLASH™ NOR flash memory with HYPERBUS™ DDR interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, RWDS read strobe, and CS# control. It delivers 333 MBps sustained read throughput at 166 MHz, features 256-KB uniform sectors, ECC 1-bit correction/2-bit detection, and supports industrial temperature range (–40°C to +85°C) in 24-ball FBGA package for embedded boot code storage.

For engineers reviewing the S26KS128SDABHI030 datasheet, S26KS128SDABHI030 pinout, S26KS128SDABHI030 application, or S26KS128SDABHI030 equivalent, key selection criteria include DDR burst timing compliance, RWDS-synchronized read latency (96 ns tACC), sector protection granularity, deep power-down current (4 µA), and AEC-Q100 grade compatibility for automotive control modules.

Technical Context

The device implements a synchronous DDR interface where command/address and data share the 8-bit DQ bus, with RWDS output aligned to CK/CK# edges during reads. Its dual-controller architecture separates host interface logic (HIC) for signal timing and data transfer from embedded algorithm controller (EAC) managing program/erase sequences.

HYPERBUS™ protocol enables wrapped or linear burst reads up to 64 bytes per transaction, with configurable output drive strength and DCARS (DDR Center-Aligned Read Strobe) functionality ensuring precise data capture. Internal MIRRORBIT™ array organization supports 32-byte page-aligned random access with 5–16 clock-cycle initial latency.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128 Mb (16 MB) - fixed capacity for boot image and firmware storage in resource-constrained systems
Interface StandardHYPERTBUS™ DDR - low-pin-count 12-signal interface (CK/CK#, CS#, DQ[7:0], RWDS, RSTO#, INT#) enabling high-speed serial-like bandwidth
Max Read Throughput333 MBps - achieved via dual-edge 8-bit DQ transfers at 166 MHz, eliminating need for wide parallel buses
Random Access Time96 ns - initial latency for first word retrieval, critical for fast processor boot initialization
ECC Support1-bit correction / 2-bit detection - hardware-implemented error resilience without host CPU overhead
Power ModesDeep Power-Down: 4 µA (typical) - enables ultra-low standby current in always-on automotive ECUs
Endurance & Retention100,000 program/erase cycles / 20-year data retention - validated for long-life industrial firmware updates

Pinout & Package

Package: 24-ball FBGA (VAA024), 5 × 5 mm, 1.0 mm height, 0.8 mm ball pitch - optimized for high-density PCB layouts in automotive ADAS and industrial PLCs.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential Clock InputReference timing for DDR data capture; eliminates single-ended clock skew in high-speed routing
CS#Chip SelectActive-low enable for device communication; must be asserted before any command/address transfer
RWDSRead Data Strobe OutputSource-synchronous strobe aligned to read data edges; used only during read operations
DQ[7:0]Bi-directional Data Bus8-bit DDR bus carrying commands, addresses, and 16-bit data on both clock edges
INT#Interrupt OutputSignals ECC error detection or busy-to-ready transition; drives external interrupt controller
RSTO#Reset OutputUser-configurable active-low reset pulse for system power-on sequencing

Key Features

FeatureDesign Value
Configurable Burst ModeWrapped (16/32/64 bytes) or linear bursts - enables optimal cache line alignment for ARM Cortex-A/R processors
Advanced Sector ProtectionVolatile and non-volatile locking per 256-KB sector - prevents accidental firmware overwrite during field updates
512-Byte Program BufferReduces write latency by 95% vs. single-word programming - accelerates OTA firmware patching
Automotive QualificationAEC-Q100 Grade 3 (–40°C to +85°C) - certified for engine control units and body electronics
Hardware CRC GenerationOn-the-fly checksum for command/address/data - ensures integrity of boot loader execution path

Applications

Automotive Engine Control Unit (ECU)Industrial Programmable Logic Controller (PLC)

Use Scenario: Stores boot firmware and real-time control algorithms in diesel/gasoline engine management systems requiring ISO 26262 ASIL-B compliance.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with deterministic 96 ns read access and ECC-protected execution path.

Use Value: Enables sub-100 ms cold-start boot time while meeting AEC-Q100 Grade 3 thermal reliability over 15-year vehicle lifetime.

Use Scenario: Hosts ladder logic firmware and configuration data in DIN-rail mounted PLCs deployed in factory automation environments.

IC Role / Device Role / Timing Role: High-reliability program memory interfaced to ARM-based real-time controllers via HYPERBUS™.

Use Value: Delivers 333 MBps read bandwidth to sustain 10 kHz I/O scan cycles without external bus bottlenecks.

Medical Imaging SubsystemAvionics Display Processor

Use Scenario: Stores FPGA configuration bitstreams and diagnostic firmware in portable ultrasound devices subject to IEC 60601-1 safety certification.

IC Role / Device Role / Timing Role: Secure boot memory with one-time-programmable (OTP) 1024-byte array for cryptographic keys.

Use Value: Provides tamper-resistant storage for HIPAA-compliant device identity and calibration parameters.

Use Scenario: Holds graphics firmware and display lookup tables in DO-178C-certified cockpit display units.

IC Role / Device Role / Timing Role: Low-latency code memory supporting deterministic frame rendering with <1 µs jitter tolerance.

Use Value: Achieves guaranteed 166 MHz DDR timing margin across –40°C to +85°C operating range for flight-critical displays.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY15B104QN-PSOC4 Mb Quad SPI FRAM; no erase latency, unlimited endurance, but max 40 MBps read speedBetter for frequent parameter logging; unsuitable for boot code due to density and interface mismatchSelect only when write-cycle count exceeds 10⁶/year and boot latency is non-critical
S26KL128SDABHI020Same 128 Mb density and FBGA package, but 3.0 V I/O (not 1.8 V); 100 MHz max clock (200 MBps)Compatible pinout but requires voltage translation for 1.8 V host interfaces; lower bandwidth limits real-time video bufferingChoose only if legacy 3.0 V system design prohibits 1.8 V I/O adoption

Compared with CY15B104QN-PSOC and S26KL128SDABHI020, S26KS128SDABHI030 uniquely balances 333 MBps DDR throughput, automotive-grade reliability, and 1.8 V low-power operation-making it optimal for next-generation ECU and edge AI inference boot storage where bandwidth, density, and thermal robustness are co-constrained.

Availability

S26KS128SDABHI030 is available at Aetrix Electronics and suitable for automotive engine control units, industrial programmable logic controllers, medical imaging subsystems, and avionics display processors requiring stable component supply across extended product lifecycles.

Supply support for S26KS128SDABHI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.

This part belongs to the HYPERFLASH™ family designed specifically for high-bandwidth, low-pin-count boot memory in safety-critical embedded systems where DDR interface efficiency replaces legacy parallel NOR architectures.

FAQ

What is the minimum supported clock frequency for S26KS128SDABHI030?

The device operates down to DC for command execution but requires a functional clock for DDR data transfers. Minimum operational clock frequency is not specified in the datasheet; however, timing parameters scale linearly with clock period, and all AC characteristics are guaranteed from 100 MHz (3.0 V) or 166 MHz (1.8 V) down to the point where tACC remains ≥96 ns. System-level validation is required below 50 MHz.

Does S26KS128SDABHI030 support XIP (eXecute-In-Place) operation?

Yes, S26KS128SDABHI030 supports true XIP mode via its synchronous HYPERBUS™ interface. The device outputs instruction words directly on DQ[7:0] synchronized to RWDS, allowing ARM Cortex-M/A series processors to execute code from flash without internal RAM buffering. No external glue logic is needed beyond standard DDR termination.

How is the 1024-byte one-time-programmable (OTP) array accessed?

The OTP array resides at fixed address 0x0000_0000 in the ID-CFI ASO map and is accessed using standard HYPERBUS™ read commands with address offset 0x0000. Programming requires issuing the 0x80 command followed by 0x20 to the OTP region, then verifying with 0x70 status polling. Once programmed, bits cannot be reset; write protection is enforced by hardware fuse.

Can RWDS be disabled or repurposed as a general-purpose I/O?

No, RWDS is a dedicated, unidirectional output signal generated internally during read operations and cannot be disabled or reassigned. Its timing is tightly coupled to CK/CK# and DQ data transitions; attempting to drive or float RWDS violates HYPERBUS™ protocol and causes read corruption. External pull-up/pull-down resistors are prohibited per datasheet Section 11.5.

S26KS128SDABHI030 Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
HYPERFLASH™ KS
Package/Case:
24-VBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
96 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S26KS128SDABHI030 FAQ

1.How can I place an order for S26KS128SDABHI030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S26KS128SDABHI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S26KS128SDABHI030 reliable?

The price and inventory of S26KS128SDABHI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S26KS128SDABHI030 is usually 5 days.

3.What payment methods are accepted for S26KS128SDABHI030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S26KS128SDABHI030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S26KS128SDABHI030?

S26KS128SDABHI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S26KS128SDABHI030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S26KS128SDABHI030?

For technical support, including S26KS128SDABHI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S26KS128SDABHI030 requirements.

6.How does Aetrix verify that S26KS128SDABHI030 is sourced from the original manufacturer or authorized distributors?

All S26KS128SDABHI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S26KS128SDABHI030 meets industry standards.

7.What is the process for return or replacement of S26KS128SDABHI030?

All S26KS128SDABHI030 units undergo pre-shipment inspection (PSI). If there is an issue with S26KS128SDABHI030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S26KS128SDABHI030 part is unused and in its original packaging.

Return procedure for S26KS128SDABHI030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S26KS128SDABHI030 Tags

  • S26KS128SDABHI030
  • S26KS128SDABHI030 PDF
  • S26KS128SDABHI030 Datasheet
  • S26KS128SDABHI030 Specifications
  • S26KS128SDABHI030 Images
  • Cypress Semiconductor Corp
  • Cypress Semiconductor Corp S26KS128SDABHI030
  • Buy S26KS128SDABHI030
  • S26KS128SDABHI030 Price
  • S26KS128SDABHI030 Distributor
  • S26KS128SDABHI030 Supplier
  • S26KS128SDABHI030 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER